Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1714 1716 1743 2852
This examiner grants 52% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18771727 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18232123 | PLASMA CONTROL DEVICE AND PLASMA CONTROL METHOD | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18123508 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF FABRICATING THE SAME | Non-Final OA | ASM IP Holding B.V. |
| 18476215 | DENTAL APPLIANCES WITH ORNAMENTAL DESIGNS AND ASSOCIATED METHODS | Non-Final OA | Align Technology, Inc. |
| 18374224 | ETCHING PROCESSING METHOD AND ETCHING PROCESSING APPARATUS | Final Rejection | Hitachi High-Tech Corporation |
| 17909039 | SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS | Final Rejection | HITACHI HIGH-TECH CORPORATION |
| 17908177 | PLASMA PROCESSING METHOD | Final Rejection | Hitachi High-Tech Corporation |
| 16650691 | POLISHING SOLUTION, POLISHING SOLUTION SET, AND POLISHING METHOD | Non-Final OA | HITACHI CHEMICAL COMPANY, LTD. |
| 18400440 | SEMICONDUCTOR DIE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18646459 | PLANARIZATION PROCESS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18534061 | UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING GEOMETRIES | Final Rejection | Applied Materials, Inc. |
| 18521948 | PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROL | Final Rejection | Applied Materials, Inc. |
| 18395879 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18573700 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 18564314 | FILM FORMATION METHOD AND FILM FORMATION DEVICE | Non-Final OA | Tokyo Electron Limited |
| 18517206 | METHOD AND SYSTEM FOR PLASMA PROCESS | Final Rejection | Tokyo Electron Limited |
| 18386618 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 17956089 | Low-Temperature Etch | Non-Final OA | Tokyo Electron Limited |
| 17880660 | METHOD AND APPARATUS FOR CONTROLLING A SHAPE OF A PATTERN OVER A SUBSTRATE | Final Rejection | Tokyo Electron Limited |
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