Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2812 2897
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18533049 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND OPERATING METHOD THEREOF | Non-Final OA | LG ELECTRONICS INC. |
| 18606436 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18454206 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18701352 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18646240 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18529575 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18128848 | 2D FILLERS FOR REDUCED CTE FOR PID | Non-Final OA | Intel Corporation |
| 18090420 | REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS | Non-Final OA | Intel Corporation |
| 18085106 | LAYER TRANSFER DIODE OR THIN-FILM RESISTOR FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY | Non-Final OA | Intel Corporation |
| 18456467 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF AND MEMORY SYSTEMS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18657067 | IC MODULE AND METHOD FOR MANUFACTURING IC MODULE | Non-Final OA | TOPPAN HOLDINGS INC. |
| 18419908 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18236556 | METAL SILICIDE IN INTEGRATION OF MEMORY ARRAY WITH PERIPHERY | Final Rejection | Micron Technology, Inc. |
| 18757882 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18235391 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18449348 | DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18529948 | CONDUCTIVE FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18621018 | POWER RAIL IN STACKED FET DEVICES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18131929 | LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR DIE-TO-PACKAGE FAN OUT | Final Rejection | NXP B.V. |
| 18710303 | ARRANGEMENT AND METHOD FOR TESTING OPTOELECTRONIC COMPONENTS | Non-Final OA | ams-OSRAM International GmbH |
| 18701384 | SYSTEM AND METHOD FOR CARBON PLUG FORMATION | Non-Final OA | Lam Research Corporation |
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