Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1712 1716 1718 1792 3762
This examiner grants 46% of resolved cases
Tiffany Z. Nuckols examines applications in Art Unit 1712 within Tech Center 3700. She has resolved 631 cases with an allowance rate of 45.5 percent. The median days to allowance is 1546, which is a significant duration for prosecution. Practitioners should be prepared for a timeline that spans many days in Tech Center 3700.
The data highlights a substantial interview lift of 40.1 percent. This lift is particularly impactful given the 45.5 percent baseline allowance rate, suggesting that interviews are a critical strategy for success. For the 631 cases resolved, the 1546-day median pendency is a key factor to consider. Practitioners should prioritize interviews to leverage the 40.1 percent lift and improve their chances in Art Unit 1712. Navigating the 1546-day process requires a proactive approach to communication.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18532468 | PLASMA PROCESSING EQUIPMENT | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17955816 | MODULAR REACTION CHAMBER | Final Rejection | ASM IP Holding B.V. |
| 17457605 | HIGH PERFORMANCE SUSCEPTOR APPARATUS | Non-Final OA | ASM IP HOLDING B.V. |
| 18727830 | ACTIVE TEMPERATURE CONTROL OF SHOWERHEADS FOR HIGH TEMPERATURE PROCESSES | Non-Final OA | LAM RESEARCH CORPORATION |
| 18764079 | SELECTIVE SILICON DIOXIDE REMOVAL USING LOW PRESSURE LOW BIAS DEUTERIUM PLASMA | Non-Final OA | Lam Research Corporation |
| 18710671 | SHOWERHEAD FACEPLATE CONFIGURATIONS | Non-Final OA | LAM RESEARCH CORPORATION |
| 18768923 | THIN FACEPLATE DESIGN FOR USE IN A PROCESSING CHAMBER | Non-Final OA | Applied Materials, Inc. |
| 18667082 | BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR | Final Rejection | Applied Materials, Inc. |
| 18370155 | PLASMA SOURCE WITH MULTIPLE EXTRACTION APERTURES | Non-Final OA | Applied Materials, Inc. |
| 18140508 | GAS EXHAUST FRAMES INCLUDING PATHWAYS HAVING SIZE VARIATIONS, AND RELATED APPARATUS AND METHODS | Non-Final OA | Applied Materials, Inc. |
| 18101523 | PRE-HEAT RINGS AND PROCESSING CHAMBERS INCLUDING BLACK QUARTZ, AND RELATED METHODS | Final Rejection | Applied Materials, Inc. |
| 17975195 | EPI OVERLAPPING DISK AND RING | Final Rejection | Applied Materials, Inc. |
| 17919896 | WAFER EDGE TEMPERATURE CORRECTION IN BATCH THERMAL PROCESS CHAMBER | Final Rejection | Applied Materials, Inc. |
| 17964684 | ELECTROSTATIC CHUCK WITH DETACHABLE SHAFT | Final Rejection | Applied Materials, Inc. |
| 19056816 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17756980 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18891772 | SUBSTRATE PROCESSING APPARATUS, PROCESSING VESSEL, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kokusai Electric Corporation |
| 18413805 | SUBSTRATE TREATING APPARATUS AND FLUID SUPPLY UNIT | Non-Final OA | SEMES CO., LTD. |
| 18816792 | SYSTEMS FOR DEPOSITING COATINGS ON SURFACES AND ASSOCIATED METHODS | Non-Final OA | Continental Reifen Deutschland GmbH |
| 18846849 | VACUUMING STSTEM, SEMICONDUCTOR PROCESS DEVICE AND VACUUMING METHOD THEREOF | Final Rejection | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 18722085 | SEMICONDUCTOR PROCESSING DEVICE AND EXHAUST SYSTEM THEREOF | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 18254062 | SEMICONDUCTOR PROCESS APPARATUS AND POWER CONTROL METHOD | Final Rejection | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy