Prosecution Insights
Last updated: August 17, 2026

Examiner: CHACKO DAVIS, DABORAH

Tech Center 1700 • Art Units: 1722 1737 1795

This examiner grants 72% of resolved cases

Performance Statistics

71.9%
Allow Rate
+6.9% vs TC avg
1,023
Total Applications
+20.7%
Interview Lift
1227
Avg Prosecution Days
Based on 988 resolved cases, 2023–2026

Rejection Statute Breakdown

0.7%
§101 Eligibility
28.3%
§102 Novelty
35.9%
§103 Obviousness
25.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18403927 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18312825 CARBOXYLATE SALT, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE PHOTORESIST COMPOSITION Non-Final OA Samsung Electronics Co., Ltd.
18130001 SUPERCRITICAL FLUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18125923 SUBSTRATE PROCESSING METHOD Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18411337 MANUFACTURING METHOD OF SEMICONDUCTOR CHIP, AND KIT Non-Final OA FUJIFILM Corporation
18191597 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Final Rejection FUJIFILM Corporation
18428227 HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS Non-Final OA SAMSUNG SDI CO., LTD.
18580110 COMPOSITION FOR REMOVING EDGE BEAD OF METAL-CONTAINING RESIST, AND METHOD FOR FORMING PATTERN COMPRISING STEP OF REMOVING EDGE BEAD BY USING SAME Non-Final OA SAMSUNG SDI CO., LTD.
18404737 METHOD OF INCREASING CROSSLINKING DENSITY OF PHOTORESIST Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18137288 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18222897 INTEGRATED SOLUTION WITH LOW TEMPERATURE DRY DEVELOP FOR EUV PHOTORESIST Non-Final OA Applied Materials, Inc.
18093121 CHARACTERIZATION OF PHOTOSENSITIVE MATERIALS Non-Final OA Applied Materials, Inc.
18470491 METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM Non-Final OA Tokyo Electron Limited
18216168 METHOD OF FORMING PHOTOSENSITIVE ORGANOMETALLIC OXIDES BY CHEMICAL VAPOR POLYMERIZATION Final Rejection Tokyo Electron Limited
18022213 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
17989438 Self Aligned Multiple Patterning Method Non-Final OA Tokyo Electron Limited
17943926 PATTERNING A SEMICONDUCTOR WORKPIECE Final Rejection Tokyo Electron Limited
18308670 PHOTOMASK STRUCTURE Final Rejection United Microelectronics Corp.

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