Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2800 2817 3652
This examiner grants 85% of resolved cases
William H. Anderson is an examiner in Tech Center 3600, specifically assigned to Art Unit 2800. With 221 resolved cases, the examiner maintains a high allowance rate of 85.1 percent. This suggests a favorable environment for applicants seeking patent grants. The median days to allowance stands at 946, providing a timeline for expectations regarding the duration of the prosecution process.
The data indicates a significant interview lift of 17.9 percent. This metric suggests that engaging in an interview with the examiner is a productive strategy to increase the probability of allowance. Given the 85.1 percent baseline allowance rate, the lift provides a clear path for overcoming potential rejections. Practitioners should prioritize direct communication to navigate the 946-day median pendency efficiently. The volume of 221 resolved cases provides a robust statistical basis for these observations within the 3600 tech center.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18675285 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18609921 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18224802 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18138564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18711633 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18417960 | DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18395921 | ANTI-SHOCK LAYER AND DISPLAY PANEL INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18530892 | DISPLAY PANEL AND METHOD OF MANUFACTURING SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18740114 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18608585 | DISPLAY DEVICE AND DISPLAY PANEL | Final Rejection | LG Display Co., Ltd. |
| 18673715 | LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, AND WEARABLE DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18540542 | PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE | Non-Final OA | QUALCOMM Incorporated |
| 17934023 | CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE | Non-Final OA | QUALCOMM Incorporated |
| 17211751 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP | Final Rejection | Intel Corporation |
| 18376597 | METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SUBSTRATE BY ATOMIC LAYER DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | Final Rejection | ASM IP Holding B.V. |
| 18531553 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, THREE-DIMENSIONAL MEMORY | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18705078 | LIGHT DETECTION APPARATUS AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18668373 | ISOLATED SHARED CONTACT FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18589861 | TAPERED CHANNEL FORKSHEET TRANSISTOR | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17657961 | NANOSHEET PULL-UP TRANSISTOR IN SRAM | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18423164 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18669537 | STACKED SEMICONDUCTOR DEVICE WITH EXPANDABLE INTERFACE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 18353110 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A WORD LINE WITH VARIABLE WIDTHS | Non-Final OA | SK hynix Inc. |
| 18588595 | SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY | Final Rejection | Micron Technology, Inc. |
| 18626960 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18307002 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18506366 | IMMERSION COOLING SYSTEM AND METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18630807 | SEMICONDUCTOR DEVICE | Non-Final OA | TSMC NANJING COMPANY LIMITED |
| 18647764 | CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
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