Prosecution Insights
Last updated: August 18, 2026

Examiner: EOFF, ANCA

Tech Center 1700 • Art Units: 1722 1724 1737 1795 1796

This examiner grants 80% of resolved cases

Performance Statistics

80.0%
Allow Rate
+15.0% vs TC avg
1,292
Total Applications
+11.0%
Interview Lift
984
Avg Prosecution Days
Based on 1253 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
18.8%
§102 Novelty
50.6%
§103 Obviousness
20.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18286612 METHOD FOR FORMING A RESIST PATTERN Non-Final OA NISSAN CHEMICAL CORPORATION
18285141 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION Non-Final OA NISSAN CHEMICAL CORPORATION
18420038 ORGANOMETALLIC COMPOUND, RESIST COMPOSITION INCLUDING THE SAME AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION Non-Final OA Samsung Electronics Co., Ltd.
18527056 PHOTORESIST COMPOSITION INCLUDING PHOTOSENSITIVE POLYMER AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18493192 RESIST COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18439390 METHOD FOR INSPECTING RESIST COMPOSITION, METHOD FOR PRODUCING RESIST COMPOSITION, AND RESIST COMPOSITION Non-Final OA FUJIFILM Corporation
18392245 FLEXOGRAPHIC PRINTING PLATE PRECURSOR AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE Non-Final OA FUJIFILM Corporation
18458609 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Non-Final OA FUJIFILM Corporation
18356701 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN Final Rejection FUJIFILM Corporation
18339622 LAMINATE OF NEGATIVE TONE LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PREPARING NEGATIVE TONE LITHOGRAPHIC PRINTING PLATE Final Rejection FUJIFILM Corporation
18157899 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Final Rejection FUJIFILM Corporation
18213025 NEGATIVE ELECTRODE COMPOSITION, NEGATIVE ELECTRODE FOR LITHIUM SECONDARY BATTERY INCLUDING SAME, LITHIUM SECONDARY BATTERY INCLUDING NEGATIVE ELECTRODE, AND METHOD OF MANUFACTURING NEGATIVE ELECTRODE Non-Final OA LG Energy Solution, LTD.
18030854 CELL MOUNTING JIG FOR PREVENTING DAMAGE TO APPEARANCE OF BATTERY CELL, CELL ALIGNMENT DEVICE AND CELL MOUNTING METHOD Non-Final OA LG ENERGY SOLUTION, LTD.
18003717 ELECTROLYTE FOR LITHIUM BATTERY, AND LITHIUM BATTERY COMPRISING SAME Final Rejection Samsung SDI Co., Ltd.
18248964 Metal Air Battery Non-Final OA NTT, Inc.
18054661 LAYERED ELECTRODE Non-Final OA Rivian IP Holdings, LLC
19070239 RESIST COMPOSITION AND PATTERN FORMING PROCESS Non-Final OA Shin-Etsu Chemical Co., Ltd.
19035087 RESIST COMPOSITION AND PATTERNING PROCESS Non-Final OA Shin-Etsu Chemical Co., Ltd.
18597253 ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS Non-Final OA Shin-Etsu Chemical Co., Ltd.
18539887 RESIST COMPOSITION AND PATTERN FORMING PROCESS Non-Final OA Shin-Etsu Chemical Co., Ltd.
18447164 Composition For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film Final Rejection SHIN-ETSU CHEMICAL CO., LTD.
17970061 MATERIAL FOR FORMING FILLING FILM FOR INHIBITING SEMICONDUCTOR SUBSTRATE PATTERN COLLAPSE, AND METHOD FOR TREATING SEMICONDUCTOR SUBSTRATE Non-Final OA SHIN-ETSU CHEMICAL CO., LTD.
18385563 ADDITIVES FOR METALLIC PHOTORESIST Non-Final OA Taiwan Semiconductor Manufacturing Company Ltd
18204805 METHOD TO OPTIMIZE POST DEPOSITION BAKING CONDITION OF PHOTO RESISTIVE MATERIALS Final Rejection Applied Materials, Inc.
18565554 METHOD FOR USING COMPOSITION COMPRISING ORGANIC ACID COMPOUND, LITHOGRAPHY COMPOSITION COMPRISING ORGANIC ACID COMPOUND, AND METHOD FOR MANUFACTURING RESIST PATTERN Non-Final OA Merck Patent GmbH
18269074 NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION Non-Final OA Merck Patent GmbH
18684046 RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, ACID-GENERATING AGENT, ACID DIFFUSION CONTROL AGENT, AND HIGH-MOLECULAR-WEIGHT COMPOUND Non-Final OA TOKYO OHKA KOGYO CO., LTD.
18566338 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING COMPOUNDS, INTERMEDIATE, AND COMPOUNDS Non-Final OA TOKYO OHKA KOGYO CO., LTD.
18687722 COMPOSITION FOR SPIN-ON CARBON FILM FORMATION, METHOD FOR PRODUCING COMPOSITION FOR SPIN-ON CARBON FILM FORMATION, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMATION METHOD, AND CIRCUIT PATTERN FORMATION METHOD Non-Final OA Mitsubishi Gas Chemical Company, Inc.
18352031 COMPOSITE COVER FOR A BATTERY PACK OR A BATTERY MODULE FOR REDUCING THERMAL PROPAGATION RUNAWAY AND MITIGATING ARCING Non-Final OA GM Global Technology Operations LLC

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