Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2694 2893 2898
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18657084 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18442668 | INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE, AND METHOD OF DESIGNING LAYOUT OF SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18234092 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18393405 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18646914 | INTEGRATED CIRCUIT, MANUFACTURING METHOD THEREOF, POWER AMPLIFIER, AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18741107 | DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18670891 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18391364 | METHOD AND APPARATUS FOR AMBIENT TEMPERATURE SENSOR DESIGN IN A COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) PROCESS | Non-Final OA | QUALCOMM Incorporated |
| 18590491 | Method of Backgrind Tape Planarization Using Heated Press | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18430636 | INTEGRATING HIGH PERMEABILITY MATERIAL IN SOLDER BALL CONNECTION | Non-Final OA | Cisco Technology, Inc. |
| 18717059 | TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE | Non-Final OA | Lam Research Corporation |
| 18641706 | SHAPED MICRO REFLECTOR PRINTING PROCESS FOR SIDE-FIRE MICRO LIGHT-EMITTING DIODE DISPLAYS | Non-Final OA | GM GLOBAL TECHNOLOGY OPERATIONS LLC |
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