Tech Center 2800 • Art Units: 2892
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18192031 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18262395 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18123337 | HEAT RADIATING MEMBER INCLUDING A SLIT AND SEMICONDUCTOR MODULE INCLUDING THE HEAT RADIATING MEMBER | Final Rejection | NIDEC CORPORATION |
| 17903414 | MULTIPLE FIN TRANSISTOR AND METHOD | Final Rejection | Micron Technology, Inc. |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18147957 | A MULTI-LAYER SEMICONDUCTOR DEVICE INTERCONNECT INCLUDING INTERWEAVED FINGERS | Non-Final OA | NEXPERIA B.V. |
| 18191701 | ARRAY SUBSTRATE | Non-Final OA | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 17735367 | METHOD FOR FABRICATING SEMICONDUCTOR CHIP STRUCTURES, SEMICONDUCTOR CARRIER AND SEMICONDUCTOR CHIP STRUCTURE | Final Rejection | PanelSemi Corporation |
| 18216733 | PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE PACKAGING STRUCTURE | Non-Final OA | Rayprus Technology (Foshan) Co., Ltd. |
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