7 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18545467 | Semiconductor Device and Method of Forming Protective Layer on Substrate to Avoid Damage During Encapsulation | LEE, EUGENE | 2815 | Non-Final OA | Dec 19, 2023 |
| 18475249 | ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME | CROSS, XIA L | 2892 | Non-Final OA | Sep 27, 2023 |
| 18475255 | METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE | KIM, TONG-HO | 2811 | Non-Final OA | Sep 27, 2023 |
| 18471960 | Semiconductor Device and Method of Forming Fine-Pitch Interconnection Using Insulating Layer | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Sep 21, 2023 |
| 18469572 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | YUSHIN, NIKOLAY K | 2893 | Non-Final OA | Sep 19, 2023 |
| 18469536 | METHOD FOR MAKING AN ELECTRONIC PACKAGE | NETTLES, CORALIE ANN | 2893 | Non-Final OA | Sep 18, 2023 |
| 18462204 | Semiconductor Device and Method of Forming AIP Structure to Reduce Signal Interference Among and Between Encapsulant Blocks | MAZUMDER, DIDARUL A | 2812 | Final Rejection | Sep 06, 2023 |
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