Prosecution Insights
Last updated: August 18, 2026

Examiner: NUCKOLS, TIFFANY Z

Tech Center 3700 • Art Units: 1712 1716 1718 1792 3762

This examiner grants 44% of resolved cases

Performance Statistics

44.5%
Allow Rate
-25.5% vs TC avg
663
Total Applications
+40.0%
Interview Lift
1544
Avg Prosecution Days
Based on 620 resolved cases, 2023–2026

Rejection Statute Breakdown

0.2%
§101 Eligibility
21.9%
§102 Novelty
61.5%
§103 Obviousness
12.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18532468 PLASMA PROCESSING EQUIPMENT Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
17457605 HIGH PERFORMANCE SUSCEPTOR APPARATUS Non-Final OA ASM IP HOLDING B.V.
17851637 APPARATUS FOR MANUFACTURING POLYSILICON ROD AND METHOD FOR MANUFACTURING POLYSILICON ROD Non-Final OA Shin-Etsu Chemical Co., Ltd.
18786928 SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
17855529 METAL ETCHING WITH IN SITU PLASMA ASHING Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18667082 BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR Final Rejection Applied Materials, Inc.
18370155 PLASMA SOURCE WITH MULTIPLE EXTRACTION APERTURES Non-Final OA Applied Materials, Inc.
18140508 GAS EXHAUST FRAMES INCLUDING PATHWAYS HAVING SIZE VARIATIONS, AND RELATED APPARATUS AND METHODS Non-Final OA Applied Materials, Inc.
18125215 SEMICONDUCTOR MANUFACTURING SUSCEPTOR POCKET EDGE FOR PROCESS IMPROVEMENT Final Rejection Applied Materials, Inc.
18101523 PRE-HEAT RINGS AND PROCESSING CHAMBERS INCLUDING BLACK QUARTZ, AND RELATED METHODS Final Rejection Applied Materials, Inc.
17919896 WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER Final Rejection Applied Materials, Inc.
17964684 ELECTROSTATIC CHUCK WITH DETACHABLE SHAFT Final Rejection Applied Materials, Inc.
17204428 Pedestal Geometry for Fast Gas Exchange Final Rejection Applied Materials, Inc.
18753777 METHOD AND APPARATUS FOR DAMASCENE ETCHING Non-Final OA Tokyo Electron Limited
18891772 SUBSTRATE PROCESSING APPARATUS, PROCESSING VESSEL, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Kokusai Electric Corporation
17914129 ATMOSPHERIC PRESSURE REMOTE PLASMA CVD DEVICE, FILM FORMATION METHOD, AND PLASTIC BOTTLE MANUFACTURING METHOD Non-Final OA SUNTORY HOLDINGS LIMITED
18764079 SELECTIVE SILICON DIOXIDE REMOVAL USING LOW PRESSURE LOW BIAS DEUTERIUM PLASMA Non-Final OA Lam Research Corporation
17924618 EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKS Final Rejection LAM RESEARCH CORPORATION
17438021 ELECTROSTATIC CLAMP FOR A LITHOGRAPHIC APPARATUS Non-Final OA ASML Holding N.V.

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