Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2897
This examiner grants 97% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18593300 | CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18469970 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 17966034 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18455447 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND ELECTRONIC APPARATUS | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17891055 | THREE-DIMENSIONAL MEMORY DEVICES, SYSTEMS, AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18471715 | INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES | Non-Final OA | President and Fellows Of Harvard College |
| 18338088 | MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 17828356 | THROUGH WAFER TRENCH ISOLATION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18321281 | IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18398243 | EMBEDDED ACTIVE CHIP WITHIN INTERPOSER | Non-Final OA | International Business Machines Corporation |
| 17889615 | SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES | Final Rejection | International Business Machines Corporation |
| 18313425 | STRUCTURE AND METHOD FOR POWER METAL LINES | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18161710 | LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE HAVING THE SAME, AND APPARATUS HAVING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
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