Tech Center 1700 • Art Units: 1723 1756 1759 1788 1795
This examiner grants 54% of resolved cases
Stefanie S. Wittenberg is an examiner in Tech Center 1700 and Art Unit 1723. She has 693 resolved cases with an allowance rate of 54.4 percent. This 54.4 percent rate indicates the proportion of applications that reach issuance under her review. The median days to allowance of 1131 provides a timeline for the duration of the prosecution process for successful cases. Practitioners should use this timing metric to plan their patent strategy and manage expectations in Tech Center 1700.
The interview lift of 17.8 percent suggests that conducting an interview provides a measurable increase in the probability of a grant. This 17.8 percent lift is a metric for practitioners deciding whether to engage in direct communication with the examiner to resolve rejections. With 693 resolved cases, the data reflects a consistent examination history. The median days to allowance of 1131 is a useful figure for managing the expected timeline of a patent application. Utilizing the interview process can be a helpful component for navigating Art Unit 1723.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18408821 | FILM FORMING APPARATUS FOR METAL FILM | Non-Final OA | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18488303 | WATER ELECTROLYSIS CELL STACK AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18466334 | WATER ELECTROLYSIS SYSTEM | Final Rejection | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18550569 | SOLID-ELECTROLYTE-TYPE ELECTROLYZER AND METHOD FOR MAINTAINING SAME | Non-Final OA | IDEMITSU KOSAN CO.,LTD. |
| 18318757 | CARBON DIOXIDE RECOVERY SYSTEM | Non-Final OA | DENSO CORPORATION |
| 17995243 | ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS | Final Rejection | Lam Research Corporation |
| 18200939 | SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18483957 | ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER | Non-Final OA | Applied Materials, Inc. |
| 18160109 | SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS | Final Rejection | Applied Materials, Inc. |
| 18311838 | METHANE ACTIVATION SYSTEMS AND RELATED ELECTROCHEMICAL APPARATUSES | Final Rejection | Battelle Energy Alliance, LLC |
| 17923080 | PLATING APPARATUS | Non-Final OA | EBARA CORPORATION |
| 18280811 | METHOD FOR REMOVING FERRIC IONS FROM SULFATE-BASED IRON ELECTROPLATING SOLUTION | Final Rejection | POSCO CO., LTD |
| 18266889 | Reversible Electrochemical Mirror (REM) | Non-Final OA | Nanyang Technological University |
| 18557948 | SOLID OXIDE ELECTROCHEMICAL CELL AND METHOD FOR PRODUCING SAME | Non-Final OA | KYOTO UNIVERSITY |
| 18626331 | REACTION CHAMBER COMPONENT, PREPARATION METHOD, AND REACTION CHAMBER | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
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