Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2823 2892 2897
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508941 | TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co,. Ltd. |
| 18386003 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18287788 | SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTOR COMPONENT CONTACTED ON THE SUBSTRATE | Non-Final OA | Siemens Aktiengesellschaft |
| 18554268 | IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18391663 | MOTHER SUBSTRATE FOR DISPLAY DEVICE AND DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18384368 | DISPLAY PANEL | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18340236 | DISPLAY PANEL | Non-Final OA | Hefei Visionox Technology Co., Ltd. |
| 18596254 | Power and Temperature Management for Functional Blocks Implemented by a 3D Stacked Integrated Circuit | Non-Final OA | Micron Technology, Inc. |
| 18571831 | CIRCUIT BOARD MANUFACTURING METHOD | Non-Final OA | MITSUI MINING & SMELTING CO., LTD. |
| 18405967 | DIFFUSION BARRIER STRUCTURES IN SOURCE/DRAIN STRUCTURES OF NANOSTRUCTURE TRANSISTORS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18533136 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18329186 | ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTRONIC ASSEMBLY | Final Rejection | Skyworks Solutions, Inc. |
| 18572112 | METHOD OF MANUFACTURING A LAYERED 3D PRODUCT | Non-Final OA | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO |
| 18510046 | EPITAXIAL STRUCTURE | Non-Final OA | GLOBALWAFERS CO., LTD. |
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