Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2892
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18389465 | INTEGRATED CIRCUIT INCLUDING CELL ARRAY AND BACKSIDE POWER RAIL | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18192031 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18123337 | HEAT RADIATING MEMBER INCLUDING A SLIT AND SEMICONDUCTOR MODULE INCLUDING THE HEAT RADIATING MEMBER | Final Rejection | NIDEC CORPORATION |
| 18217827 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 17903414 | MULTIPLE FIN TRANSISTOR AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 18090199 | METHOD AND DEVICE FOR OBTAINING COORDINATE OF CONTACT THROUGH-HOLE (CT) IN MEMORY DEVICE | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18191701 | ARRAY SUBSTRATE | Non-Final OA | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18216733 | PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE PACKAGING STRUCTURE | Non-Final OA | Rayprus Technology (Foshan) Co., Ltd. |
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