Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2881 2892
This examiner grants 62% of resolved cases
Eric W. Jones is an examiner in Tech Center 2800 and Art Unit 2881. The profile shows 715 resolved cases and an allowance rate of 62.1 percent. The total number of resolved cases establishes the reliability of the prosecution data. This specific percentage of 62.1 helps practitioners estimate the likelihood of an application reaching an allowance.
The interview lift is 17.5 percent. This figure shows the difference in allowance probability when an interview is conducted. Practitioners can use the 17.5 percent lift to evaluate the utility of direct communication with the examiner during prosecution. This metric serves as a guide for deciding whether to request a formal discussion.
The median days to allowance is 1135. This period represents the middle value of the time taken to reach an allowance. With 715 resolved cases, the 1135-day duration characterizes the experience for applications assigned to this examiner. Practitioners should plan for this timeline when seeking a grant in Art Unit 2881.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18651934 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18735021 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18489173 | SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD THEREFOR | Final Rejection | NXP USA, INC. |
| 18009970 | DISPLAY DEVICE WITH BENDING REGION REINFORCING STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | SHARP KABUSHIKI KAISHA |
| 18263406 | EBEAM INSPECTION | Final Rejection | VueReal Inc. |
| 18140465 | RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE ANTENNA AND THE RF DIE | Final Rejection | Intel Corporation |
| 17372612 | MEMORY CELLS WITH NON-PLANAR FERROELECTRIC OR ANTIFERROELECTRIC MATERIALS | Final Rejection | Intel Corporation |
| 18730675 | METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS, AND OPTOELECTRONIC SEMICONDUCTOR CHIP | Non-Final OA | AMS-OSRAM INTERNATIONAL GMBH |
| 18696484 | OPTOELECTRONIC COMPONENT, OPTOELECTRONIC DEVICE, AND METHOD FOR PRODUCING OPTOELECTRONIC COMPONENTS OR OPTOELECTRONIC DEVICES | Non-Final OA | AMS-OSRAM International GmbH |
| 18656609 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18751061 | THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18781105 | OVERHANGING SOURCE/DRAIN CONTACT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18733536 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18789808 | Via for Component Electrode Connection | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18777240 | NANOSTRUCTURE DEVICE WITH REDUCED HIGH-K DIELECTRIC AREA AND RELATED METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18766300 | SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18748008 | NOVEL THIN FILM RESISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18613120 | Heat dissipation module | Final Rejection | Coretronic Corporation |
| 18542189 | CHIP SCALE PACKAGE LIGHT-EMITTING DEVICE WITH THIN, CONFORMAL WAVELENGTH CONVERTER | Non-Final OA | LUMILEDS LLC |
| 18099496 | SLURRY FOR POLISHING COPPER, DISPLAY DEVICE MANUFACTURING METHOD USING THE SAME, AND DISPLAY DEVICE | Final Rejection | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) |
| 18413687 | INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMING THE SAME | Final Rejection | SANDISK TECHNOLOGIES LLC |
| 18651076 | WAVELENGTH CONVERTER FOR LUMINESCENCE THERMOMETRY | Non-Final OA | Photon Control Inc. |
| 18573817 | LIGHT EMITTING DEVICE COMPRISING A COOLING SYSTEM | Non-Final OA | INSTITUT D'OPTIQUE THEORIQUE ET APPLIQUEE |
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