Prosecution Insights
Prosecution Insights
7 pending office actions • 3 art units • 7 examiners • 0 of 7 (0%) have an AI response strategy ready • 3 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 2 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 3 (43%) |
| §102 only | 1 (14%) |
| Multi-statute (no §101) | 3 (43%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| GOODLING, DEVIN KIRK | 1 | — | — |
| NGUYEN, HOAI AN D | 1 | 86.0% | +11.8% |
| PUNCHBEDDELL, SEYON ALI-SIMAH | 1 | 77.5% | +5.6% |
| AHMAD, KHAJA | 1 | 81.0% | +26.0% |
| ROLAND, CHRISTOPHER M | 1 | 64.9% | +21.5% |
| LEE, ALEXANDER N | 1 | 75.2% | +11.5% |
| VU, HUNG K | 1 | 87.6% | +9.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18363645 | SEMICONDUCTOR PACKAGE STRUCTURE | VU, HUNG K | 38d overdue |
| 18757416 | SEMICONDUCTOR PACKAGE AND METHOD FOR IDENTIFYING INTEGRATED CIRCUIT LAYERS IN STACK | NGUYEN, HOAI AN D | 70d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18642563 | HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME | PUNCHBEDDELL, SEYON ALI-SIMAH | — |
| 18638705 | SEMICONDUCTOR PACKAGE STRUCTURE | AHMAD, KHAJA | — |
| 18509259 | STITCHING METHOD FOR EXPOSURE PROCESS | LEE, ALEXANDER N | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18757416 | SEMICONDUCTOR PACKAGE AND METHOD FOR IDENTIFYING INTEGRATED CIRCUIT LAYERS IN STACK | NGUYEN, HOAI AN D | 70d |
| 18638705 | SEMICONDUCTOR PACKAGE STRUCTURE | AHMAD, KHAJA | — |
| 18583156 | PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PACKAGE SUBSTRATE | ROLAND, CHRISTOPHER M | — |
| 18509259 | STITCHING METHOD FOR EXPOSURE PROCESS | LEE, ALEXANDER N | — |
| Art Unit | Apps |
|---|---|
| 2858 | 1 |
| 2893 | 1 |
| 2897 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18777444 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | GOODLING, DEVIN KIRK | — | §103 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18757416 | SEMICONDUCTOR PACKAGE AND METHOD FOR IDENTIFYING INTEGRATED CIRCUIT LAYERS IN STACK | NGUYEN, HOAI AN D | 2858 | §102 | Non-Final OA | 70d | Pending | Jun 27, 2024 |
| 18642563 | HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME | PUNCHBEDDELL, SEYON ALI-SIMAH | — | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18638705 | SEMICONDUCTOR PACKAGE STRUCTURE | AHMAD, KHAJA | — | §102§103 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18583156 | PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PACKAGE SUBSTRATE | ROLAND, CHRISTOPHER M | 2893 | §103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18509259 | STITCHING METHOD FOR EXPOSURE PROCESS | LEE, ALEXANDER N | — | §103§112 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18363645 | SEMICONDUCTOR PACKAGE STRUCTURE | VU, HUNG K | 2897 | §103 | Final Rejection | 38d overdue | Pending | Aug 01, 2023 |
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