Tech Center 2800 • Art Units: 2613 2621 2624 2665 2676 2815 2896
This examiner grants 68% of resolved cases
Yu Chen, an examiner in Tech Center 2800 and Art Unit 2613, has 1087 resolved cases. The allowance rate is 67.9%, which represents a solid majority of cases. The median days to allowance is 1038, reflecting a standard timeline for successful prosecution. This 1038-day duration is a key metric for planning in Art Unit 2613. The 67.9% rate indicates a balanced examination environment.
The interview lift is 29.6%, which is quite high. This indicates that interviews are very effective at moving cases toward allowance, especially when compared to the 67.9% baseline. In Tech Center 2800, the 1038-day median pendency can be managed more successfully with direct communication. The 29.6% lift is a critical tool for practitioners seeking to improve their odds. With 1087 resolved cases, these metrics provide a clear guide for strategy.
Applicants should use the 29.6% interview lift to their advantage to overcome the 67.9% baseline. The 1038-day median to allowance should be factored into any long-term prosecution plan. Overall, the 1087 cases suggest that direct engagement is a key strategy for success with this examiner. Practitioners in Art Unit 2613 should prioritize interviews to move beyond the initial 67.9% allowance probability.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18660936 | SEMICONDUCTOR DEVICE HAVING VERTICAL CHANNEL STRUCTURE AND MANUFACTURING METHOD OF VERTICAL CHANNEL STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18338869 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18096819 | MICRO LED AND DISPLAY MODULE HAVING SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 19179613 | VIRTUAL ASSISTANT INTERACTIONS IN A 3D ENVIRONMENT | Non-Final OA | Apple Inc. |
| 18123833 | Transposing Virtual Objects Between Viewing Arrangements | Final Rejection | Apple Inc. |
| 18067604 | LENTICULAR IMAGE GENERATION | Final Rejection | Apple Inc. |
| 18191177 | SEMICONDUCTOR DEVICE AND POWER DEVICE | Final Rejection | SEIKO EPSON CORPORATION |
| 18569307 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM | Final Rejection | NEC Corporation |
| 18026332 | LIGHT-EMITTING CHIP, LIGHT-EMITTING SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR LIGHT-EMITTING SUBSTRATE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18637790 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18585289 | DISPLAY DEVICE, FLEXIBLE DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18403079 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18056614 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18180239 | INFORMATION PROCESSING APPARATUS, NON-TRANSITORY COMPUTER READABLE MEDIUM, AND INFORMATION PROCESSING METHOD | Non-Final OA | FUJIFILM Business Innovation Corp. |
| 18740295 | MESH GENERATION USING PROMPTS | Non-Final OA | SNAP INC. |
| 18232699 | LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18060869 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18466070 | LIGHT-EMITTING DEVICE | Final Rejection | NICHIA CORPORATION |
| 18642452 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, POWER CONVERSION CIRCUIT, AND VEHICLE | Non-Final OA | Huawei Digital Power Technologies Co., Ltd. |
| 18883986 | SYSTEM AND CONTROL METHOD OF SYSTEM | Final Rejection | CANON KABUSHIKI KAISHA |
| 18984646 | MODES OF USER INTERACTION | Non-Final OA | Magic Leap, Inc. |
| 18403222 | HYBRID THREE-DIMENSIONAL (3D) RECONSTRUCTION WITH SEMANTIC SEGMENTATION AND RECONSTRUCTION | Final Rejection | QUALCOMM Incorporated |
| 18477888 | CONFIGURATION INDEPENDENT SURFACE LAYOUT FOR DATA PROCESSING | Final Rejection | Intel Corporation |
| 18129873 | INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS | Non-Final OA | Intel Corporation |
| 17955689 | LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS | Final Rejection | Intel Corporation |
| 17956421 | DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING | Final Rejection | Intel Corporation |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | Final Rejection | Intel Corporation |
| 17954288 | IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS | Final Rejection | Intel Corporation |
| 17953511 | OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS | Final Rejection | Intel Corporation |
| 17123451 | VERTICAL CHANNEL WITH CONDUCTIVE STRUCTURES TO IMPROVE STRING CURRENT | Non-Final OA | Intel NDTM US LLC |
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