Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2823 2899
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18332149 | FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE GROWN MATERIALS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18320013 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DEVIATION | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18301403 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18148231 | METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH VOLTAGE ELECTRIC FIELD REQUIREMENTS | Final Rejection | Texas Instruments Incorporated |
| 18135799 | METHOD TO REDUCE BENDING OF FEATURES ON A SURFACE OF A SUBSTRATE AND STRUCTURE FORMED USING SAME | Non-Final OA | ASM IP Holding B.V. |
| 18187738 | TOP VIA INTERCONNECT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18136970 | HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS | Non-Final OA | Applied Materials, Inc. |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17729119 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18144952 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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