Tech Center 2800 • Art Units: 2893
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18509925 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18141738 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17766960 | METHOD OF FABRICATING A RESONANT CAVITY AND DISTRIBUTED BRAGG REFLECTOR MIRRORS FOR A VERTICAL CAVITY SURFACE EMITTING LASER ON A WING OF AN EPITAXIAL LATERAL OVERGROWTH REGION | Non-Final OA | The Regents of the University of California |
| 18050989 | DISPLAY APPARATUS | Non-Final OA | LG DISPLAY CO., LTD. |
| 18264784 | IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SONY GROUP CORPORATION |
| 18240614 | DUAL PACKAGE SWITCHING POWER DEVICE | Non-Final OA | Texas Instruments Incorporated |
| 17932952 | PHOTOELECTRIC CONVERSION APPARATUS | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18256227 | PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYSTEM, ELECTRONIC APPARATUS, AND MOBILE BODY | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17910476 | SOLID-STATE IMAGE ELEMENT AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17626249 | LIGHT RECEIVING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17704189 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18561961 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 17485294 | ELIMINATION OF SUB-FIN LEAKAGE IN STACKED NANOSHEET ARCHITECTURES | Non-Final OA | Intel Corporation |
| 18176210 | VAPOR CHAMBER AND SEMICONDUCTOR PACKAGE HAVING SAME MOUNTED THEREON | Final Rejection | KANEKA CORPORATION |
| 18458090 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 17654771 | MARK, TEMPLATE, AND SEMICONDCTOR DEVICE MANUFACTURING METHOD | Final Rejection | Kioxia Corporation |
| 18502112 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18491353 | SEMICONDUCTOR DEVICE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 17973046 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18360447 | NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICE AND METHODS OF FORMING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17654627 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17691233 | HIGH DENSITY CAPACITOR AND METHOD OF MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18469536 | METHOD FOR MAKING AN ELECTRONIC PACKAGE | Non-Final OA | JCET STATS ChipPAC Korea Limited |
| 18251365 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
| 18043724 | TRANSISTOR AND METHOD FOR FABRICATING THE SAME | Non-Final OA | BEIJING HUA TAN YUAN XIN ELECTRONICS TECHNOLOGY CO., LTD. |
| 17653763 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | HAESUNG DS CO., LTD. |
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