Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2694 2893 2898 4100
This examiner grants 75% of resolved cases
Dzung T. Hoang works in Tech Center 4100 and Art Unit 2694, where he has handled 8 resolved cases. His allowance rate is 75.0%, suggesting a generally positive environment for applicants. The median days to allowance is 950, which is a relatively efficient timeline for reaching a grant. While the sample size of 8 resolved cases is small, these figures provide an initial look at his examination style and the typical outcomes for applications on his docket.
The interview lift pct is 0.0%, indicating that interviews have not statistically improved the allowance rate in his limited case history. With a 75.0% allowance rate and a 950 median days to allowance, it appears that most successful cases are resolved through the written record. Practitioners should focus on high quality written responses, as the data does not currently show a benefit from oral advocacy. These metrics, though based on only 8 resolved cases, offer a starting point for strategy in Art Unit 2694 and Tech Center 4100.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18234092 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18565813 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18763499 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18741107 | DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18598548 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18390632 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18646914 | INTEGRATED CIRCUIT, MANUFACTURING METHOD THEREOF, POWER AMPLIFIER, AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18596528 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF | Non-Final OA | Kioxia Corporation |
| 18717059 | TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE | Non-Final OA | Lam Research Corporation |
| 18430636 | INTEGRATING HIGH PERMEABILITY MATERIAL IN SOLDER BALL CONNECTION | Non-Final OA | Cisco Technology, Inc. |
| 18826347 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH INNER SPACER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18659527 | UNIFORM SIGE CHANNEL FORMATION FOR GAA PMOS | Non-Final OA | Applied Materials, Inc. |
| 18641706 | SHAPED MICRO REFLECTOR PRINTING PROCESS FOR SIDE-FIRE MICRO LIGHT-EMITTING DIODE DISPLAYS | Non-Final OA | GM GLOBAL TECHNOLOGY OPERATIONS LLC |
| 18733148 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | National Yang Ming Chiao Tung University |
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