Tech Center 1700 • Art Units: 1756 1759 1795
This examiner grants 54% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17876477 | METHOD FOR MANUFACTURING ALUMINIUM ALLOY SHEET AND ELECTRONIC DEVICE INCLUDING SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18308716 | GAS RECOVERY SYSTEM | Non-Final OA | DENSO CORPORATION |
| 18308713 | GAS ADSORPTION SYSTEM AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | DENSO CORPORATION |
| 18168486 | PLATING APPARATUS | Final Rejection | EBARA CORPORATION |
| 18017645 | LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS | Final Rejection | EBARA CORPORATION |
| 17923080 | PLATING APPARATUS | Final Rejection | EBARA CORPORATION |
| 18200939 | SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17993398 | ELECTROLYSIS METHODS THAT UTILIZE CARBON DIOXIDE FOR MAKING COATED NANOCARBON ALLOTROPES | Final Rejection | C2CNT LLC |
| 17945759 | LITHIUM EXTRACTION THROUGH PULSED ELECTROCHEMICAL INTERCALATION METHOD | Non-Final OA | The Board of Trustees of the Leland Stanford Junior University |
| 18267130 | Method for Depositing a Bronze Alloy on a Printed Circuit and Printed Circuit Obtained by Said Method | Non-Final OA | Linxens Holding |
| 17971108 | SYSTEM AND METHOD FOR FORMING A NOZZLE INLET OF A NOZZLE | Non-Final OA | Pratt & Whitney Canada Corp. |
| 19097983 | ELECTROLYTE FOR FORMING ANODIC OXIDE FILM, METHOD OF FORMING ANODIC OXIDE FILM, AND ANODIC OXIDE FILM AND MEMBER FOR SEMICONDUCTOR DEVICE MANUFACTURED THEREBY | Non-Final OA | KoMiCo Ltd. |
| 18251770 | A WATER ELECTROLYZER SYSTEM | Non-Final OA | NATIONAL UNIVERSITY OF SINGAPORE |
| 18962461 | Electrolytic Cell with Electrically Neutral and Conductive Sieve | Final Rejection | ClassOne Technology |
| 17995243 | ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS | Non-Final OA | Lam Research Corporation |
| 17660186 | ELECTROFORMED HEAT EXCHANGER WITH EMBEDDED PULSATING HEAT PIPE | Final Rejection | Raytheon Company |
| 18305973 | ELECTROLYTIC ADDITIVE MANUFACTURING SYSTEM | Non-Final OA | Seagate Technology LLC |
| 17661430 | NON-ELECTROLYTIC DEPOSITION OF ELECTRODE FOR PULSED ELECTROCHEMICAL MACHINING | Final Rejection | Rolls-Royce Corporation |
| 18226130 | MICROSTRUCTURAL SURFACE INCORPORATION OF PHASE CHANGE MATERIALS FOR THERMAL MANAGEMENT | Non-Final OA | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY |
| 17938679 | NON-MEMBRANE DEIONIZATION AND ION-CONCENTRATING APPARATUS AND NON-MEMBRANE DEIONIZATION AND ION-CONCENTRATING MODULE | Final Rejection | NATIONAL TSING HUA UNIVERSITY |
| 18254783 | PLATING APPARATUS AND PLATING METHOD | Non-Final OA | ACM RESEARCH (SHANGHAI), INC. |
| 17907053 | PLATING APPARATUS AND PLATING METHOD | Final Rejection | ACM Research (Shanghai) Inc. |
| 18731640 | APPARATUS AND METHODS FOR CONTROLLED ELECTROCHEMICAL SURFACE MODIFICATION | Final Rejection | Manufacturing Systems Limited |
| 17436745 | COPPER ELECTROWINNING PROCESS | Final Rejection | UMICORE |
| 18704222 | DEVICE AND METHOD FOR ELECTROLYTIC TREATMENT OF SUBSTRATES | Non-Final OA | MECO EQUIPMENT ENGINEERS B.V. |
| 18061048 | FOULANT RESISTANT SURFACES FOR PHASE CHANGE HEAT | Non-Final OA | UChicago Argonne, LLC |
| 18162971 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS | Final Rejection | Rohm and Haas Electronic Materials LLC |
| 18266796 | THREE-DIMENSIONAL PRINTING DEVICE USING SELECTIVE ELECTROCHEMICAL DEPOSITION | Non-Final OA | ANYCASTING CO., LTD. |
| 18037157 | PLATING DEVICE | Non-Final OA | MITOMO SEMICON ENGINEERING CO., LTD. |
| 18132246 | APPARATUS FOR MANUFACTURING COPPER FOIL | Non-Final OA | SK NEXILIS CO., LTD. |
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