Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 88% of resolved cases
Bo Bin Jang, examining in Art Unit 2818, has a high allowance rate of 88.4 percent across 623 resolved cases. This 88.4 percent rate suggests that Tech Center 2800 applicants have a very high probability of securing a patent. The 623 cases demonstrate a consistent pattern of granting applications, making this a very favorable environment for prosecution.
The interview lift is low at 7.4 percent. This 7.4 percent figure indicates that interviews have a minimal impact on the already high 88.4 percent allowance rate. It suggests that Bo Bin Jang is generally satisfied with the applications as filed or through written amendments, making the 7.4 percent lift a secondary consideration for the 623 cases in this portfolio. Written excellence is likely the primary driver of the 88.4 percent success rate.
The median time to allowance is 788 days, which is efficient. This 788-day timeline, combined with the 88.4 percent allowance rate, makes Bo Bin Jang a very effective examiner for the 623 cases in his portfolio. Applicants can expect a quick and successful prosecution process within this 788-day window. The 788-day median is a key advantage for applicants in this unit.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18817681 | FORKSHEET TRANSISTOR STRUCTURE HAVING CONDUCTIVE WALL | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18641698 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18635753 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18596862 | ELECTRONIC DEVICE AND METHOD OF PROVIDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18340072 | INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCRIBE LINES | Non-Final OA | Intel Corporation |
| 18695677 | OPTICAL COMPONENT MOUNTING PACKAGE AND OPTICAL APPARATUS | Non-Final OA | KYOCERA Corporation |
| 18504014 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 18216829 | METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCANNING | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18807199 | SUBSTRATE-TO-SUBSTRATE BONDING USING ELECTROSTATIC CHUCKS | Non-Final OA | Applied Materials, Inc. |
| 18630913 | SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18399709 | COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUNICATION DEVICE | Non-Final OA | AUO Corporation |
| 18675721 | MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC BASE BELOW WORD LINE CONTACT VIA STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18404920 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy