Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2816 2823 2899
This examiner grants 92% of resolved cases
Examiner PARKER, JOHN M is assigned to Art Unit 2811 within Tech Center 2800. The data shows that the examiner has 859 resolved cases, with an allowance rate of 92.1 percent. This 92.1 percent allowance rate serves as a baseline for applicants during the examination process. The 859 resolved cases provide a record of the examiner's work in Art Unit 2811. These figures establish the prosecution environment for this unit.
The median days to allowance for successful applications is 813. An interview lift of 0.9 percent is recorded, which indicates the change in the probability of allowance following an interview. Practitioners can use this 0.9 percent lift to evaluate the impact of communication. The 813 median days to allowance helps in planning the prosecution timeline. The metrics are derived from the examiner's professional history in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18435628 | UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY | Non-Final OA | Lodestar Licensing Group LLC |
| 18605019 | DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT | Non-Final OA | Infineon Technologies AG |
| 17729119 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18513303 | REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY | Non-Final OA | Micron Technology, Inc. |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18648884 | BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18649541 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18785934 | Spacers for Semiconductor Devices Including Backside Power Rails | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18782335 | AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18641764 | SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18784583 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH BOTTOM SELF-ALIGNED VIA LANDING | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18757668 | THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18136970 | HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS | Final Rejection | Applied Materials, Inc. |
| 18780208 | ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
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