Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 97% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18173847 | INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHODS OF FORMING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18369928 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 17966034 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18453341 | SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17889615 | SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES | Non-Final OA | International Business Machines Corporation |
| 17891530 | LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES | Non-Final OA | Intel Corporation |
| 18311890 | SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18560177 | Semiconductor Die with a Vertical Power Transistor Device | Non-Final OA | Infineon Technologies Austria AG |
| 18484156 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES FOR BACKSIDE VIA STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18008851 | HIGH DIELECTRIC FILMS AND SEMICONDUCTOR OR CAPACITOR DEVICES COMPRISING SAME | Final Rejection | The Industry & Academic Cooperation in Chungnam National University (IAC) |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy