Tech Center 2800 • Art Units: 2800 2892
This examiner grants 92% of resolved cases
Ethan Edward Cutler is an examiner in Tech Center 2800 and Art Unit 2800 with 61 resolved cases. He has an allowance rate of 91.8% and a median of 1267 days to allowance. The interview lift of 11.9% suggests that interviews provide a boost to the 91.8% allowance rate. For the 61 resolved cases, the 1267-day timeline is a factor for applicants to consider.
This 11.9% lift is a tool for navigating the prosecution period in Tech Center 2800. Practitioners should factor the 1267-day duration into their long-term strategies. The 91.8% allowance rate indicates a high frequency of successful outcomes. With 61 resolved cases, these metrics provide a clear picture of his examination style. The combination of the allowance rate and the 11.9% lift offers a path to grant in Art Unit 2800. These figures are the primary benchmarks for his docket.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18405534 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18404529 | IINTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18389465 | INTEGRATED CIRCUIT INCLUDING CELL ARRAY AND BACKSIDE POWER RAIL | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18238644 | INSULATED GLASS UNIT WITH TRANSPARENT OLED PANEL AND MOBILITY SYSTEM INCLUDING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 18723840 | COMPOUND SEMICONDUCTOR SUBSTRATE | Non-Final OA | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
| 18090199 | METHOD AND DEVICE FOR OBTAINING COORDINATE OF CONTACT THROUGH-HOLE (CT) IN MEMORY DEVICE | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18809258 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18290895 | LIGHTING DEVICE AND VEHICLE LAMP COMPRISING SAME | Non-Final OA | LG INNOTEK CO., LTD. |
| 18332388 | STACKED FETs WITH BACKSIDE ANGLE CUT | Non-Final OA | International Business Machines Corporation |
| 18594987 | SEMICONDUCTOR DEVICE INCLUDING SELECTOR | Non-Final OA | SK hynix Inc. |
| 18217827 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18403616 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
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