Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2891
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18451197 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18280978 | FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17992818 | INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES & SELF-ALIGNED VIAS | Non-Final OA | Intel Corporation |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | Non-Final OA | Intel Corporation |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Non-Final OA | Intel Corporation |
| 19214066 | COWOS IC STRUCTURE WITH EDGE-PAD SEMICONDUCTOR DIE | Non-Final OA | ETRON TECHNOLOGY, INC. |
| 18177404 | DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION | Non-Final OA | QUALCOMM Incorporated |
| 18177005 | INTEGRATED DEVICE COMPRISING ELONGATED PADS | Non-Final OA | QUALCOMM Incorporated |
| 18347313 | Liquid Immersion-Cooled Power Module | Non-Final OA | Kia Corporation |
| 17985894 | LAMINATION OF A LIGHT SOURCE HAVING A LOW-DENSITY SET OF LIGHT-EMITTING ELEMENTS | Non-Final OA | Lumileds LLC |
| 18166551 | MODULE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18504158 | BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18451263 | SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18448125 | DIAGONAL VIA STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18366112 | MEMORY, FABRICATION METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18090459 | DISPLAY DEVICE | Non-Final OA | Industrial Technology Research Institute |
| 18329845 | SEMICONDUCTOR PACKAGE ASSEMBLY AND A METHOD OF MANUFACTURING SUCH SEMICONDUCTOR PACKAGE ASSEMBLY | Non-Final OA | NEXPERIA B.V. |
| 18222776 | SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION | Non-Final OA | Sandisk Technologies, Inc. |
| 18137514 | POWER AMPLIFICATION DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | KMW INC. |
| 18515364 | CHIPLETS WITH CONNECTION POSTS | Final Rejection | X Display Company Technology Limited |
| 18244315 | SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME | Final Rejection | SJ Semiconductor(Jiangyin) Corporation |
| 18340607 | THERMALLY CONDUCTIVE INTERPOSER, A DEVICE IMPLEMENTING A THERMALLY CONDUCTIVE INTERPOSER, AND PROCESSES FOR IMPLEMENTING THE SAME | Non-Final OA | MACOM Technology Solutions Holdings, LLC |
| 17455243 | DIAMOND-BASED THERMAL COOLING DEVICES METHODS AND MATERIALS | Final Rejection | SHARFI, BENJAMIN K. |
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