Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 68% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17891738 | THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES | Final Rejection | Intel Corporation |
| 18473896 | THREE-DIMENSIONAL MEMORIES, MANUFACTURING METHODS THEREOF, AND MEMORY SYSTEMS | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 17888918 | POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Kia Corporation |
| 17726494 | FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17452642 | SUBSTRATE HOLDER, SUBSTRATE TRANSFER DEVICE, AND METHOD OF MANUFACTURING SUBSTRATE HOLDER | Final Rejection | Tokyo Electron Limited |
| 18499266 | VIA CONNECTION IN MIDDLE BEOL WIRING | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18333033 | SEMICONDUCTOR DEVICE | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18466820 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Final Rejection | MACRONIX International Co., Ltd. |
| 17671551 | PLASMA DAMAGE PROTECTION DEVICE AND PLASMA DAMAGE PROTECTION METHOD | Non-Final OA | Winbond Electronics Corp. |
| 18349440 | SEMICONDUCTOR DEVICE PACKAGE | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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