Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2881 2892
This examiner grants 62% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18739698 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18651934 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17927212 | LIGHT EMITTING DEVICE AND DISPLAY APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 18735021 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18400810 | DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | LG Display Co., Ltd. |
| 18696582 | INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18164615 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Magnolia White Corporation |
| 18432301 | DISPLAY PANEL AND ELECTRONIC APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18116447 | MANUFACTURING METHOD OF DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 18569845 | DISPLAY DEVICE | Final Rejection | Sharp Display Technology Corporation |
| 18263406 | EBEAM INSPECTION | Final Rejection | VueReal Inc. |
| 18140465 | RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE ANTENNA AND THE RF DIE | Non-Final OA | Intel Corporation |
| 18009970 | DISPLAY DEVICE WITH BENDING REGION REINFORCING STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | SHARP KABUSHIKI KAISHA |
| 18489173 | SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD THEREFOR | Final Rejection | NXP USA, INC. |
| 18656609 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18751061 | THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18733536 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18766300 | SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18748008 | NOVEL THIN FILM RESISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18651076 | WAVELENGTH CONVERTER FOR LUMINESCENCE THERMOMETRY | Non-Final OA | LUMILEDS LLC |
| 18542189 | CHIP SCALE PACKAGE LIGHT-EMITTING DEVICE WITH THIN, CONFORMAL WAVELENGTH CONVERTER | Non-Final OA | LUMILEDS LLC |
| 18099496 | SLURRY FOR POLISHING COPPER, DISPLAY DEVICE MANUFACTURING METHOD USING THE SAME, AND DISPLAY DEVICE | Non-Final OA | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) |
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