Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2874 2891
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18606843 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18457535 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18451197 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18430395 | PACKAGE COMPRISING SUBSTRATES WITH POST INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18177404 | DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION | Final Rejection | QUALCOMM Incorporated |
| 17992010 | REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT | Non-Final OA | Intel Corporation |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | Final Rejection | Intel Corporation |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Non-Final OA | Intel Corporation |
| 17833648 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Final Rejection | Intel Corporation |
| 18788853 | FABRICATION METHODS AND STRUCTURES FOR LIQUID COOLING CHANNEL CHIP | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18366112 | MEMORY, FABRICATION METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18525490 | CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER | Non-Final OA | NXP USA, Inc. |
| 18347313 | Liquid Immersion-Cooled Power Module | Non-Final OA | Kia Corporation |
| 18663124 | BONDING STRUCTURE AND METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18430507 | SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18504158 | BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18451263 | SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18451982 | BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE USING THE APPARATUS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18137514 | POWER AMPLIFICATION DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | KMW INC. |
| 18504309 | SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGEMENT | Non-Final OA | Infineon Technologies AG |
| 18222776 | SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION | Final Rejection | Sandisk Technologies, Inc. |
| 18090459 | DISPLAY DEVICE | Final Rejection | Industrial Technology Research Institute |
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