Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1714 1716 1718 2837 2896
This examiner grants 33% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18447479 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18239176 | SYSTEM AND APPARATUS FOR A REACTION CHAMBER | Non-Final OA | ASM IP Holding B.V. |
| 18129932 | GAS-DELIVERY ASSEMBLY AND REACTOR SYSTEM INCLUDING SAME | Final Rejection | ASM IP Holding B.V. |
| 17897461 | SUBSTRATE PROCESSING APPARATUS INCLUDING IMPEDANCE ADJUSTER | Non-Final OA | ASM IP Holding B.V. |
| 18454234 | PIPING, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18740007 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18383673 | CONTROL METHOD OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18231278 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18364010 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18275359 | FILM FORMING DEVICE AND FILM FORMING METHOD | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18359783 | APPARATUS AND METHOD FOR PLASMA PROCESSING | Non-Final OA | Tokyo Electron Limited |
| 17747861 | PLASMA PROCESSING APPARATUS | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18447533 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18087216 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 17973985 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD | Final Rejection | SEMES CO., LTD. |
| 18013429 | MOVABLE DISK WITH APERTURE FOR ETCH CONTROL | Non-Final OA | LAM RESEARCH CORPORATION |
| 17927297 | ATOMIC LAYER DEPOSITION COATED POWDER COATING FOR PROCESSING CHAMBER COMPONENTS | Final Rejection | Lam Research Corporation |
| 17924354 | MID-CHAMBER FLOW OPTIMIZER | Final Rejection | Lam Research Corporation |
| 18476507 | SILICON CARBIDE WAFER MANUFACTURING APPARATUS | Non-Final OA | MIRISE Technologies Corporation |
| 18367759 | SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES | Non-Final OA | INTEVAC, INC. |
| 18262048 | SIC SINGLE-CRYSTAL GROWTH APPARATUS | Non-Final OA | SEC CARBON, Ltd. |
| 18354022 | FOCUS RING AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | HANA MATERIALS INC. |
| 17927877 | PLASMA ETCHING SYSTEM AND FARADAY SHIELDING APPARATUS WHICH CAN BE USED FOR HEATING | Non-Final OA | BEIJING LEUVEN SEMICONDUCTOR TECHNOLOGY CO. LTD |
| 17775427 | SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE | Non-Final OA | HANWHA PRECISION MACHINERY CO., LTD. |
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