Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2145 2173 2898
This examiner grants 56% of resolved cases
Andrew Chung operates in Art Unit 2145 of Tech Center 2800 and has 332 resolved cases. The allowance rate is 56.0 percent. This percentage reflects the frequency of grants within the examiner's portfolio. The median days to allowance is 1382, which measures the time from the initial filing to the final issuance.
The interview lift is 31.4 percent. This figure indicates a significant increase in the probability of success for cases that include an interview. Practitioners can use this 31.4 percent lift to evaluate the impact of oral advocacy. The 332 cases provide the statistical grounding for these observations in Art Unit 2145.
The 1382 median days to allowance acts as a guide for prosecution timelines in Tech Center 2800. With an allowance rate of 56.0 percent, the data shows the frequency of successful outcomes. These metrics offer a clear perspective on the examiner's historical performance. The record of resolved cases helps in understanding the procedural environment.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18387702 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18082851 | EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT | Non-Final OA | Intel Corporation |
| 18494808 | Chip-On-Wafer Assembly Containing A Decoupling Capacitor | Non-Final OA | KYOCERA AVX Components Corporation |
| 18067968 | STACKED TRANSISTORS WITH STEPPED CONTACTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18471316 | SEMICONDUCTOR CHIP | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18344860 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18162074 | SUBSTRATE PROCESSING FOR AlN AND GaN POLARITY CONTROL | Non-Final OA | Applied Materials, Inc. |
| 18203654 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18345790 | Transfer of Epitaxial Compound Semiconductor Layers From a Van Der Waals Interface Using Direct Wafer Bonding | Non-Final OA | FUTURE SEMICONDUCTOR BUSINESS, INC. |
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