Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1722 1724 1737 1795 1796
This examiner grants 80% of resolved cases
Anca Eoff is an examiner in Tech Center 1700 and Art Unit 1722, with a significant history of 1258 resolved cases. The examiner maintains an 80.0 percent allowance rate, which is quite high and suggests a positive environment for patent applicants. The median days to allowance is 985, providing a benchmark for the expected duration of the prosecution process.
The data indicates a 10.8 percent interview lift, showing that direct engagement with the examiner can be a helpful strategy. While the 80.0 percent allowance rate is already high, the 10.8 percent lift provides an additional boost for cases that might otherwise struggle. Practitioners should consider the 1258 resolved cases as a strong indicator of the examiner's consistent approach to granting patents. The 985-day median timeline is a reasonable duration for successful applications in this art unit.
With such a large number of resolved cases, the examiner's performance metrics are well-established. The 80.0 percent allowance rate and 10.8 percent interview lift offer a clear roadmap for practitioners. By understanding the 985-day median timeline, applicants can better manage their expectations and resources when prosecuting patents in Art Unit 1722.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18420038 | ORGANOMETALLIC COMPOUND, RESIST COMPOSITION INCLUDING THE SAME AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18527056 | PHOTORESIST COMPOSITION INCLUDING PHOTOSENSITIVE POLYMER AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18329976 | ORGANOMETALLIC COMPOUND, RESIST COMPOSITION INCLUDING THE SAME AND PATTERN FORMING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18439390 | METHOD FOR INSPECTING RESIST COMPOSITION, METHOD FOR PRODUCING RESIST COMPOSITION, AND RESIST COMPOSITION | Non-Final OA | FUJIFILM Corporation |
| 18458609 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18356701 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN | Final Rejection | FUJIFILM Corporation |
| 18213025 | NEGATIVE ELECTRODE COMPOSITION, NEGATIVE ELECTRODE FOR LITHIUM SECONDARY BATTERY INCLUDING SAME, LITHIUM SECONDARY BATTERY INCLUDING NEGATIVE ELECTRODE, AND METHOD OF MANUFACTURING NEGATIVE ELECTRODE | Non-Final OA | LG Energy Solution, LTD. |
| 18030854 | CELL MOUNTING JIG FOR PREVENTING DAMAGE TO APPEARANCE OF BATTERY CELL, CELL ALIGNMENT DEVICE AND CELL MOUNTING METHOD | Non-Final OA | LG ENERGY SOLUTION, LTD. |
| 18512626 | METHOD AND SYSTEM FOR CONTROLLING AIR SUPPLY TO FUEL CELL | Non-Final OA | Kia Corporation |
| 18054661 | LAYERED ELECTRODE | Non-Final OA | Rivian IP Holdings, LLC |
| 18411690 | HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18003717 | ELECTROLYTE FOR LITHIUM BATTERY, AND LITHIUM BATTERY COMPRISING SAME | Final Rejection | Samsung SDI Co., Ltd. |
| 18491292 | ELECTROLYTIC SOLUTION, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWERED DEVICE | Final Rejection | CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED |
| 18094415 | BATTERY CELL, BATTERY, POWER CONSUMING APPARATUS, AND METHOD AND APPARATUS FOR MANUFACTURING BATTERY CELL | Final Rejection | CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED |
| 18248964 | Metal Air Battery | Non-Final OA | NTT, Inc. |
| 18526121 | METHOD OF SMOOTHENING PROFILE OF PHOTORESIST | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18385563 | ADDITIVES FOR METALLIC PHOTORESIST | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd |
| 18459077 | PHOTO ACID GENERATOR | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18694200 | PHOTOSENSITIVE COMPOSITION | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18684046 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, ACID-GENERATING AGENT, ACID DIFFUSION CONTROL AGENT, AND HIGH-MOLECULAR-WEIGHT COMPOUND | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18566338 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING COMPOUNDS, INTERMEDIATE, AND COMPOUNDS | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18460104 | RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 19070239 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 19035087 | RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18597253 | ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18539887 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18380454 | Positive Resist Material And Patterning Process | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18450670 | Polymer, Resist Composition, And Patterning Process | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18447164 | Composition For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18352031 | COMPOSITE COVER FOR A BATTERY PACK OR A BATTERY MODULE FOR REDUCING THERMAL PROPAGATION RUNAWAY AND MITIGATING ARCING | Non-Final OA | GM Global Technology Operations LLC |
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