Tech Center 2800 • Art Units: 2818 2894
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18641698 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18396357 | METHODS FOR SELECTIVELY FORMING A DIELECTRIC LAYER ON A METALLIC SURFACE RELATIVE TO A DIELECTRIC SURFACE | Non-Final OA | ASM IP Holding B.V. |
| 18388548 | SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND NITROGEN | Non-Final OA | ASM IP Holding B.V. |
| 18712948 | Display Device And Method For Manufacturing Display Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18695677 | OPTICAL COMPONENT MOUNTING PACKAGE AND OPTICAL APPARATUS | Non-Final OA | KYOCERA Corporation |
| 18705777 | FILM FORMING APPARATUS AND FILM FORMING METHOD, AND OXIDE SEMICONDUCTOR FILM AND LAMINATE | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18399709 | COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUNICATION DEVICE | Non-Final OA | AUO Corporation |
| 18675721 | MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC BASE BELOW WORD LINE CONTACT VIA STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17978465 | DEEP VIA WITH INTERNAL VOID FOR STRESS MITIGATION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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