Tech Center 1700 • Art Units: 1713 1716
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18593014 | SELECTIVE ETCHING OF ALTERNATING LAYERS OF SILICON OXIDE AND SILICON NITRIDE FOR HIGH ASPECT RATIO CONTACTS | Non-Final OA | Applied Materials, Inc. |
| 18442681 | SYSTEMS AND METHODS FOR NANOHOLE WET CLEANS | Non-Final OA | Applied Materials, Inc. |
| 18484379 | MICROWAVE HIGH-DENSITY PLASMA FOR SELECTIVE ETCH | Non-Final OA | Applied Materials, Inc. |
| 18696798 | POLISHING COMPOSITION | Non-Final OA | FUJIMI INCORPORATED |
| 18589690 | SILICON OXYNITRIDE REMOVAL ENHANCERS AND METHODS OF USE THEREOF | Non-Final OA | FUJIMI INCORPORATED |
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