Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2899 4100
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18612672 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17888918 | POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Kia Corporation |
| 18812031 | SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 18319551 | THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPREADER CONFIGURED AS A BACKSIDE POWER PLANE | Final Rejection | Microsoft Technology Licensing, LLC |
| 18513765 | BACKSIDE CONTACT CAP AND SPACER FOR BACKSIDE SIGNAL CONTACT ISOLATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18784860 | METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18784297 | ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17726494 | FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17452642 | SUBSTRATE HOLDER, SUBSTRATE TRANSFER DEVICE, AND METHOD OF MANUFACTURING SUBSTRATE HOLDER | Final Rejection | Tokyo Electron Limited |
| 18702727 | THREE-DIMENSIONAL MEMORY ARRAY AND METHOD FOR MANUFACTURING SAME | Non-Final OA | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| 17671551 | PLASMA DAMAGE PROTECTION DEVICE AND PLASMA DAMAGE PROTECTION METHOD | Non-Final OA | Winbond Electronics Corp. |
| 17839313 | METHOD FOR MANUFACTURING METAL GATE MOS TRANSISTOR | Non-Final OA | Shanghai Huali Integrated Circuit Corporation |
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