Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2816 2823 2899
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18545136 | BONDED STRUCTURES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17729119 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18148231 | METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH VOLTAGE ELECTRIC FIELD REQUIREMENTS | Non-Final OA | Texas Instruments Incorporated |
| 18513303 | REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY | Non-Final OA | Micron Technology, Inc. |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18649541 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18430017 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18424246 | SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18511016 | THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18672546 | CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18136970 | HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS | Final Rejection | Applied Materials, Inc. |
| 18187738 | TOP VIA INTERCONNECT | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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