Tech Center 1700 • Art Units: 1722 1737 1795
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18403927 | PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18312825 | CARBOXYLATE SALT, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE PHOTORESIST COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18130001 | SUPERCRITICAL FLUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18125923 | SUBSTRATE PROCESSING METHOD | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18411337 | MANUFACTURING METHOD OF SEMICONDUCTOR CHIP, AND KIT | Non-Final OA | FUJIFILM Corporation |
| 18191597 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 18428227 | HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18580110 | COMPOSITION FOR REMOVING EDGE BEAD OF METAL-CONTAINING RESIST, AND METHOD FOR FORMING PATTERN COMPRISING STEP OF REMOVING EDGE BEAD BY USING SAME | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18404737 | METHOD OF INCREASING CROSSLINKING DENSITY OF PHOTORESIST | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18137288 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18222897 | INTEGRATED SOLUTION WITH LOW TEMPERATURE DRY DEVELOP FOR EUV PHOTORESIST | Non-Final OA | Applied Materials, Inc. |
| 18093121 | CHARACTERIZATION OF PHOTOSENSITIVE MATERIALS | Non-Final OA | Applied Materials, Inc. |
| 18470491 | METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 18216168 | METHOD OF FORMING PHOTOSENSITIVE ORGANOMETALLIC OXIDES BY CHEMICAL VAPOR POLYMERIZATION | Final Rejection | Tokyo Electron Limited |
| 18022213 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17989438 | Self Aligned Multiple Patterning Method | Non-Final OA | Tokyo Electron Limited |
| 17943926 | PATTERNING A SEMICONDUCTOR WORKPIECE | Final Rejection | Tokyo Electron Limited |
| 18308670 | PHOTOMASK STRUCTURE | Final Rejection | United Microelectronics Corp. |
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