Tech Center 3700 • Art Units: 1712 1716 1718 1792 3762
This examiner grants 44% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18532468 | PLASMA PROCESSING EQUIPMENT | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17457605 | HIGH PERFORMANCE SUSCEPTOR APPARATUS | Non-Final OA | ASM IP HOLDING B.V. |
| 17851637 | APPARATUS FOR MANUFACTURING POLYSILICON ROD AND METHOD FOR MANUFACTURING POLYSILICON ROD | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18786928 | SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17855529 | METAL ETCHING WITH IN SITU PLASMA ASHING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18667082 | BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR | Final Rejection | Applied Materials, Inc. |
| 18370155 | PLASMA SOURCE WITH MULTIPLE EXTRACTION APERTURES | Non-Final OA | Applied Materials, Inc. |
| 18140508 | GAS EXHAUST FRAMES INCLUDING PATHWAYS HAVING SIZE VARIATIONS, AND RELATED APPARATUS AND METHODS | Non-Final OA | Applied Materials, Inc. |
| 18125215 | SEMICONDUCTOR MANUFACTURING SUSCEPTOR POCKET EDGE FOR PROCESS IMPROVEMENT | Final Rejection | Applied Materials, Inc. |
| 18101523 | PRE-HEAT RINGS AND PROCESSING CHAMBERS INCLUDING BLACK QUARTZ, AND RELATED METHODS | Final Rejection | Applied Materials, Inc. |
| 17919896 | WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER | Final Rejection | Applied Materials, Inc. |
| 17964684 | ELECTROSTATIC CHUCK WITH DETACHABLE SHAFT | Final Rejection | Applied Materials, Inc. |
| 17204428 | Pedestal Geometry for Fast Gas Exchange | Final Rejection | Applied Materials, Inc. |
| 18753777 | METHOD AND APPARATUS FOR DAMASCENE ETCHING | Non-Final OA | Tokyo Electron Limited |
| 18891772 | SUBSTRATE PROCESSING APPARATUS, PROCESSING VESSEL, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kokusai Electric Corporation |
| 17914129 | ATMOSPHERIC PRESSURE REMOTE PLASMA CVD DEVICE, FILM FORMATION METHOD, AND PLASTIC BOTTLE MANUFACTURING METHOD | Non-Final OA | SUNTORY HOLDINGS LIMITED |
| 18764079 | SELECTIVE SILICON DIOXIDE REMOVAL USING LOW PRESSURE LOW BIAS DEUTERIUM PLASMA | Non-Final OA | Lam Research Corporation |
| 17924618 | EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKS | Final Rejection | LAM RESEARCH CORPORATION |
| 17438021 | ELECTROSTATIC CLAMP FOR A LITHOGRAPHIC APPARATUS | Non-Final OA | ASML Holding N.V. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy