Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811 2813 2897
This examiner grants 81% of resolved cases
Khaja Ahmad is an examiner in Tech Center 2800, where he has resolved 957 cases. The examiner maintains an allowance rate of 81.2%, which indicates a high likelihood of success for the 957 cases in his record. This 81.2% rate suggests that a large majority of applications reaching a final resolution result in an allowance. This provides a positive signal for practitioners filing in this tech center. The high volume of cases suggests a wealth of experience.
The interview lift is 25.5%, suggesting that conducting an interview has a significant positive impact on the probability of allowance. This 25.5% lift indicates that direct communication is a highly effective strategy for overcoming rejections. The median days to allowance is 862, establishing a clear timeframe for successful prosecution. With a median of 862 days, applicants can anticipate a relatively efficient duration for the 81.2% of cases that are allowed. This 862-day figure is a key data point for managing expectations.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18619711 | SEMICONDUCTOR PACKAGES AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18515009 | CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18432861 | METHOD AND APPARATUS FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18510287 | ELECTRONIC DEVICE | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 18479163 | APPARATUS FOR MANUFACTURING DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND MASK ASSEMBLY | Final Rejection | Samsung Display Co., Ltd. |
| 18514780 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18540104 | LIGHT EMITTING UNIT AND LENS UNIT | Final Rejection | NICHIA CORPORATION |
| 18130584 | EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY | Non-Final OA | Intel Corporation |
| 18683884 | METHOD AND OPTOELECTRONIC DEVICE | Non-Final OA | ams-OSRAM international GmbH |
| 18238594 | MULTI-CHANNEL STACK NANOWIRE | Non-Final OA | International Business Machines Corporation |
| 18658096 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18479006 | INTEGRATED CIRCUIT DEVICE WITH FERROELECTRIC CAPACITOR | Non-Final OA | Texas Instruments Incorporated |
| 18361997 | SEMICONDUCTOR DEVICE WITH GATE ELECTRICAL CONTACT FORMING JUNCTIONS HAVING DIFFERENT ENERGY BARRIER HEIGHTS TO GATE LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17563789 | INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL PERFORMANCE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17562666 | LOW STRESS LASER MODIFIED MOLD CAP PACKAGE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18634663 | SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND POWER MODULE | Non-Final OA | STMicroelectronics International N.V. |
| 18174462 | HEMT DEVICE AND MANUFACTURING PROCESS THEREOF | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18338984 | MEMORY DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18644770 | Semiconductor Device and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing co., Ltd |
| 18619459 | PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779831 | CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18398185 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18630165 | PACKAGE STRUCTURE INCLUDING INACTIVE ELEMENT, ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18471034 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18396323 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | Final Rejection | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 18425703 | POWER CONVERTER APPARATUS | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18638705 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | AP Memory Technology Corporation |
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