Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1722 1737 1795
This examiner grants 72% of resolved cases
Daborah Chacko Davis is an examiner in Tech Center 1700 and Art Unit 1722. The data includes 996 resolved cases. The allowance rate is 72.1 percent, which indicates the frequency of granted patents. The median days to allowance is 1228, serving as a benchmark for the duration of the grant process. This 1228 day figure is a key timing metric for applicants.
The interview lift is 20.6 percent. This figure suggests that an interview is associated with a 20.6 percent change in the probability of allowance. With 996 resolved cases, this lift provides a look at the impact of verbal communication. The 72.1 percent allowance rate and the 1228 median days to allowance are the primary figures for developing a prosecution strategy.
The Art Unit 1722 designation and the Tech Center 1700 location form the basis for the current statistical profile. The 72.1 percent allowance rate provides a baseline for success, while the 20.6 percent interview lift highlights the impact of direct negotiation. These 996 resolved cases define the current data for this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18170591 | TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR CIRCUIT WIRE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18428227 | HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 17753110 | POSITIVE TONE DEVELOPMENT OF CVD EUV RESIST FILMS | Final Rejection | Lam Research Corporation |
| 18404737 | METHOD OF INCREASING CROSSLINKING DENSITY OF PHOTORESIST | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18137288 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18361298 | DOSE REDUCTION BOTTOM ANTI-REFLECTIVE COATING FOR METALLIC PHOTORESIST | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18361609 | EUV RETICLE WITH EMBEDDED PROCESS ASSISTANCE LAYER AND METHOD OF MANUFACTURING THE EUV RETICLE | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18093121 | CHARACTERIZATION OF PHOTOSENSITIVE MATERIALS | Non-Final OA | Applied Materials, Inc. |
| 18470491 | METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 17943729 | Hybrid Development of EUV Resists | Non-Final OA | Tokyo Electron Limited |
| 17912202 | SYSTEMS AND METHODS FOR FORMING STRUCTURES ON A SURFACE | Final Rejection | ASML HOLDING N.V. |
| 18294072 | PELLICLE FOR EXPOSURE CAPABLE OF EASY ADJUSTMENT OF ATMOSPHERIC PRESSURE | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18376499 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18308670 | PHOTOMASK STRUCTURE | Final Rejection | United Microelectronics Corp. |
| 18350480 | Wafer Bow Mitigation | Non-Final OA | The University of Queensland |
| 18435001 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | Non-Final OA | JSR CORPORATION |
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