Prosecution Insights
Last updated: October 02, 2026

Examiner: LEE, ALEXANDER N

Tech Center 2800 • Art Units: 1716 1737 2812 2891

This examiner grants 77% of resolved cases

Analysis

Alexander N. Lee is an examiner in Art Unit 1716, within Tech Center 2800. He has 116 resolved cases, providing a clear view of his examination tendencies. The allowance rate for this examiner is 76.7 percent, which is a favorable and encouraging figure for patent applicants. The interview lift is 11.9 percent, suggesting that direct communication can provide a meaningful boost to the probability of allowance. This 11.9 percent lift is a useful strategic tool for practitioners to consider during prosecution.

The median time to allowance is 1228 days, which is over three years and indicates a relatively long prosecution cycle. This 1228-day timeline, paired with the 76.7 percent allowance rate, offers a predictable path for patent applicants. The 11.9 percent interview lift indicates that the examiner is receptive to oral advocacy and that such interactions often lead to positive outcomes. With 116 resolved cases, the data shows a consistent preference for collaborative prosecution. Practitioners should use the lift to resolve any potential issues early in the process. The 1228-day median pendency remains the primary benchmark for expected prosecution length. Overall, the data indicates that this examiner is both productive and receptive to patent applications.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

76.7%
Allow Rate
+8.7% vs TC avg
143
Total Applications
+11.9%
Interview Lift
1228
Avg Prosecution Days
Based on 116 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
21.5%
§102 Novelty
57.8%
§103 Obviousness
17.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18413399 EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18392365 POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN BY USING THE RESIST COMPOSITION Non-Final OA Samsung Electronics Co., Ltd.
18251922 PHOTORESIST REMOVER COMPOSITIONS Non-Final OA Merck Patent GmbH
18452721 MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE Non-Final OA FUJIFILM Corporation
18177742 CHEMICAL LIQUID SUPPLY METHOD AND PATTERN FORMING METHOD Non-Final OA FUJIFILM Corporation
17952941 PATTERN FORMATION METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Final Rejection FUJIFILM Corporation
17867327 COLORING RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE Final Rejection FUJIFILM Corporation
18131279 GAS-PHASE METHOD OF FORMING RADIATION-SENSITIVE PATTERNABLE MATERIAL Non-Final OA ASM IP Holding, B.V.
18578627 METHOD OF FORMING PATTERNS Non-Final OA SAMSUNG SDI CO., LTD.
18565488 COMPOSITION FOR REMOVING EDGE BEAD FROM METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEAD USING SAME Final Rejection SAMSUNG SDI CO., LTD.
17512959 CONDUCTIVE PATTERNING USING A PERMANENT RESIST Non-Final OA TEXAS INSTRUMENTS INCORPORATED
17758567 POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PERFORMANCE OF METAL-CONTAINING EUV RESIST Final Rejection Lam Research Corporation
18447568 PHOTORESIST MATERIALS AND ASSOCIATED METHODS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18231540 PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
17486223 UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
17340838 PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
17302880 PHOTORESIST MATERIALS AND ASSOCIATED METHODS Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
17875322 NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
18314481 IMPLANT INTO EUV METAL OXIDE PHOTORESIST MODULE TO REDUCE EUV DOSE Final Rejection Applied Materials, Inc.
18511327 LAYER STACK FOR EXTREME ULTRAVIOLET LITHOGRAPHY Non-Final OA Tokyo Electron Limited
18193324 Dry Developing Metal-Free Photoresists Final Rejection Tokyo Electron Limited
18339350 METHOD OF MANUFACTURING MASK, MASK AND METHOD OF MANUFACTURING MASK APPARATUS Non-Final OA DAI NIPPON PRINTING CO., LTD.
18561499 MASK BLANK, REFLECTIVE MASK, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES Non-Final OA HOYA CORPORATION
18560659 MASK BLANK AND PHASE SHIFT MASK Non-Final OA HOYA CORPORATION
18293927 SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE Non-Final OA Shin-Etsu Chemical Co., Ltd.
18542142 Reflective Mask Blank, Reflective Mask, and Manufacturing Method Thereof Non-Final OA Shin-Etsu Chemical Co., Ltd.
18207250 ONIUM SALT, RESIST COMPOSITION AND PATTERN FORMING PROCESS Final Rejection Shin-Etsu Chemical Co., Ltd.
18180936 RESIST MATERIAL AND PATTERN FORMING METHOD Non-Final OA SHIN-ETSU CHEMICAL CO., LTD.
18351511 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND MICROLENS ARRAY Non-Final OA Advanced Echem Materials Company Limited

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