Tech Center 2800 • Art Units: 2817
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18593381 | SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18426995 | SEMICONDUCTOR PACKAGE WITH STEPPED REDISTRIBUTION STRUCTURE EXPOSING MOLD LAYER | Final Rejection | Samsung Electronics Co., Ltd. |
| 18419399 | SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18493041 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18224802 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18326145 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18202085 | INTEGRATED CIRCUIT DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18309113 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18138564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17880723 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18399630 | WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLOCKING MATERIAL AND METHODS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17199143 | Buried Power Rail Architecture | Final Rejection | Arm Limited |
| 18100289 | DRAM Transistor Including Pillars Formed Using Low-Temperature Ion Implant | Non-Final OA | Applied Materials, Inc. |
| 17928318 | Joining and Insulating Power Electronic Semiconductor Components | Final Rejection | Siemens Aktiengesellschaft |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17822390 | CAPACITORLESS DYNAMIC RANDOM ACCESS MEMORY AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17485217 | PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS | Final Rejection | Intel Corporation |
| 17934023 | CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE | Final Rejection | QUALCOMM Incorporated |
| 17153220 | SEMICONDUCTOR DEVICE INCLUDING POWER RAIL | Non-Final OA | SK hynix Inc. |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18499908 | FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18376597 | METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SUBSTRATE BY ATOMIC LAYER DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | Non-Final OA | ASM IP Holding B.V. |
| 17599532 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Final Rejection | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18242492 | NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE | Non-Final OA | iCometrue Company Ltd. |
| 18231415 | NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE | Final Rejection | iCometrue Company Ltd. |
| 18448296 | PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE | Final Rejection | Sandisk Technologies, Inc. |
| 18298645 | CONFIGURABLE WARPAGE CONTROL SPACERS | Final Rejection | Nokia Solutions and Networks Oy |
| 18319422 | DYNAMIC RANDOM ACCESS MEMORY DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | Powerchip Semiconductor Manufacturing Corporation |
| 18752274 | METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, SEMICONDUCTOR PRODUCT, DEVICE AND TESTING METHOD | Final Rejection | STMicroelectronics S.r.l. |
| 18070966 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Final Rejection | STMicroelectronics S.r.l. |
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