Tech Center 2800 • Art Units: 2841
This examiner grants 56% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18430032 | RING-TYPE WEARABLE ELECTRONIC DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17960404 | ELECTRONIC DEVICE INCLUDING HEAT RADIATING STRUCTURE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18664489 | RUGGEDIZING APPARATUS AND METHOD FOR ELECTRONIC EQUIPMENT MOUNTED ON SPACECRAFT | Final Rejection | NEC Corporation |
| 18621637 | COVER WINDOW AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18534452 | ELECTRONIC DEVICE | Non-Final OA | Apple Inc. |
| 17589876 | MICRO-OLED DISPLAY MODULE THERMAL MANAGEMENT | Non-Final OA | Meta Platforms Technologies, LLC |
| 17825558 | SOCKETED MEMORY ARCHITECTURE PACKAGE AND METHOD | Final Rejection | Intel Corporation |
| 18476416 | ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR ELECTRONIC APPARATUS | Final Rejection | LENOVO (SINGAPORE) PTE. LTD. |
| 18768217 | Server System Chassis Rear Wall System | Non-Final OA | Dell Products L.P. |
| 18324772 | CHASSIS FOR INSTALLING MULTIPLE COMPUTING ELEMENTS | Final Rejection | PEGATRON CORPORATION |
| 18526545 | ELECTRONIC DEVICE | Non-Final OA | ASUSTEK COMPUTER INC. |
| 18491387 | FASTENER ASSEMBLY TO REMOVABLY FASTEN A RISER CAGE ASSEMBLY TO AN ELECTRONIC DEVICE | Non-Final OA | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
| 18592648 | ELECTRONIC DEVICE AND EXPANSION ASSEMBLY THEREOF | Final Rejection | Wistron Corporation |
| 18081056 | RACK WITH HEAT-DISSIPATION SYSTEM, POWER SUPPLY SYSTEM FOR RACK WITH HEAT-DISSIPATION SYSTEM, AND POWER CONTROL SYSTEM OF RACK HEAT-DISSIPATION SYSTEM | Non-Final OA | CHICONY POWER TECHNOLOGY CO., LTD. |
| 18712163 | Improved Near Field Communication Ring and Manufacturing Method Thereof | Non-Final OA | ARE CON BETEILIGUNGS-GMBH |
| 18076530 | FACILITATING HEAT DISSIPATION AND ELECTROMAGNETIC SHIELDING | Non-Final OA | Continental Automotive Systems, Inc. |
| 18288670 | SERVER | Non-Final OA | XI'AN YEP TELECOM TECHNOLOGY CO., LTD. |
| 18483267 | EXPANDED SCREEN | Non-Final OA | OBDSPACE TECHNOLOGY CO.,LTD |
| 17801302 | LIQUID COOLING PLATE SUITABLE FOR LIQUID COOLING HEAT DISSIPATION OF ELECTRONIC DEVICE, AND HEAT DISSIPATION UNIT | Final Rejection | SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD. |
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