Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2892 2897
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18397354 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18509685 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD |
| 18499117 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18489886 | SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18489649 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18089476 | THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA | Non-Final OA | Intel Corporation |
| 18216432 | INTERCONNECT CAPPING WITH INTEGRATED PROCESS STEPS | Non-Final OA | Applied Materials, Inc. |
| 18512939 | Semiconductor module having a double-sided heat dissipation structure and A Method for fabricating the same | Non-Final OA | LX SEMICON CO., LTD. |
| 18509010 | BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18497482 | BACK BARRIER INTEGRATION SCHEME FOR GAN DEVICES | Non-Final OA | STMicroelectronics International N.V. |
| 18511334 | BACKSIDE CONTACT WITH STRAIGHT PROFILE | Non-Final OA | International Business Machines Corporation |
| 18158505 | BACKSIDE CONTACT WITH CONTACT JUMPER FOR STACKED FET | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18393771 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | United Microelectronics Corp. |
| 18153375 | CAPACITOR STRUCTURE | Final Rejection | Powerchip Semiconductor Manufacturing Corporation |
| 18510756 | ENHANCED ISOLATION FOR ON-CHIP CURRENT SENSORS | Non-Final OA | Wolfspeed, Inc. |
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