Tech Center 2800 • Art Units: 2881 2892
This examiner grants 61% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18370940 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18480912 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18573440 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 17927212 | LIGHT EMITTING DEVICE AND DISPLAY APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 18275809 | DISPLAY APPARATUS, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18262124 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18566668 | SEMICONDUCTOR MODULE AND POWER CONVERTER | Non-Final OA | Mitsubishi Electric Corporation |
| 18355197 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18348219 | DISPLAY PANEL AND ELECTRONIC DEVICE INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18118886 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18166366 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18513685 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18009970 | DISPLAY DEVICE WITH BENDING REGION REINFORCING STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | SHARP KABUSHIKI KAISHA |
| 18345540 | PITCH CHANGE BETWEEN METAL LINES | Non-Final OA | International Business Machines Corporation |
| 18569845 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18164615 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Magnolia White Corporation |
| 18542189 | CHIP SCALE PACKAGE LIGHT-EMITTING DEVICE WITH THIN, CONFORMAL WAVELENGTH CONVERTER | Non-Final OA | LUMILEDS LLC |
| 18229626 | MASK-SUPPORT ASSEMBLY AND PRODUCING METHOD THEREOF | Non-Final OA | Olum Material Corporation |
| 18263406 | EBEAM INSPECTION | Non-Final OA | VueReal Inc. |
| 18489173 | SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD THEREFOR | Non-Final OA | NXP USA, INC. |
| 18480897 | FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18567363 | MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMICONDUCTOR PACKAGE, MULTI-LAYER STACKED SEMICONDUCTOR DEVICE, AND DISPLAY | Non-Final OA | POINT ENGINEERING CO., LTD. |
| 18552610 | TRANSFER METHOD FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18573856 | SUPER-JUNCTION MOSFET DEVICE | Non-Final OA | CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD |
| 18573817 | LIGHT EMITTING DEVICE COMPRISING A COOLING SYSTEM | Non-Final OA | INSTITUT D'OPTIQUE THEORIQUE ET APPLIQUEE |
| 17771992 | METHOD FOR PRODUCING A LIGHT-EMITTING DIODE HAVING POLARIZED EMISSION | Final Rejection | FRAUNHOFER-GESELLISCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
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