Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 87% of resolved cases
Victor Joseph Lasasso is an examiner in Art Unit 2898 of Tech Center 2800. With 46 resolved cases, the examiner maintains an allowance rate of 87.0 percent. This rate suggests a favorable path to allowance for most applications. The median days to allowance is 1347, providing a benchmark for the expected duration of the prosecution process.
The interview lift is 0.8 percent, indicating that while interviews are beneficial, the baseline allowance rate of 87.0 percent is already high. Practitioners may still find interviews useful for resolving specific issues and potentially navigating the 1347-day median pendency more effectively. The 46 resolved cases provide a look at the examiner's tendencies in Tech Center 2800.
The 87.0 percent allowance rate and 0.8 percent interview lift suggest a consistent examination process. The 1347-day median to allowance helps applicants plan their patent strategies with an understanding of the timeline. These metrics from Art Unit 2898 offer a data-grounded view of historical performance.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18436993 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18394158 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18536237 | WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF | Non-Final OA | NICHIA CORPORATION |
| 18474088 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 17710348 | ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION | Non-Final OA | Texas Instruments Incorporated |
| 18099348 | SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18594675 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 18656194 | STACKED SEMICONDUCTOR DEVICE WITH METAL PAD FOR REDUCED VOLTAGE DROP | Non-Final OA | OMNIVISION TECHNOLOGIES, INC. |
| 18492802 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18433416 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | United Semiconductor (Xiamen) Co., Ltd. |
| 18439823 | PROCESS OF FORMING A THIN SEMICONDUCTOR LAYER BONDED TO A PROCESSING SUBSTRATE AND AN ELECTRONIC DEVICE INCLUDING THE THIN SEMICONDUCTOR LAYER | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18530238 | STRUCTURE HAVING MULTI-DIELECTRIC LAYERS | Non-Final OA | MIKRO MESA TECHNOLOGY CO., LTD. |
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