Tech Center 2800 • Art Units: 2897
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18061628 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18277021 | DISPLAY PANELS, DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY PANEL | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18022171 | Display Substrate, Preparation Method Therefor, and Electronic Apparatus | Final Rejection | BOE Technology Group Co., Ltd. |
| 18116401 | MICRO LED, MICRO LED PANEL AND MICRO LED CHIP | Final Rejection | JADE BIRD DISPLAY (SHANGHAI) LIMITED |
| 18257921 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18252583 | SOLID-STATE IMAGING ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18314559 | INFRARED-RESPONSIVE SENSOR ELEMENT | Non-Final OA | Microsoft Technology Licensing, LLC |
| 17957181 | Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18453755 | SPURIOUS JUNCTION PREVENTION VIA IN-SITU ION MILLING | Final Rejection | International Business Machines Corporation |
| 17883668 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18295462 | BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 17876438 | APPARATUS AND METHODS FOR EFFECTIVE IMPURITY GETTERING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18306517 | DEEP TRENCH ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR AND METHODS THEREOF | Non-Final OA | OMNIVISION TECHNOLOGIES, INC. |
| 18223780 | SELF-PROTECTED ELECTROSTATIC DISCHARGE PROTECTION DEVICES | Non-Final OA | GlobalFoundries U.S. Inc. |
| 17844076 | NON-VOLATILE MEMORY HAVING L SHAPED DIELECTRIC LAYER | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17449975 | INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18262100 | ELECTROSTATIC PROTECTION STRUCTURE AND PREPARATION METHOD THEREFOR | Non-Final OA | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| 18296458 | MULTIPLE DISTRIBUTED BRAGG REFLECTOR PIXEL ARRAY | Non-Final OA | Avalon Holographics Inc. |
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