Tech Center 2800 • Art Units: 2483 2800 2898
This examiner grants 44% of resolved cases
William Adrovel examines applications in Art Unit 2483 within Tech Center 2800. He has 160 resolved cases with an allowance rate of 43.8%. The median days to allowance for these cases is 1451. This history of 160 cases suggests a challenging prosecution environment.
The interview lift of 53.6% is an exceptionally high metric. This lift indicates that an interview can increase the probability of success compared to the 43.8% baseline allowance rate. In Art Unit 2483, practitioners should prioritize interviews to overcome rejections and manage the 1451-day median timeline.
With a 53.6% interview lift, verbal advocacy is a highly effective strategy for this examiner. The 43.8% allowance rate and 1451-day median pendency require a proactive approach. These data points from 160 cases are essential for planning successful prosecution in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18404584 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18523477 | Compound Semiconductor Device for High Power and High Frequency Operation | Non-Final OA | Mitsubishi Electric Research Laboratories, Inc. |
| 18712735 | RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18358768 | CROSS-POINT OVONIC FRUSTUM MEMORY DEVICE AND METHOD OF MAKING THE SAME | Final Rejection | WESTERN DIGITAL TECHNOLOGIES, INC. |
| 18457645 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18663327 | SEMICONDUCTOR DEVICE | Non-Final OA | DENSO CORPORATION |
| 18498305 | OXYGEN CONTROL DURING GATE FORMATION FOR IMPROVED CHANNEL MOBILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18367605 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17863175 | TIE OFF DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18434222 | EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18403418 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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