Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1714 1743
This examiner grants 52% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17697056 | SYSTEMS AND METHODS FOR SELECTIVELY ETCHING FILMS | Non-Final OA | ASM IP Holding B.V. |
| 17889136 | METHOD FOR TREATING OBJECT TO BE TREATED AND TREATMENT LIQUID | Non-Final OA | FUJIFILM Corporation |
| 18409085 | POLYMER NANOPARTICLE AND METHOD OF PREPARING SAME | Non-Final OA | POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION |
| 19051385 | METAL OXIDE DIRECTIONAL REMOVAL | Non-Final OA | Applied Materials, Inc. |
| 18668480 | PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROL | Final Rejection | Applied Materials, Inc. |
| 17033201 | METHODS TO FABRICATE 2D WEDGE AND LOCALIZED ENCAPSULATION FOR DIFFRACTIVE OPTICS | Non-Final OA | Applied Materials, Inc. |
| 17966021 | MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING | Non-Final OA | Intel Corporation |
| 18386520 | MEMORY CELLS WITH SIDEWALL AND BULK REGIONS IN PLANAR STRUCTURES | Non-Final OA | Micron Technology, Inc. |
| 17440212 | SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR PRODUCTION METHOD, AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18538048 | ISOTROPIC ECHING METHOD FOR TWO-DIMENSIONAL SEMICONDUCTOR MATERIALS | Non-Final OA | Research & Business Foundation SUNGKYUNKWAN UNIVERSITY |
| 17921789 | MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT | Final Rejection | KYOCERA Corporation |
| 17446723 | METHOD FOR ETCHING A III-N MATERIAL LAYER | Final Rejection | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18782475 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18657842 | APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18622318 | METHOD FOR REMOVING METAL-CONTAINING MATERIALS IN SMALL PITCH STRUCTURES | Non-Final OA | Tokyo Electron Limited |
| 18433320 | DIRECT CURRENT SUPERPOSITION (DCS) FOR PROTECTION OF ORGANIC MANDREL DURING SPACER DEPOSITION | Non-Final OA | Tokyo Electron Limited |
| 18402328 | FAULT DETECTION AND CLASSIFICATION (FDC) FOR ENDPOINT DETECTION (EPD) BY REFLECTOMETRY | Non-Final OA | Tokyo Electron Limited |
| 18518862 | CLEANING METHOD AND PLASMA PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 18198355 | METAL OXIDE PRECLEANING PRIOR TO METAL FILLING | Non-Final OA | Tokyo Electron Limited |
| 17880660 | METHOD AND APPARATUS FOR CONTROLLING A SHAPE OF A PATTERN OVER A SUBSTRATE | Final Rejection | Tokyo Electron Limited |
| 17842501 | PLASMA ETCHING USING MULTIPHASE MULTIFREQUENCY POWER PULSES AND VARIABLE DUTY CYCLING | Non-Final OA | Tokyo Electron Limited |
| 18784608 | SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17924248 | METHOD FOR ETCHING SILICON WAFER | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 17851812 | APPARATUS AND METHOD FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18044336 | TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE DIRECT METAL-METAL BONDING | Non-Final OA | Lam Research Corporation |
| 18003894 | REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD EXTENSION | Final Rejection | Lam Research Corporation |
| 16577580 | Barrier Slurry Removal Rate Improvement | Non-Final OA | Versum Materials US, LLC |
| 18309925 | SYSTEMS AND METHODS FOR ENGRAVING OF NANO VOID-DASH METASURFACE INTO SUBSTRATE TO GENERATE BIREFRINGENCE IN THE SURFACE LAYER | Non-Final OA | Lawrence Livermore National Security, LLC |
| 18909483 | CMP SLURRIES | Final Rejection | FUJIMI INCORPORATED |
| 18423589 | POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION | Non-Final OA | FUJIMI INCORPORATED |
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