Tech Center 1700 • Art Units: 1713 1714
This examiner grants 52% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17889136 | METHOD FOR TREATING OBJECT TO BE TREATED AND TREATMENT LIQUID | Non-Final OA | FUJIFILM Corporation |
| 18187055 | ATOMIC LAYER ETCHING OF METAL OXIDES USING NOVEL CO-REACTANTS AS HALOGENATING AGENTS FOR SEMICONDUCTOR FABRICATION | Non-Final OA | North Carolina State University |
| 16645741 | METHOD FOR MANUFACTURING DISK-SHAPED GLASS SUBSTRATE, METHOD FOR MANUFACTURING THIN GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING LIGHT-GUIDING PLATE | Non-Final OA | HOYA CORPORATION |
| 19051385 | METAL OXIDE DIRECTIONAL REMOVAL | Non-Final OA | Applied Materials, Inc. |
| 18668480 | PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROL | Final Rejection | Applied Materials, Inc. |
| 17921789 | MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT | Final Rejection | KYOCERA Corporation |
| 18782475 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18657842 | APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17967041 | METHOD AND APPARATUS FOR SOLVENT RECYCLING | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17966021 | MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING | Non-Final OA | Intel Corporation |
| 18386520 | MEMORY CELLS WITH SIDEWALL AND BULK REGIONS IN PLANAR STRUCTURES | Non-Final OA | Micron Technology, Inc. |
| 17944227 | ANTI-CORROSION SUPER-SLIPPERY ALUMINUM CAPILLARY TUBE AND METHOD AND DEVICE FOR PREPARING THE SAME | Non-Final OA | XI'AN JIAOTONG UNIVERSITY |
| 17440212 | SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR PRODUCTION METHOD, AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 17446723 | METHOD FOR ETCHING A III-N MATERIAL LAYER | Final Rejection | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18538048 | ISOTROPIC ECHING METHOD FOR TWO-DIMENSIONAL SEMICONDUCTOR MATERIALS | Non-Final OA | Research & Business Foundation SUNGKYUNKWAN UNIVERSITY |
| 18622318 | METHOD FOR REMOVING METAL-CONTAINING MATERIALS IN SMALL PITCH STRUCTURES | Non-Final OA | Tokyo Electron Limited |
| 18433320 | DIRECT CURRENT SUPERPOSITION (DCS) FOR PROTECTION OF ORGANIC MANDREL DURING SPACER DEPOSITION | Non-Final OA | Tokyo Electron Limited |
| 18402328 | FAULT DETECTION AND CLASSIFICATION (FDC) FOR ENDPOINT DETECTION (EPD) BY REFLECTOMETRY | Non-Final OA | Tokyo Electron Limited |
| 18395879 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18518862 | CLEANING METHOD AND PLASMA PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 17880660 | METHOD AND APPARATUS FOR CONTROLLING A SHAPE OF A PATTERN OVER A SUBSTRATE | Final Rejection | Tokyo Electron Limited |
| 18476215 | DENTAL APPLIANCES WITH ORNAMENTAL DESIGNS AND ASSOCIATED METHODS | Non-Final OA | Align Technology, Inc. |
| 17908177 | PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18784608 | SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17809912 | Chemical Composition for Tri-Layer Removal | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17991044 | METHOD FOR SELECTIVELY REMOVING OXIDE FROM A SURFACE | Final Rejection | ASM IP Holding B.V. |
| 17924248 | METHOD FOR ETCHING SILICON WAFER | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 17851812 | APPARATUS AND METHOD FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18003894 | REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD EXTENSION | Final Rejection | Lam Research Corporation |
| 16577358 | High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dishing In Shallow Trench Isolation(STI) Chemical Mechanical Planarization Polishing(CMP) | Non-Final OA | Versum Materials US, LLC |
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