Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18609921 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18419399 | SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18503690 | SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18493041 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18224802 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18309113 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18138564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18705078 | LIGHT DETECTION APPARATUS AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18711633 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18608585 | DISPLAY DEVICE AND DISPLAY PANEL | Non-Final OA | LG Display Co., Ltd. |
| 18417960 | DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18530892 | DISPLAY PANEL AND METHOD OF MANUFACTURING SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18540542 | PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE | Non-Final OA | QUALCOMM Incorporated |
| 17934023 | CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE | Non-Final OA | QUALCOMM Incorporated |
| 17211751 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP | Final Rejection | Intel Corporation |
| 18376597 | METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SUBSTRATE BY ATOMIC LAYER DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | Non-Final OA | ASM IP Holding B.V. |
| 18669537 | STACKED SEMICONDUCTOR DEVICE WITH EXPANDABLE INTERFACE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 18353110 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A WORD LINE WITH VARIABLE WIDTHS | Non-Final OA | SK hynix Inc. |
| 18399630 | WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLOCKING MATERIAL AND METHODS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18588595 | SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY | Final Rejection | Micron Technology, Inc. |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18499908 | FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18647764 | CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18491584 | METHODS AND APPARATUS FOR ANISOTROPIC FILM GROWTH, AND RELATED DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18423164 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18205180 | POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICALLY WELDED CONTACT REGIONS AND METHOD OF PRODUCING THE POWER SEMICONDUCTOR MODULE | Non-Final OA | Infineon Technologies AG |
| 17199143 | Buried Power Rail Architecture | Non-Final OA | Arm Limited |
| 18752274 | METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, SEMICONDUCTOR PRODUCT, DEVICE AND TESTING METHOD | Final Rejection | STMicroelectronics S.r.l. |
| 18668373 | ISOLATED SHARED CONTACT FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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