Tech Center 2800 • Art Units: 2483 2800 2898
This examiner grants 43% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18228191 | SUBSTRATE DEGASSING METHOD AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18057693 | MASK AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18404584 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18523477 | Compound Semiconductor Device for High Power and High Frequency Operation | Non-Final OA | Mitsubishi Electric Research Laboratories, Inc. |
| 18397506 | INTEGRATED DEEP TRENCH HIGH-K CAPACITOR AND METHOD | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18498305 | OXYGEN CONTROL DURING GATE FORMATION FOR IMPROVED CHANNEL MOBILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18367605 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17863175 | TIE OFF DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18457645 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18584492 | THERMALLY ENHANCED ELECTRO-OPTICAL DEVICE | Non-Final OA | STMICROELECTRONICS INTERNATIONAL N.V. |
| 18078245 | ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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