Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1737 2898
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18763547 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18469743 | HARD MASK AND SEMICONDUCTOR DEVICE COMPRISING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18452919 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18727637 | Display Substrate and Display Device | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18519621 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, WEARABLE DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18529848 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18769246 | AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18437569 | DISTINGUISHED FLIP CHIP PACKAGING FOR STRESS RELAXATION AND ENHANCED EM PROTECTION | Non-Final OA | Applied Materials, Inc. |
| 18640770 | MEMORY CHIP STACK HYBRID BONDED TO A PROCESS CHIP | Non-Final OA | International Business Machines Corporation |
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