Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18625341 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17957359 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Final Rejection | Intel Corporation |
| 18645374 | STACK CHIP PACKAGE | Non-Final OA | SK hynix Inc. |
| 18629966 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18485602 | GATE FORMATION PROCESS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
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