Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2823 2899
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18471900 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18244739 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18244546 | SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18462067 | SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18343204 | SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18335979 | MICROELECTRONICS DEVICE PACKAGE AND METHODS | Non-Final OA | Texas Instruments Incorporated |
| 18557996 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18519392 | SEMICONDUCTOR DEVICE | Non-Final OA | IDEMITSU KOSAN CO., LTD. |
| 18523659 | METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18558079 | Three-Dimensional Memory, Chip Package Structure, and Electronic Device | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18554148 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18539797 | ELECTRONIC APPARATUS | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18764167 | PACKAGE STRUCTURE WITH ANTENNA PATTERN AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18173033 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18151643 | INTEGRATED CIRCUIT PACKAGES AND METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18471703 | LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18464399 | SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18459046 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18391173 | CONDUCTIVE MATERIALS FOR DIRECT BONDING | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18456736 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | AaltoSemi Inc. |
| 18471960 | Semiconductor Device and Method of Forming Fine-Pitch Interconnection Using Insulating Layer | Non-Final OA | JCET STATS ChipPAC Korea Limited |
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