Prosecution Insights
Last updated: May 29, 2026

Examiner: AHMAD, KHAJA

Tech Center 2800 • Art Units: 2800 2813

This examiner grants 81% of resolved cases

Performance Statistics

80.9%
Allow Rate
+12.9% vs TC avg
976
Total Applications
+26.6%
Interview Lift
853
Avg Prosecution Days
Based on 933 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
10.8%
§102 Novelty
86.0%
§103 Obviousness
0.9%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18515009 CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18471583 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18479006 INTEGRATED CIRCUIT DEVICE WITH FERROELECTRIC CAPACITOR Non-Final OA Texas Instruments Incorporated
18361997 SEMICONDUCTOR DEVICE WITH GATE ELECTRICAL CONTACT FORMING JUNCTIONS HAVING DIFFERENT ENERGY BARRIER HEIGHTS TO GATE LAYER Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18351308 MAGNETIC DEVICE HAVING PLURALITY OF COUPLED MAGNETIC TUNNEL JUNCTION PILLARS Final Rejection Katholieke Universiteit Leuven
18510287 ELECTRONIC DEVICE Non-Final OA SAMSUNG DISPLAY CO., LTD.
18463417 FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND SWITCH CIRCUIT Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
18073576 LIGHT EMITTING DEVICE Final Rejection Innolux Corporation
18540104 LIGHT EMITTING UNIT AND LENS UNIT Non-Final OA NICHIA CORPORATION
18176987 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Toshiba Electronic Devices & Storage Corporation
18204009 TRIAC GATE DESIGN FOR COMMUTATION SENSITIVITY TRADE OFF IMPROVEMENT Non-Final OA STMicroelectronics International N.V.
18338984 MEMORY DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18741376 METHOD OF MANUFACTURING A FIELD EFFECT TRANSDUCER Final Rejection Analog Devices, Inc.
18240685 CIRCUIT BOARD Final Rejection SAMSUNG ELECTRO-MECHANICS CO., LTD.
18511547 ELECTRONIC DEVICE Non-Final OA Renesas Electronics Corporation
18345270 STACKED LED CHIPS Non-Final OA CreeLED, Inc.
18174462 HEMT DEVICE AND MANUFACTURING PROCESS THEREOF Non-Final OA STMICROELECTRONICS S.r.l.
18121782 METAL STACK WITH PHONON SCATTERING LAYER THAT FORMS A NON-OHMIC CONTACT TO A SEMICONDUCTOR LAYER Final Rejection Wolfspeed, Inc.
18175231 Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices Non-Final OA Wolfspeed, Inc.
18468957 Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps Final Rejection STATS ChipPAC Pte. Ltd.
18270464 PHOTOELECTRIC CONVERSION ELEMENT MATERIAL, METHOD FOR PRODUCING PHOTOELECTRIC CONVERSION ELEMENT MATERIAL, AND INK IN WHICH SEMICONDUCTOR NANOPARTICLES ARE DISPERSED Final Rejection UNIVERSITY INDUSTRY FOUNDATION, YONSEI UNIVERSITY

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