Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 90% of resolved cases
Emily Nicole Farmer is an examiner in Tech Center 2800 and Art Unit 2812, with 48 resolved cases. Her allowance rate of 89.6% indicates a very high success rate for patent applications. The median days to allowance is 1123, providing a clear expectation for the duration of the prosecution process.
The data shows an interview lift of 6.3%, suggesting that interviews are a beneficial tool for increasing the 89.6% allowance rate. For practitioners in Art Unit 2812, this 6.3% lift is a factor to consider in strategy development. The 48 resolved cases provide a solid foundation for these performance metrics.
With a median days to allowance of 1123, Farmer maintains a consistent pace within Tech Center 2800. The combination of a very high allowance rate and a positive interview lift suggests a favorable environment for applicants. Practitioners should consider the 6.3% lift as a way to further improve their chances of success.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17957359 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Final Rejection | Intel Corporation |
| 17709365 | LAYERED 2D SEMICONDUCTORS | Non-Final OA | Intel Corporation |
| 18562086 | DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18715878 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18594394 | MAGNETIC MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18067705 | SCREEN LAYER INTEGRATION IN GALLIUM NITRIDE TECHNOLOGY | Final Rejection | Texas Instruments Incorporated |
| 18674220 | SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING | Non-Final OA | STMICROELECTRONICS INTERNATIONAL N.V. |
| 18402976 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18513325 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18889666 | PACKAGE SUBSTRATE INCLUDING FIBER-REINFORCED DIELECTRIC LAYER, PACKAGE STRUCTURE INCLUDING THE PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18756730 | SEMICONDUCTOR DEVICE | Non-Final OA | ENNOSTAR CORPORATION |
| 18775357 | LIGHT EMITTING DIODE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
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