Prosecution Insights
Last updated: April 19, 2026

Examiner: CULBERT, ROBERTS P

Tech Center 2800 • Art Units: 1716 1792 2812

This examiner grants 82% of resolved cases

Performance Statistics

81.5%
Allow Rate
+13.5% vs TC avg
829
Total Applications
-3.6%
Interview Lift
891
Avg Prosecution Days
Based on 809 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
35.1%
§102 Novelty
42.6%
§103 Obviousness
9.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18028808 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE Non-Final OA Mitsubishi Electric Corporation
17553811 POLISHING LIQUID AND CHEMICAL MECHANICAL POLISHING METHOD Non-Final OA FUJIFILM Corporation
18236042 METHODS OF ETCHING SILICON-AND-OXYGEN-CONTAINING FEATURES AT LOW TEMPERATURES Non-Final OA Applied Materials, Inc.
18751858 PELLICLE ASSEMBLY AND METHOD OF MAKING SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18608043 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
18207737 ETCHING METHOD AND PLASMA PROCESSING SYSTEM Final Rejection Tokyo Electron Limited
18027720 SURFACE-MODIFIED SILICA PARTICLES AND COMPOSITIONS COMPRISING SUCH PARTICLES Non-Final OA MERCK PATENT GMBH
18213894 SACRIFICIAL PASSIVATION FILM DEPOSITION METHOD, TRENCH ETCHING METHOD AND SEMICONDUCTOR PROCESSING APPARATUS USING LOW-TEMPERATURE ALD PROCESS Non-Final OA SEMES CO., LTD.
18662672 METHOD FOR ETCHING AN ETCH LAYER Final Rejection Lam Research Corporation
18122961 SULFONIC ACID-MODIFIED COLLOIDAL SILICA Final Rejection FUJIMI INCORPORATED
18216289 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF Final Rejection Fujifilm Electronic Materials U.S.A., Inc.
18239037 CRYOGENIC PLASMA ETCHING USING C2H2F2 Non-Final OA L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
18239041 DIELECTRIC PLASMA ETCHING USING C2H2F2 Non-Final OA L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude
18014406 Control of Processing Equipment Final Rejection University of Exeter
18157006 ETCHANT COMPOSITION OF TITANIUM LAYER AND ETCHING METHOD USING THE SAME Non-Final OA ENF TECHNOLOGY CO., LTD.

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