Tech Center 3700 • Art Units: 2831 2835 2841 2848 2896 3763
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18089489 | SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION | Final Rejection | Intel Corporation |
| 18853000 | CIRCUIT BOARD | Non-Final OA | LG INNOTEK CO., LTD. |
| 18595907 | ELECTRONIC SYSTEM | Non-Final OA | MEDIATEK INC. |
| 18447406 | CONNECTOR STRUCTURES | Non-Final OA | Cisco Technology, Inc. |
| 18886513 | COMMUNICATION CABLES WITH ELECTRICAL AND OPTICAL LANES | Non-Final OA | Panduit Corp. |
| 18938154 | ENHANCE ISOLATION PACKAGE | Non-Final OA | Analog Devices, Inc. |
| 18953566 | MULTI-CORE CABLE | Non-Final OA | Sumitomo Wiring Systems, Ltd. |
| 18957034 | SHIELD CABLE | Non-Final OA | Proterial, Ltd. |
| 18854547 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE | Non-Final OA | Resonac Corporation |
| 18731834 | TRACK ASSEMBLY | Final Rejection | Pexco Aerospace, Inc. |
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