Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2897
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18454206 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 19277309 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY CELLS | Non-Final OA | Monolithic 3D Inc. |
| 18239882 | ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18289099 | Display Substrate and Display Device | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17781912 | SEMICONDUCTOR ELEMENT AND ELECTRONIC APPARATUS | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18066513 | CONTROLLABLE QUBIT DEVICE WITH A SINGLE JOSEPHSON JUNCTION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18089908 | INTEGRATED CIRCUIT STRUCTURES HAVING STACKED ELECTROSTATIC DISCHARGE (ESD) FOR BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 17955269 | RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE | Non-Final OA | Intel Corporation |
| 17846153 | PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES | Non-Final OA | Intel Corporation |
| 18236556 | METAL SILICIDE IN INTEGRATION OF MEMORY ARRAY WITH PERIPHERY | Final Rejection | Micron Technology, Inc. |
| 18235391 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18449348 | DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18296182 | THREE-DIMENSIONAL MEMORY DEVICES | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18513116 | STRESS LINERS IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18153532 | Semiconductor Device and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18131929 | LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR DIE-TO-PACKAGE FAN OUT | Final Rejection | NXP B.V. |
| 18505458 | GAN POWER DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | PEKING UNIVERSITY |
| 18396816 | SEMICONDUCTOR DEVICE HAVING AT LEAST ONE AIR GAP AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18363645 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | AP MEMORY TECHNOLOGY CORPORATION |
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