4 pending office actions • 4 art units • 4 examiners • 0 of 4 (0%) have an AI response strategy ready • 7 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 3 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 3 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 3 (75%) |
| Multi-statute (no §101) | 1 (25%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHEN, YU | 1 | 67.9% | +29.7% |
| ZARNEKE, DAVID A | 1 | 70.8% | +10.7% |
| ANDERSON, WILLIAM H | 1 | 85.5% | +16.8% |
| TRAN, TRANG Q | 1 | 81.0% | +7.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18139748 | THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD THEREOF | ANDERSON, WILLIAM H | 59d overdue |
| 18132602 | HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME | TRAN, TRANG Q | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 1 ordered by deadline are shown.
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18139748 | THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD THEREOF | ANDERSON, WILLIAM H | 59d overdue |
| 18367477 | FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFACTURING SAME | CHEN, YU | 10d overdue |
| 18244315 | SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME | ZARNEKE, DAVID A | 85d |
| Art Unit | Apps |
|---|---|
| 2896 | 1 |
| 2891 | 1 |
| 2817 | 1 |
| 2811 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18367477 | FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFACTURING SAME | CHEN, YU | 2896 | §102§103 | Non-Final OA | 10d overdue | Pending | Sep 13, 2023 |
| 18244315 | SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | 85d | Pending | Sep 11, 2023 |
| 18139748 | THREE-DIMENSIONAL FAN-OUT MEMORY POP STRUCTURE AND PACKAGING METHOD THEREOF | ANDERSON, WILLIAM H | 2817 | §103 | Non-Final OA | 59d overdue | Pending | Apr 26, 2023 |
| 18132602 | HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME | TRAN, TRANG Q | 2811 | §103 | Non-Final OA | — | Pending | Apr 10, 2023 |
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