Tech Center 3700 • Art Units: 1712 1716 1792 3762
This examiner grants 44% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18667082 | BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR | Non-Final OA | Applied Materials, Inc. |
| 18140508 | GAS EXHAUST FRAMES INCLUDING PATHWAYS HAVING SIZE VARIATIONS, AND RELATED APPARATUS AND METHODS | Final Rejection | Applied Materials, Inc. |
| 18101523 | PRE-HEAT RINGS AND PROCESSING CHAMBERS INCLUDING BLACK QUARTZ, AND RELATED METHODS | Non-Final OA | Applied Materials, Inc. |
| 17975195 | EPI OVERLAPPING DISK AND RING | Non-Final OA | Applied Materials, Inc. |
| 17971494 | PROCESS CHAMBER WITH REFLECTOR | Final Rejection | Applied Materials, Inc. |
| 17919896 | WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER | Non-Final OA | Applied Materials, Inc. |
| 17964684 | ELECTROSTATIC CHUCK WITH DETACHABLE SHAFT | Non-Final OA | Applied Materials, Inc. |
| 17961214 | LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING | Final Rejection | Applied Materials, Inc. |
| 17862138 | APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY | Non-Final OA | Applied Materials, Inc. |
| 17374558 | APPARATUS DESIGN FOR PHOTORESIST DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 17368997 | COATED SUBSTRATE SUPPORT ASSEMBLY FOR SUBSTRATE PROCESSING | Final Rejection | Applied Materials, Inc |
| 17691856 | PLASMA PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Final Rejection | Kioxia Corporation |
| 17178458 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17457605 | HIGH PERFORMANCE SUSCEPTOR APPARATUS | Final Rejection | ASM IP HOLDING B.V. |
| 17392257 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18495891 | SUBSTRATE PROCESSING APPARATUS, PLASMA GENERATING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 17733653 | APPARATUS AND METHOD FOR PROCESSING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18463647 | TOOL FOR PREVENTING OR SUPPRESSING ARCING | Non-Final OA | Lam Research Corporation |
| 17924618 | EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKS | Non-Final OA | LAM RESEARCH CORPORATION |
| 17920111 | FLOATING PCB DESIGN FOR SUBSTRATE SUPPORT ASSEMBLY | Non-Final OA | LAM RESEARCH CORPORATION |
| 17821107 | ATOMIC LAYER ETCHING AND SMOOTHING OF REFRACTORY METALS AND OTHER HIGH SURFACE BINDING ENERGY MATERIALS | Final Rejection | Lam Research Corporation |
| 18846849 | VACUUMING STSTEM, SEMICONDUCTOR PROCESS DEVICE AND VACUUMING METHOD THEREOF | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 17941923 | REACTION CHAMBER | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 17846867 | Radiatively-Cooled Substrate Holder | Final Rejection | TEL Manufacturing and Engineering of America, Inc. |
| 17838821 | SUSCEPTOR AND MANUFACTURING METHOD THEREOF | Final Rejection | CoorsTek KK |
| 18454374 | CHAMBER FOR DEGASSING SUBSTRATES | Non-Final OA | EVATEC AG |
| 18248069 | PEDESTAL HEATER BLOCK HAVING ASYMMETRIC HEATING WIRE STRUCTURE | Non-Final OA | MECARO CO., LTD. |
| 17801488 | ATOMIZING APPARATUS FOR FILM FORMATION, FILM FORMING APPARATUS USING THE SAME, AND SEMICONDUCTOR FILM | Non-Final OA | KOCHI PREFECTURAL PUBLIC UNIVERSITY CORPORATION |
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