Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 69% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18759447 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18509925 | SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18097749 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18079165 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18256227 | PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYSTEM, ELECTRONIC APPARATUS, AND MOBILE BODY | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17910476 | SOLID-STATE IMAGE ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17626249 | LIGHT RECEIVING ELEMENT AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18050989 | DISPLAY APPARATUS | Final Rejection | LG DISPLAY CO., LTD. |
| 18328351 | PHOTOELECTRIC CONVERSION APPARATUS, METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION APPARATUS, DEVICE, AND SUBSTRATE | Final Rejection | CANON KABUSHIKI KAISHA |
| 17811909 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | InnoLux Corporation |
| 18217208 | LOW-RESISTANCE VIA STRUCTURES | Non-Final OA | Intel Corporation |
| 17485294 | ELIMINATION OF SUB-FIN LEAKAGE IN STACKED NANOSHEET ARCHITECTURES | Final Rejection | Intel Corporation |
| 18561961 | SEMICONDUCTOR DEVICE | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 18458090 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18693649 | POWER SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18754687 | SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE | Non-Final OA | MEDIATEK INC. |
| 17973046 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 17690981 | STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES | Final Rejection | Micron Technology, Inc. |
| 17691233 | HIGH DENSITY CAPACITOR AND METHOD OF MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18052884 | GE ON SI PHOTODETECTOR WITH GAIN | Non-Final OA | Cisco Technology, Inc. |
| 17654771 | MARK, TEMPLATE, AND SEMICONDCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18491353 | SEMICONDUCTOR DEVICE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18502112 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18186499 | PROGRAMMABLE READ-ONLY MEMORY | Non-Final OA | STMicroelectronics (Rousset) SAS |
| 18533589 | DOUBLE-SIDED MEMORY DEVICE USING A SHARED TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 17704189 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18755722 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18661704 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18516868 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18594074 | CAPACITIVE JUNCTION BETWEEN CONDUCTIVE LINE AND CONDUCTIVE PILLAR WITH METHODS TO FORM SAME | Non-Final OA | GlobalFoundries U.S. Inc. |
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