Prosecution Insights
Last updated: October 02, 2026

Examiner: LOPEZ, JORGE ANDRES

Tech Center 2800 • Art Units: 2892 2897

This examiner grants 92% of resolved cases

Analysis

Jorge Andres Lopez has resolved 38 cases in Tech Center 2800 and Art Unit 2892. The examiner's allowance rate is 92.1 percent, and the median days to allowance is 1262. These figures provide a benchmark for expected outcomes and pendency. The 1262-day figure is a metric for practitioners to use when managing prosecution timelines. The 92.1 percent rate indicates the likelihood of an application being allowed once it reaches a final resolution.

The interview lift of 10.7 percent indicates that interviews are associated with an increase in the probability of allowance relative to the 92.1 percent baseline. This lift suggests that direct engagement can be a factor in securing an allowance. Practitioners should consider the 10.7 percent lift when managing the 1262-day median pendency. The 38 resolved cases provide the statistical foundation for these metrics. These figures offer a clear view of the prosecution landscape for this examiner.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

92.1%
Allow Rate
+24.1% vs TC avg
71
Total Applications
+10.7%
Interview Lift
1262
Avg Prosecution Days
Based on 38 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
20.8%
§102 Novelty
68.0%
§103 Obviousness
11.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18499117 INTEGRATED CIRCUIT DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18512939 Semiconductor module having a double-sided heat dissipation structure and A Method for fabricating the same Non-Final OA LX SEMICON CO., LTD.
18513734 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18089476 THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA Non-Final OA Intel Corporation
18509010 BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METHODS FOR FORMING THE SAME Non-Final OA WESTERN DIGITAL TECHNOLOGIES, INC.,
18511334 BACKSIDE CONTACT WITH STRAIGHT PROFILE Non-Final OA International Business Machines Corporation
18404345 BACKSIDE CONTACT RESISTANCE REDUCTION Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18216432 INTERCONNECT CAPPING WITH INTEGRATED PROCESS STEPS Non-Final OA Applied Materials, Inc.
18510756 ENHANCED ISOLATION FOR ON-CHIP CURRENT SENSORS Non-Final OA Wolfspeed, Inc.
18393771 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA United Microelectronics Corp.

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