Tech Center 2800 • Art Units: 2897
This examiner grants 96% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18374792 | FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18369258 | SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE ANTIOXIDANT LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18462610 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18374924 | SEMICONDUCTOR STRUCTURE WITH PLACEHOLDER POSITION MARGIN | Non-Final OA | International Business Machines Corporation |
| 18227128 | LIFT FRAMES FOR CENTRAL HEATING, AND RELATED PROCESSING CHAMBERS AND METHODS | Non-Final OA | Applied Materials, Inc. |
| 17975662 | ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FORMING THEREOF | Non-Final OA | Intel Corporation |
| 18046635 | PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS | Non-Final OA | Intel Corporation |
| 17958281 | DESIGN OF VOLTAGE CONTRAST PROCESS MONITOR | Non-Final OA | Intel Corporation |
| 18459103 | SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18181100 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18489853 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18037395 | WIRELESSLY POWERED ELECTRIC ACTUATION OF PARTICLES AND MOLECULES | Non-Final OA | REGENTS OF THE UNIVERSITY OF MINNESOTA |
| 18458833 | DISPLAY PANEL | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18153375 | CAPACITOR STRUCTURE | Final Rejection | Powerchip Semiconductor Manufacturing Corporation |
| 17983400 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Turning Point Lasers Corporation |
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