Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1746 2874 2891
This examiner grants 71% of resolved cases
David A. Zarneke is an examiner in Art Unit 1746 within Tech Center 2800. He has a history of 822 resolved cases. His allowance rate is 71.0 percent. This 71.0 percent rate suggests that the majority of applications are eventually granted. The median days to allowance is 1023. This 1023-day figure provides an expectation for the timeline in Art Unit 1746. Practitioners should use this metric for their long-term planning.
The interview lift of 11.2 percent indicates that interviews provide a measured advantage. This 11.2 percent lift can be a factor in difficult cases. With 822 resolved cases, these metrics are reliable for practitioners working in Tech Center 2800. The lift suggests that a proactive approach is beneficial. The 71.0 percent allowance rate and the 1023-day median point to a consistent examination process. Practitioners can use these figures to assess the historical performance of this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18665893 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18457535 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18293834 | LIGHT EMITTING DIODE CHIP AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18525490 | CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER | Non-Final OA | NXP USA, Inc. |
| 18430395 | PACKAGE COMPRISING SUBSTRATES WITH POST INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18075360 | SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT | Final Rejection | Intel Corporation |
| 17992010 | REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT | Non-Final OA | Intel Corporation |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | Final Rejection | Intel Corporation |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Non-Final OA | Intel Corporation |
| 17833648 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | Final Rejection | Intel Corporation |
| 18366112 | MEMORY, FABRICATION METHOD THEREOF AND MEMORY SYSTEM | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18685775 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18684565 | OPTOELECTRONIC COMPONENT, LIGHTING UNIT AND METHOD OF MANUFACTURING AN OPTOELECTRONIC COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18657165 | THROUGH DIELECTRIC VIA | Non-Final OA | International Business Machines Corporation |
| 18214159 | CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18504309 | SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGEMENT | Non-Final OA | Infineon Technologies AG |
| 18105309 | CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMENT, AND METHOD OF FORMING A CHIP PACKAGE | Non-Final OA | Infineon Technologies AG |
| 18430507 | SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18451263 | SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18371179 | LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME | Final Rejection | Applied Materials, Inc. |
| 18137514 | POWER AMPLIFICATION DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | KMW INC. |
| 19214066 | COWOS IC STRUCTURE WITH EDGE-PAD SEMICONDUCTOR DIE | Final Rejection | ETRON TECHNOLOGY, INC. |
| 18222776 | SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION | Final Rejection | Sandisk Technologies, Inc. |
| 18090459 | DISPLAY DEVICE | Final Rejection | Industrial Technology Research Institute |
| 18606922 | METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18800784 | SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd |
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