Technology area: Semiconductors, Circuits & Optics
14 pending office actions • 11 art units • 14 examiners • 0 of 14 (0%) have an AI response strategy ready • 9 patents granted in the last 365 days
At&S Austria Technologie & Systemtechnik AG has 13 pending office actions in Semiconductors, Circuits & Optics. The matters involve 13 examiners across 11 art units, demonstrating broad prosecution activity across several technical examination environments. This distribution supports centralized oversight of deadlines and claim strategy, with detailed review of each assignment.
ANDERSON, WILLIAM H is the busiest examiner, with 1 pending matter. No examiner accounts for a repeated share of the recorded workload, so counsel should focus on art-unit and application-specific patterns rather than a single examiner relationship.
The semiconductor, circuit, and optics classification can encompass different prior-art fields and claim interpretation issues. Consistent technical terminology and specification support remain useful across the portfolio, but arguments should be tied to the concrete limitations and references presented in each action.
Practitioners should also monitor whether amendments in one application affect related claim sets or admissions elsewhere. A structured comparison of actions by art unit can identify recurring objections without assuming that the same response will fit every proceeding.
Based on the USPTO statutory response window for each pending office action. 6 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 6 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 6 (43%) |
| §102 only | 1 (7%) |
| Multi-statute (no §101) | 7 (50%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SHARMA, ADITYA | 1 | 78.0% | +29.5% |
| SON, ERIKA HEERA | 1 | 64.5% | +2.7% |
| ANDERSON, WILLIAM H | 1 | 84.9% | +18.4% |
| RAHMAN, MOHAMMAD A | 1 | 87.2% | +10.6% |
| VARGHESE, ROSHN K | 1 | 67.5% | +20.4% |
| AYCHILLHUM, ANDARGIE M | 1 | 84.3% | +14.7% |
| VONCH, JEFFREY A | 1 | 52.0% | +43.6% |
| HARRISON, MONICA D | 1 | 91.8% | +2.7% |
| BELLO, AGUSTIN | 1 | 75.4% | +12.0% |
| CRITE, ANTONIO B | 1 | 81.6% | -13.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | AYCHILLHUM, ANDARGIE M | 72d |
| 18693683 | Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both | ANDERSON, WILLIAM H | — |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | RAHMAN, MOHAMMAD A | — |
| 18585434 | Component Carrier with Ultra-thin Insulation Film and Manufacturing Method | HARRISON, MONICA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18301244 | Metal Body Formed on a Component Carrier by Additive Manufacturing | ALONZO MILLER, RHADAMES J | 141d overdue |
| 18479944 | Package having component carrier with cavity and electronic component as well as functional filling medium therein | CRITE, ANTONIO B | 1d overdue |
| 18182272 | Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same | CHAN, TSZFUNG JACKIE | 15d |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | VARGHESE, ROSHN K | 43d |
| 18160406 | Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same | TYNES JR., LAWRENCE C | 75d |
| 18693609 | Component Carrier and Method of Manufacturing the Same | SON, ERIKA HEERA | — |
| 18604322 | SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FILLER PARTICLES HAVING DIFFERENT HOLLOW VOLUME THEREIN | VONCH, JEFFREY A | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | VARGHESE, ROSHN K | 43d |
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | AYCHILLHUM, ANDARGIE M | 72d |
| 18693630 | Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method | SHARMA, ADITYA | — |
| 18693683 | Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both | ANDERSON, WILLIAM H | — |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | RAHMAN, MOHAMMAD A | — |
| 18604322 | SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FILLER PARTICLES HAVING DIFFERENT HOLLOW VOLUME THEREIN | VONCH, JEFFREY A | — |
| 18410858 | Component Carrier With Stack and Optically Transparent Body For Guiding Light | BELLO, AGUSTIN | — |
| Art Unit | Apps |
|---|---|
| 2847 | 3 |
| 2817 | 2 |
| 2893 | 1 |
| 2898 | 1 |
| 2896 | 1 |
| 2848 | 1 |
| 1781 | 1 |
| 2815 | 1 |
| 2635 | 1 |
| 2837 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18693630 | Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method | SHARMA, ADITYA | 2847 | §103 | Final Rejection | — | Pending | Mar 20, 2024 |
| 18693609 | Component Carrier and Method of Manufacturing the Same | SON, ERIKA HEERA | 2893 | §102§103§112 | Non-Final OA | — | Pending | Mar 20, 2024 |
| 18693683 | Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both | ANDERSON, WILLIAM H | 2817 | §103 | Final Rejection | — | Pending | Mar 20, 2024 |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | RAHMAN, MOHAMMAD A | 2898 | §103 | Final Rejection | — | Pending | Mar 19, 2024 |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | VARGHESE, ROSHN K | 2896 | §102§103 | Final Rejection | 43d | Pending | Mar 14, 2024 |
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | AYCHILLHUM, ANDARGIE M | 2848 | §103 | Final Rejection | 72d | Pending | Mar 14, 2024 |
| 18604322 | SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FILLER PARTICLES HAVING DIFFERENT HOLLOW VOLUME THEREIN | VONCH, JEFFREY A | 1781 | §102§103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18585434 | Component Carrier with Ultra-thin Insulation Film and Manufacturing Method | HARRISON, MONICA D | 2815 | §103 | Final Rejection | — | Pending | Feb 23, 2024 |
| 18410858 | Component Carrier With Stack and Optically Transparent Body For Guiding Light | BELLO, AGUSTIN | 2635 | §102 | Final Rejection | — | Pending | Jan 11, 2024 |
| 18479944 | Package having component carrier with cavity and electronic component as well as functional filling medium therein | CRITE, ANTONIO B | 2817 | §102§103§112 | Non-Final OA | 1d overdue | Pending | Oct 03, 2023 |
| 18301938 | Component Carrier and Method of Manufacturing the Same | BURNS, TREMESHA WILLIS | 2847 | §103 | Non-Final OA | — | Pending | Apr 17, 2023 |
| 18301244 | Metal Body Formed on a Component Carrier by Additive Manufacturing | ALONZO MILLER, RHADAMES J | 2847 | §102§103 | Final Rejection | 141d overdue | Pending | Apr 16, 2023 |
| 18182272 | Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same | CHAN, TSZFUNG JACKIE | 2837 | §103§112Other | Final Rejection | 15d | Pending | Mar 10, 2023 |
| 18160406 | Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same | TYNES JR., LAWRENCE C | 2899 | §102§103 | Final Rejection | 75d | Pending | Jan 27, 2023 |
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Start Free TrialAt&S Austria Technologie & Systemtechnik AG has 14 pending office actions as of October 2026, spread across 11 art units and 14 examiners.
Aditya Sharma has the most, with 1 of At&S Austria Technologie & Systemtechnik AG's pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.
