Prosecution Insights
Last updated: May 29, 2026

Examiner: GRAY, AARON J

Tech Center 2800 • Art Units: 2897

This examiner grants 82% of resolved cases

Performance Statistics

82.0%
Allow Rate
+14.0% vs TC avg
538
Total Applications
+30.6%
Interview Lift
899
Avg Prosecution Days
Based on 505 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
6.6%
§102 Novelty
90.7%
§103 Obviousness
1.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18061628 IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME Final Rejection Samsung Electronics Co., Ltd.
18277021 DISPLAY PANELS, DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY PANEL Non-Final OA BOE Technology Group Co., Ltd.
18116401 MICRO LED, MICRO LED PANEL AND MICRO LED CHIP Final Rejection JADE BIRD DISPLAY (SHANGHAI) LIMITED
18257921 SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18252583 SOLID-STATE IMAGING ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18000849 LIGHT-EMITTING DEVICE AND DISPLAY DEVICE HAVING AN ELECTRODE COUPLE ELECTRICALLY CPOUPLING A PLURALITY OF COMMON ELECTRODES Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18314559 INFRARED-RESPONSIVE SENSOR ELEMENT Non-Final OA Microsoft Technology Licensing, LLC
17957181 Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device Non-Final OA Semiconductor Energy Laboratory Co., Ltd.
18453755 SPURIOUS JUNCTION PREVENTION VIA IN-SITU ION MILLING Final Rejection International Business Machines Corporation
18295462 BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING MEDIUM Non-Final OA Tokyo Electron Limited
17876438 APPARATUS AND METHODS FOR EFFECTIVE IMPURITY GETTERING Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18382218 SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN SUBSTRATE Non-Final OA NANYA TECHNOLOGY CORPORATION
18522119 SILICON ON INSULATOR DEVICE Non-Final OA United Microelectronics Corp.
17449975 INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS Non-Final OA ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
18262100 ELECTROSTATIC PROTECTION STRUCTURE AND PREPARATION METHOD THEREFOR Non-Final OA CSMC TECHNOLOGIES FAB2 CO., LTD.

Facing This Examiner?

IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.

Build Your Strategy

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month