Tech Center 2800 • Art Units: 2815
This examiner grants 60% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18088362 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 19263214 | THIN-FILM TRANSISTORS AND RELATED METHODS OF MANUFACTURE WITH CHANNEL AND HARDMASK MATERIALS | Final Rejection | ZINITE CORPORATION |
| 17870405 | MODULAR POWER DEVICE PACKAGE EMBEDDED IN CIRCUIT CARRIER | Final Rejection | Infineon Technologies AG |
| 17866924 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17558425 | COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT | Final Rejection | Intel Corporation |
| 17358073 | STACKED TWO-LEVEL BACKEND MEMORY | Final Rejection | INTEL CORPORATION |
| 17193291 | MEMORY CELL AND SEMICONDUCTOR DEVICE WITH THE SAME | Non-Final OA | SK hynix Inc. |
| 18224609 | METHOD OF FORMING CAPACITOR STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17879981 | METAL STRUCTURE HAVING FUNNEL-SHAPED INTERCONNECT AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18136290 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Seoul Viosys Co., Ltd. |
| 17716928 | EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY | Non-Final OA | Altera Corporation |
| 17581751 | EMBEDDED MULTI-DIE INTERCONNECT BRIDGE WITH IMPROVED POWER DELIVERY | Non-Final OA | Altera Corporation |
| 18307388 | OPTICAL PIXEL WITH AN OPTICAL CONCENTRATOR AND A FULL-DEPTH DEEP ISOLATION TRENCH FOR IMPROVED LOW-LIGHT PERFORMANCE | Final Rejection | SiOnyx, LLC |
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