Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18593381 | SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER | Final Rejection | Samsung Electronics Co., Ltd. |
| 18426995 | SEMICONDUCTOR PACKAGE WITH STEPPED REDISTRIBUTION STRUCTURE EXPOSING MOLD LAYER | Final Rejection | Samsung Electronics Co., Ltd. |
| 18503690 | SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18493041 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18202085 | INTEGRATED CIRCUIT DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18309113 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18138564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17880723 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18399630 | WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLOCKING MATERIAL AND METHODS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18395921 | ANTI-SHOCK LAYER AND DISPLAY PANEL INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17199143 | Buried Power Rail Architecture | Final Rejection | Arm Limited |
| 18100289 | DRAM Transistor Including Pillars Formed Using Low-Temperature Ion Implant | Non-Final OA | Applied Materials, Inc. |
| 17485217 | PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS | Final Rejection | Intel Corporation |
| 17934023 | CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE | Final Rejection | QUALCOMM Incorporated |
| 18604613 | SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18353110 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A WORD LINE WITH VARIABLE WIDTHS | Final Rejection | SK hynix Inc. |
| 18514126 | Chamfered Die of Semiconductor Package and Method for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18499908 | FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17599532 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Final Rejection | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18231415 | NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE | Final Rejection | iCometrue Company Ltd. |
| 18298645 | CONFIGURABLE WARPAGE CONTROL SPACERS | Final Rejection | Nokia Solutions and Networks Oy |
| 18752274 | METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, SEMICONDUCTOR PRODUCT, DEVICE AND TESTING METHOD | Final Rejection | STMicroelectronics S.r.l. |
| 18448296 | PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE | Final Rejection | Sandisk Technologies, Inc. |
| 18155043 | MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17654158 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18366116 | SEMICONDUCTOR DEVICE | Final Rejection | MACRONIX INTERNATIONAL CO., LTD. |
| 18154756 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18099677 | INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND RACK SERVER UNIT | Non-Final OA | Invention And Collaboration Laboratory Pte. Ltd. |
| 18193942 | Semiconductor Device and Method of Forming Interconnect Structure with Graphene Core Shells for 3D Stacking Package | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18318794 | MEMORY DEVICE, METHOD OF MANUFACTURING MEMORY DEVICE, AND ELECTRONIC APPARATUS INCLUDING MEMORY DEVICE | Final Rejection | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
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