Prosecution Insights
Last updated: April 19, 2026

Examiner: NIELSEN, DEREK LANG

Tech Center 2800 • Art Units: 2899

This examiner grants 66% of resolved cases

Performance Statistics

66.0%
Allow Rate
-2.0% vs TC avg
76
Total Applications
+51.6%
Interview Lift
1384
Avg Prosecution Days
Based on 47 resolved cases, 2023–2026

Rejection Statute Breakdown

0.6%
§101 Eligibility
15.0%
§102 Novelty
60.8%
§103 Obviousness
20.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18168681 FERROELECTRIC FIELD EFFECT TRANSISTOR, NEURAL NETWORK APPARATUS, AND ELECTRONIC DEVICE Non-Final OA Samsung Electronics Co., Ltd.
17856122 INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
17434863 SUBSTRATE FOR REMOVAL OF DEVICES USING VOID PORTIONS Non-Final OA The Regents of the University of California
17671351 DISPLAY APPARATUS Non-Final OA Samsung Display Co., Ltd.
17888918 POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME Final Rejection Kia Corporation
18319551 THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPREADER CONFIGURED AS A BACKSIDE POWER PLANE Non-Final OA Microsoft Technology Licensing, LLC
17896223 SOURCE DRAIN FORMATION IN GATE ALL AROUND TRANSISTOR Final Rejection Applied Materials, Inc.
17645357 INSULATING CHIP Non-Final OA ROHM Co., LTD.
17452642 SUBSTRATE HOLDER, SUBSTRATE TRANSFER DEVICE, AND METHOD OF MANUFACTURING SUBSTRATE HOLDER Non-Final OA Tokyo Electron Limited
18473896 THREE-DIMENSIONAL MEMORIES, MANUFACTURING METHODS THEREOF, AND MEMORY SYSTEMS Non-Final OA Yangtze Memory Technologies Co., Ltd.
18450789 SIC-BASED ELECTRONIC DEVICE WITH FUSE ELEMENT FOR SHORT-CIRCUITS PROTECTION, AND MANUFACTURING METHOD THEREOF Non-Final OA STMICROELECTRONICS S.r.l.
17739415 METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE Non-Final OA NANYA TECHNOLOGY CORPORATION
18466820 MEMORY DEVICE AND METHOD OF FORMING THE SAME Non-Final OA MACRONIX International Co., Ltd.
17574904 SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF Final Rejection Semiconductor Manufacturing International (Beijing) Corporation
17846493 METHODS FOR PREVENTING EPI DAMAGE DURING ISOLATION PROCESSES Final Rejection Taiwan Semicondutor Manufacturing Company, Ltd.

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