Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2823 2899
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18558079 | Three-Dimensional Memory, Chip Package Structure, and Electronic Device | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18778669 | SEMICONDUCTOR APPARATUS AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18613867 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18614414 | POWER/THERMAL VIA FOR THREE-DIMENSIONAL (3D) CHIP STACKING | Non-Final OA | QUALCOMM Incorporated |
| 17983230 | HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF THIN TGV SUBSTRATES | Non-Final OA | Intel Corporation |
| 18343204 | SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18335979 | MICROELECTRONICS DEVICE PACKAGE AND METHODS | Non-Final OA | Texas Instruments Incorporated |
| 17710941 | FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 18583319 | SELF-ALIGNED LINE CONTACTS | Non-Final OA | Micron Technology, Inc. |
| 18420074 | CHOPLESS FLOW FOR STAIRLESS ELECTRICAL INTERCONNECT STRUCTURE | Non-Final OA | Micron Technology, Inc. |
| 18765696 | TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18591873 | TRANSISTOR AND SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18409620 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770022 | Reinforcing Package Using Reinforcing Patches | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18542681 | DISPLAY PANELS AND METHODS FOR MANUFACTURING THE SAME | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
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