Prosecution Insights
Last updated: October 02, 2026

Examiner: KENDALL, BENJAMIN R

Tech Center 2800 • Art Units: 1714 1716 1718 2837 2896

This examiner grants 33% of resolved cases

Analysis

Benjamin R Kendall works in Tech Center 2800 and Art Unit 1714. He has 488 resolved cases. The allowance rate pct is 33.4. This 33.4 allowance rate pct provides a measure of the outcomes for applications on his docket. The 488 resolved cases serve as a basis for evaluating prosecution in Art Unit 1714.

The interview lift pct is 21.5. This 21.5 interview lift pct indicates the correlation between conducting an interview and the probability of an allowance. Practitioners can use the 21.5 figure when deciding whether to engage in verbal advocacy with the examiner. This metric is a component of the data for Tech Center 2800.

The median days to allowance is 1437. This 1437 median days to allowance represents the time required for an application to reach a grant. The 1437 figure is a timeline for the prosecution process from filing to resolution. These metrics provide a view of the examiner's history across the 488 resolved cases.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

33.4%
Allow Rate
-34.6% vs TC avg
526
Total Applications
+21.5%
Interview Lift
1437
Avg Prosecution Days
Based on 488 resolved cases, 2023–2026

Rejection Statute Breakdown

1.1%
§101 Eligibility
10.4%
§102 Novelty
64.0%
§103 Obviousness
22.9%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18235653 SUBSTRATE PROCESSING APPARATUS Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18447479 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18239176 SYSTEM AND APPARATUS FOR A REACTION CHAMBER Non-Final OA ASM IP Holding B.V.
18351227 FLOW CONTROL ARRANGEMENTS WITH ENCLOSED FLOW SWITCHES AND ISOLATION VALVES, SEMICONDUCTOR PROCESSING SYSTEMS, AND FLOW CONTROL METHODS Non-Final OA ASM IP Holding, B.V.
18129932 GAS-DELIVERY ASSEMBLY AND REACTOR SYSTEM INCLUDING SAME Non-Final OA ASM IP Holding B.V.
18578100 Equipment For Manufacturing Light-Emitting Device Non-Final OA Semiconductor Energy Laboratory Co., Ltd.
18454234 PIPING, SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Final Rejection Kioxia Corporation
17917547 SUBSTRATE PROCESSING DEVICE AND METHOD Final Rejection JUSUNG ENGINEERING CO., LTD.
19206157 Vacuum arrangement and method Non-Final OA VON ARDENNE Asset GmbH & Co. KG
18010423 OPTIMIZING EDGE RADICAL FLUX IN A DOWNSTREAM PLASMA CHAMBER Non-Final OA LAM RESEARCH CORPORATION
18407368 PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR DEVICE USING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18975419 RECOMBINATION CHANNELS FOR ANGLE CONTROL OF NEUTRAL REACTIVE SPECIES Non-Final OA Applied Materials, Inc.
18206852 ICP SOURCE GAS DELIVERY HUB AND NOZZLE Non-Final OA Applied Materials, Inc.
17961553 HALOGEN-RESISTANT THERMAL BARRIER COATING FOR PROCESSING CHAMBERS Non-Final OA Applied Materials, Inc.
18581954 SUBSTRATE PROCESSING APPARATUS Non-Final OA Tokyo Electron Limited
18524015 SUBSTRATE PROCESSING APPARATUS, PLASMA MEASUREMENT METHOD, AND PLASMA REGULATION METHOD Non-Final OA Tokyo Electron Limited
18380776 SYSTEMS AND METHODS FOR IMPROVING PLANARITY USING SELECTIVE ATOMIC LAYER ETCHING (ALE) Non-Final OA Tokyo Electron Limited
18237409 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
18231278 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
18359783 APPARATUS AND METHOD FOR PLASMA PROCESSING Non-Final OA Tokyo Electron Limited
17747861 PLASMA PROCESSING APPARATUS Non-Final OA TOKYO ELECTRON LIMITED
18447533 SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM Final Rejection Kokusai Electric Corporation
18097232 ANTENNA MEMBER AND APPARATUS AND METHOD FOR TREATING SUBSTRATE Final Rejection SEMES CO., LTD.

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