Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 77% of resolved cases
Alexander Belousov serves as an examiner in Tech Center 2800, specifically within Art Unit 2818. The examiner has a record of 525 resolved cases, providing a dataset for analysis. The allowance rate is 76.6 percent, which indicates the probability of success for applicants. This 76.6 percent figure serves as a primary benchmark for evaluating the likelihood of a grant on this docket. The 525 resolved cases establish a consistent pattern of performance.
The interview lift is 16.3 percent, suggesting that formal discussions with the examiner are a beneficial part of the prosecution process. This 16.3 percent lift indicates that an interview can further improve the chances of allowance beyond the 76.6 percent baseline. Practitioners should consider this positive impact when deciding whether to request an interview. The median days to allowance is 1066, which is the typical duration for applications that reach issuance. This 1066 median days to allowance provides a clear expectation for pendency.
The data in Art Unit 2818 shows that the interview lift is 16.3 percent, offering an additional tool for success. The 1066 median days to allowance helps set expectations for the overall timeline in Tech Center 2800. The 76.6 percent allowance rate remains a key metric for evaluating the likelihood of a grant. These metrics offer a data-driven foundation for developing a successful strategy before this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18220445 | COLOR FILTER, IMAGE SENSOR, AND ELECTRONIC APPARATUS HAVING THE IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18005649 | SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING APPARATUS AND ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18359693 | IMAGE SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18786614 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783538 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18778985 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18771095 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18642658 | MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18603729 | VIA STRUCTURE FOR MULTI-STACKED CHIPS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18448093 | METHOD OF MANUFACTURING SEMICONDUCTOR IMAGE SENSOR | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18365441 | DIELECTRIC STRUCTURE OVERLYING IMAGE SENSOR ELEMENT TO INCREASE QUANTUM EFFICIENCY | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18154017 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18699329 | Packaging of microelectromechanical system devices | Non-Final OA | Teknologian tutkimuskeskus VTT Oy |
| 18176854 | IMAGE SENSOR AND METHOD FOR FORMING THE SAME | Final Rejection | VisEra Technologies Company Limited |
| 18110332 | INTEGRATED CIRCUIT WITH NON-PREFERRED DIRECTION CURVILINEAR WIRING | Final Rejection | D2S, Inc. |
| 18202430 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Final Rejection | Semiconductor Manufacturing International (Shanghai) Corporation |
| 18369054 | BIDIRECTIONAL ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR DEVICE | Non-Final OA | Littelfuse Semiconductor (Wuxi) Co., Ltd. |
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