Tech Center 2800 • Art Units: 2813
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18515009 | CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18471583 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17920766 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18361997 | SEMICONDUCTOR DEVICE WITH GATE ELECTRICAL CONTACT FORMING JUNCTIONS HAVING DIFFERENT ENERGY BARRIER HEIGHTS TO GATE LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17562666 | LOW STRESS LASER MODIFIED MOLD CAP PACKAGE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18510287 | ELECTRONIC DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18463417 | FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND SWITCH CIRCUIT | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18238594 | MULTI-CHANNEL STACK NANOWIRE | Non-Final OA | International Business Machines Corporation |
| 18338984 | MEMORY DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18073576 | LIGHT EMITTING DEVICE | Final Rejection | Innolux Corporation |
| 18610872 | DISPLAY PANEL, DISPLAY APPARATUS, AND METHOD FOR MANUFACTURING DISPLAY PANEL | Non-Final OA | Hefei Visionox Technology Co., Ltd. |
| 18495622 | MICROCHANNEL STRUCTURES WITH BURIED STRUCTURES | Final Rejection | Hewlett-Packard Development Company, L.P. |
| 18176987 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18540104 | LIGHT EMITTING UNIT AND LENS UNIT | Non-Final OA | NICHIA CORPORATION |
| 18471293 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18204009 | TRIAC GATE DESIGN FOR COMMUTATION SENSITIVITY TRADE OFF IMPROVEMENT | Non-Final OA | STMicroelectronics International N.V. |
| 18741376 | METHOD OF MANUFACTURING A FIELD EFFECT TRANSDUCER | Final Rejection | Analog Devices, Inc. |
| 18470428 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18511547 | ELECTRONIC DEVICE | Non-Final OA | Renesas Electronics Corporation |
| 18345270 | STACKED LED CHIPS | Non-Final OA | CreeLED, Inc. |
| 18174462 | HEMT DEVICE AND MANUFACTURING PROCESS THEREOF | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18471292 | CAPACITOR STRUCTURE | Non-Final OA | MACRONIX International Co., Ltd. |
| 18175231 | Electric Field Modification for Nitrogen-Polar Group III-Nitride Semiconductor Devices | Non-Final OA | Wolfspeed, Inc. |
| 18270464 | PHOTOELECTRIC CONVERSION ELEMENT MATERIAL, METHOD FOR PRODUCING PHOTOELECTRIC CONVERSION ELEMENT MATERIAL, AND INK IN WHICH SEMICONDUCTOR NANOPARTICLES ARE DISPERSED | Final Rejection | UNIVERSITY INDUSTRY FOUNDATION, YONSEI UNIVERSITY |
| 18468957 | Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 17663208 | PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METHOD THEREOF, AND VERTICAL PACKAGE MODULE | Final Rejection | Zhuhai ACCESS Semiconductor Co., Ltd. |
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