Tech Center 2800 • Art Units: 2816 2823 2899
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18332149 | FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE GROWN MATERIALS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18320013 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DEVIATION | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17781013 | METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18148231 | METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH VOLTAGE ELECTRIC FIELD REQUIREMENTS | Final Rejection | Texas Instruments Incorporated |
| 18058705 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18134966 | POWER MODULE | Non-Final OA | Kia Corporation |
| 18136970 | HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS | Non-Final OA | Applied Materials, Inc. |
| 18187738 | TOP VIA INTERCONNECT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18518196 | PHYSICAL UNCLONABLE FUNCTIONS WITH COPPER-SILICON OXIDE PROGRAMMABLE METALLIZATION CELLS | Non-Final OA | ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY |
| 17573461 | LOW VIA RESISTANCE INTERCONNECT STRUCTURE | Final Rejection | QUALCOMM Incorporated |
| 18361622 | LEAKAGE REDUCTION METHODS AND STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18135799 | METHOD TO REDUCE BENDING OF FEATURES ON A SURFACE OF A SUBSTRATE AND STRUCTURE FORMED USING SAME | Non-Final OA | ASM IP Holding B.V. |
| 18237510 | INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18372712 | METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18320235 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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