Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1714 1716 1718 2837 2896
This examiner grants 33% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18235653 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18447479 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18239176 | SYSTEM AND APPARATUS FOR A REACTION CHAMBER | Final Rejection | ASM IP Holding B.V. |
| 18447810 | METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18366074 | BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJUSTMENT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18975419 | RECOMBINATION CHANNELS FOR ANGLE CONTROL OF NEUTRAL REACTIVE SPECIES | Final Rejection | Applied Materials, Inc. |
| 18366433 | CHAMBER COMPONENT FOR IMPROVED CLEANING EFFICIENCY | Final Rejection | Applied Materials, Inc. |
| 18088417 | Metallic Shield For Stable Tape-Frame Substrate Processing | Final Rejection | Applied Materials, Inc. |
| 18454234 | PIPING, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18581954 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18383673 | CONTROL METHOD OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18380776 | SYSTEMS AND METHODS FOR IMPROVING PLANARITY USING SELECTIVE ATOMIC LAYER ETCHING (ALE) | Final Rejection | Tokyo Electron Limited |
| 18237409 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18231278 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18359783 | APPARATUS AND METHOD FOR PLASMA PROCESSING | Final Rejection | Tokyo Electron Limited |
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