Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2847 2893
This examiner grants 65% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17912308 | PHOTODIODE AND MANUFACTURING METHOD THEREOF | Non-Final OA | LG ELECTRONICS INC. |
| 18759447 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18739398 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18407040 | CAPACITOR AND DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18509925 | SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18100216 | IMAGE SENSOR | Final Rejection | Samsung Electronics Co., Ltd. |
| 18079165 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18458090 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 17811909 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | InnoLux Corporation |
| 18328351 | PHOTOELECTRIC CONVERSION APPARATUS, METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION APPARATUS, DEVICE, AND SUBSTRATE | Final Rejection | CANON KABUSHIKI KAISHA |
| 17932952 | PHOTOELECTRIC CONVERSION APPARATUS | Final Rejection | CANON KABUSHIKI KAISHA |
| 17485294 | ELIMINATION OF SUB-FIN LEAKAGE IN STACKED NANOSHEET ARCHITECTURES | Non-Final OA | Intel Corporation |
| 18782477 | BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17766960 | METHOD OF FABRICATING A RESONANT CAVITY AND DISTRIBUTED BRAGG REFLECTOR MIRRORS FOR A VERTICAL CAVITY SURFACE EMITTING LASER ON A WING OF AN EPITAXIAL LATERAL OVERGROWTH REGION | Non-Final OA | The Regents of the University of California |
| 18693649 | POWER SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18561961 | SEMICONDUCTOR DEVICE | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 18264784 | IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SONY GROUP CORPORATION |
| 18839907 | PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17910476 | SOLID-STATE IMAGE ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17626249 | LIGHT RECEIVING ELEMENT AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17793134 | DISPLAY TRANSMISSION OPTIMIZATION | Non-Final OA | ams International AG |
| 18754687 | SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE | Non-Final OA | MEDIATEK INC. |
| 18808257 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 17654771 | MARK, TEMPLATE, AND SEMICONDCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 17987958 | SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 17973046 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 17690981 | STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES | Final Rejection | Micron Technology, Inc. |
| 18186499 | PROGRAMMABLE READ-ONLY MEMORY | Non-Final OA | STMicroelectronics (Rousset) SAS |
| 17725439 | METHOD FOR FORMING CONDUCTIVE FEATURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17691233 | HIGH DENSITY CAPACITOR AND METHOD OF MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
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