Listed by the USPTO as TURNER, BRIAN
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 83% of resolved cases
TURNER, BRIAN is assigned to USPTO technology center 2800 and art unit 2818. The profile covers 776 resolved cases and shows an 83.4% allowance rate. The interview lift is 4.1%, and median time to allowance is 771 days, supplying a relatively short timing measure within this profile.
Top company entries are Taiwan Semiconductor Manufacturing Company, Ltd., Micron Technology Inc., and Intel Corporation. The listed firms are Dorsey & Whitney LLP - MTI (Nelson), Haynes and Boone, LLP, and FITCH, EVEN, TABIN & FLANNERY, LLP. These relationships help identify the prosecution settings represented in the record.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18475290 | INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18165563 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18356230 | SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18903914 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18825620 | QUANTUM DOT AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18324640 | HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES | Non-Final OA | Intel Corporation |
| 17953873 | HIGH ASPECT RATIO METAL GATE CUTS | Non-Final OA | Intel Corporation |
| 17851985 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 18281779 | POWER CONVERSION DEVICE AND METHOD FOR CONTROLLING POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18530404 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18645043 | TWO TRANSISTOR CELLS FOR VERTICAL THREE-DIMENSIONAL MEMORY HAVING VERICAL DIGIT LINES | Non-Final OA | Micron Technology, Inc. |
| 18368449 | METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE SEPARATION | Final Rejection | Micron Technology, Inc. |
| 18111424 | MODIFIED SEMICONDUCTOR DIE CARRIER AND CARRIER TAPE | Non-Final OA | Micron Technology, Inc. |
| 17587971 | STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND MOLDED UNDERFILL | Non-Final OA | Micron Technology, Inc. |
| 18419632 | SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY | Non-Final OA | KIOXIA CORPORATION |
| 17684251 | PACKAGED DEVICE CARRIER FOR THERMAL ENHANCEMENT OR SIGNAL REDISTRIBUTION OF PACKAGED SEMICONDUCTOR DEVICES | Non-Final OA | Texas Instruments Incorporated |
| 17392738 | SEMICONDUCTOR PACKAGE WITH RAISED DAM ON CLIP OR LEADFRAME | Final Rejection | Texas Instruments Incorporated |
| 18132437 | WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION | Non-Final OA | MEDIATEK INC. |
| 18093648 | HYDROGEN MANAGEMENT IN PLASMA DEPOSITED FILMS | Final Rejection | Applied Materials, Inc. |
| 18519805 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17894169 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18655833 | CONNECTION BETWEEN SOURCE/DRAIN AND GATE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18632132 | NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18526445 | SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18521931 | METAL SOURCE/DRAIN FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18314446 | Complementary Field Effect Transistors and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18258846 | FILM ADHESIVE AND METHOD FOR MAKING SAME; DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MAKING SAME; AND SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME | Final Rejection | Resonac Corporation |
| 18258891 | FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Resonac Corporation |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.4% of resolved applications examined by Brian Turner were allowed (776 resolved cases), compared with 85.2% across Art Unit 2818 over the last five years.
This examiner's interview lift is +4.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Brian Turner took 771 days on average from filing to allowance.
Brian Turner examines applications in Art Unit 2818 in Tech Center 2800 (Semiconductors, Circuits & Optics).
