Prosecution Insights
Prosecution Insights
4 pending office actions • 1 art units • 4 examiners • 0 of 4 (0%) have an AI response strategy ready • 2 patents granted in the last 365 days
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 3 (75%) |
| Multi-statute (no §101) | 1 (25%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MUSLIM, SHAWN SHAW | 1 | 86.7% | +9.6% |
| DIALLO, MAMADOU L | 1 | 92.0% | +3.0% |
| NIELSEN, DEREK LANG | 1 | 69.8% | +39.4% |
| MELLINGER, CORBYN DAVID | 1 | 77.8% | +42.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18646799 | SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF | DIALLO, MAMADOU L | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18646794 | CHIP PACKAGE STRUCTURE AND PREPARATION METHOD THEREOF | MUSLIM, SHAWN SHAW | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18594005 | BRIDGE CHIP, FAN-OUT PACKAGE STRUCTURE AND CORRESPONDING PACKAGING METHOD | NIELSEN, DEREK LANG | — |
| 18213960 | CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF | MELLINGER, CORBYN DAVID | — |
| Art Unit | Apps |
|---|---|
| 2899 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18646794 | CHIP PACKAGE STRUCTURE AND PREPARATION METHOD THEREOF | MUSLIM, SHAWN SHAW | — | §102§103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18646799 | SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF | DIALLO, MAMADOU L | — | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18594005 | BRIDGE CHIP, FAN-OUT PACKAGE STRUCTURE AND CORRESPONDING PACKAGING METHOD | NIELSEN, DEREK LANG | 2899 | §103 | Non-Final OA | — | Pending | Mar 04, 2024 |
| 18213960 | CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF | MELLINGER, CORBYN DAVID | 2899 | §103 | Non-Final OA | — | Pending | Jun 26, 2023 |
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