Tech Center 2800 • Art Units: 2812
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18237209 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18351171 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18563460 | DISPLAY APPARATUS, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17979849 | SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18298629 | SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18297182 | EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18126298 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18378235 | Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates | Non-Final OA | Chipletz, Inc. |
| 18290289 | ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING SIDE I/OS | Non-Final OA | Intel Corporation |
| 18046992 | POWER MODULE FOR PRODUCING STRUCTURE-BORNE SOUND, DEVICE FOR DETECTING AN IC PACKAGE DELAMINATION HAVING SUCH A POWER MODULE, AND METHOD FOR DETECTING AN IC PACKAGE DELAMINATION | Final Rejection | Robert Bosch GmbH |
| 18475053 | GATE-ALL-AROUND (GAA) NANOSHEET DEVICE HAVING INNER GATE SPACER WITH ROUNDED EDGES | Non-Final OA | QUALCOMM Incorporated |
| 18475895 | STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTURING APPARATUS, STACKED SUBSTRATE MANUFACTURING SYSTEM, AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | NIKON CORPORATION |
| 18225177 | STRUCTURE AND FIELD EFFECT TRANSISTOR | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18624655 | PLASMA GENERATING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kokusai Electric Corporation |
| 18247753 | SUPER-HETEROJUNCTION SCHOTTKY DIODE | Non-Final OA | The Penn State Research Foundation |
| 18364180 | SIC-BASED ELECTRONIC DEVICE WITH IMPROVED GATE DIELECTRIC AND MANUFACTURING METHOD THEREOF, DIODE | Non-Final OA | STMicroelectronics S.r.l. |
| 18323894 | FLASH MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18126729 | MULTI-CHANNEL HIGH ELECTRON MOBILITY TRANSISTOR WITH DOPED GATE FINS | Non-Final OA | Infineon Technologies Austria AG |
| 18213500 | SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS | Non-Final OA | Wolfspeed, Inc. |
| 18224293 | METHOD FOR MANUFACTURING A SCHOTTKY DIODE AND CORRESPONDING INTEGRATED CIRCUIT | Non-Final OA | STMicroelectronics (Rousset) SAS |
| 18180025 | INTEGRATED CIRCUIT COMPRISING A HIGH VOLTAGE TRANSISTOR AND CORRESPONDING MANUFACTURING METHOD | Non-Final OA | STMicroelectronics (Rousset) SAS |
| 18007721 | NEURONS AND SYNAPSES WITH FERROELECTRICALLY MODULATED METAL-SEMICONDUCTOR SCHOTTKY DIODES AND METHOD | Final Rejection | Forschungszentrum Jülich GmbH |
| 18487546 | SINGLE POLY NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SK keyfoundry Inc. |
| 18508770 | REVERSE-CONDUCTING INSULATED GATE BIPOLAR TRANSISTOR | Non-Final OA | Analog Power Conversion LLC |
| 18125655 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS | Non-Final OA | Woflspeed, Inc. |
| 18364149 | SEMICONDUCTOR DEVICE | Non-Final OA | Infineon Technologies Bipolar GmbH & Co. KG |
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