Prosecution Insights
Last updated: May 29, 2026

Examiner: LIU, XIAOMING

Tech Center 2800 • Art Units: 2812

This examiner grants 86% of resolved cases

Performance Statistics

86.0%
Allow Rate
+18.0% vs TC avg
619
Total Applications
+11.0%
Interview Lift
808
Avg Prosecution Days
Based on 580 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
5.8%
§102 Novelty
89.3%
§103 Obviousness
0.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18517917 SEMICONDUCTOR MEMORY DEVICES Non-Final OA Samsung Electronics Co., Ltd.
18351171 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18563460 DISPLAY APPARATUS, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR Non-Final OA BOE Technology Group Co., Ltd.
17979849 SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD Non-Final OA CANON KABUSHIKI KAISHA
18378235 Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates Non-Final OA Chipletz, Inc.
18290289 ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING SIDE I/OS Non-Final OA Intel Corporation
18046992 POWER MODULE FOR PRODUCING STRUCTURE-BORNE SOUND, DEVICE FOR DETECTING AN IC PACKAGE DELAMINATION HAVING SUCH A POWER MODULE, AND METHOD FOR DETECTING AN IC PACKAGE DELAMINATION Final Rejection Robert Bosch GmbH
18475053 GATE-ALL-AROUND (GAA) NANOSHEET DEVICE HAVING INNER GATE SPACER WITH ROUNDED EDGES Non-Final OA QUALCOMM Incorporated
18469483 GATE-TIE-DOWN IN BACKSIDE POWER ARCHITECTURE USING TRENCH-TIE-DOWN SCHEME Non-Final OA QUALCOMM Incorporated
18475895 STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTURING APPARATUS, STACKED SUBSTRATE MANUFACTURING SYSTEM, AND SUBSTRATE PROCESSING APPARATUS Final Rejection NIKON CORPORATION
18297182 EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18624655 PLASMA GENERATING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Kokusai Electric Corporation
18054614 MULTI-TIME PROGRAMMABLE MEMORY CELL AND METHOD THEREFOR Non-Final OA NXP B.V.
18364180 SIC-BASED ELECTRONIC DEVICE WITH IMPROVED GATE DIELECTRIC AND MANUFACTURING METHOD THEREOF, DIODE Non-Final OA STMicroelectronics S.r.l.
18296521 LOW CAPACITANCE AND LOW RESISTANCE DEVICES Non-Final OA GlobalFoundries U.S. Inc.
18213500 SILICON CARBIDE SEMICONDUCTOR DEVICES WITH SUPERJUNCTIONS Non-Final OA Wolfspeed, Inc.
18508770 REVERSE-CONDUCTING INSULATED GATE BIPOLAR TRANSISTOR Non-Final OA Analog Power Conversion LLC
18125655 SEMICONDUCTOR DEVICES WITH INTEGRATED TEST AREAS Non-Final OA Woflspeed, Inc.
18180025 INTEGRATED CIRCUIT COMPRISING A HIGH VOLTAGE TRANSISTOR AND CORRESPONDING MANUFACTURING METHOD Non-Final OA STMicroelectronics (Rousset) SAS

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