Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2812 2897
This examiner grants 88% of resolved cases
Hung K Vu is assigned to Tech Center 2800 and Art Unit 2811. The examiner has 1018 resolved cases. The allowance rate is 87.6 percent. This is a very high rate, indicating that most applications reaching a resolution are granted. Practitioners can approach prosecution with this examiner with a high degree of confidence in the probability of success.
The interview lift is 9.4 percent. This positive lift suggests that interviews can further improve the 87.6 percent allowance rate. Practitioners should consider this approach to resolve any remaining issues and potentially expedite the allowance process. The data indicates that the examiner is generally receptive to arguments in Art Unit 2811, even without an interview.
The median days to allowance is 913. This timeframe is relatively short, reflecting an efficient prosecution process. With 1018 resolved cases, the examiner's data shows a consistent approach in Tech Center 2800. This combination of a high allowance rate and fast pendency is beneficial for applicants seeking timely patent protection.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18606436 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18430288 | MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18701352 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18761639 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18646240 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18529575 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18419908 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18090420 | REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS | Non-Final OA | Intel Corporation |
| 18067031 | INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES | Final Rejection | Intel Corporation |
| 17955269 | RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE | Final Rejection | Intel Corporation |
| 17846153 | PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES | Final Rejection | Intel Corporation |
| 18710303 | ARRANGEMENT AND METHOD FOR TESTING OPTOELECTRONIC COMPONENTS | Non-Final OA | ams-OSRAM International GmbH |
| 18701384 | SYSTEM AND METHOD FOR CARBON PLUG FORMATION | Non-Final OA | Lam Research Corporation |
| 18757882 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18519452 | POWER PERFORMANCE AREA ATTRACTIVE MULTIPLE TRANSISTOR ANTI-FUSE BIT CELL LAYOUT STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18449348 | DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18606495 | PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18606497 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18529948 | CONDUCTIVE FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 19277309 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY CELLS | Non-Final OA | Monolithic 3D Inc. |
| 18451923 | DIVIDING METHOD OF WAFER | Non-Final OA | DISCO CORPORATION |
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