Prosecution Insights
Last updated: April 19, 2026

Examiner: LEE, ALEXANDER N

Tech Center 1700 • Art Units: 1737

This examiner grants 74% of resolved cases

Performance Statistics

73.5%
Allow Rate
+8.5% vs TC avg
132
Total Applications
+5.8%
Interview Lift
1208
Avg Prosecution Days
Based on 98 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
24.3%
§102 Novelty
55.1%
§103 Obviousness
14.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18127118 RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18184697 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE Non-Final OA FUJIFILM Corporation
17952941 PATTERN FORMATION METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Final Rejection FUJIFILM Corporation
17320398 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Non-Final OA FUJIFILM Corporation
18314481 IMPLANT INTO EUV METAL OXIDE PHOTORESIST MODULE TO REDUCE EUV DOSE Non-Final OA Applied Materials, Inc.
18776675 UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18447568 PHOTORESIST MATERIALS AND ASSOCIATED METHODS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18232774 UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18232264 PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
17486223 UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
17340838 PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
17302880 PHOTORESIST MATERIALS AND ASSOCIATED METHODS Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18193324 Dry Developing Metal-Free Photoresists Non-Final OA Tokyo Electron Limited
18207250 ONIUM SALT, RESIST COMPOSITION AND PATTERN FORMING PROCESS Non-Final OA Shin-Etsu Chemical Co., Ltd.
18309793 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component Non-Final OA SHIN-ETSU CHEMICAL CO., LTD.
18310925 CROSS-LINKABLE PHOTORESIST FOR EXTREME ULTRAVIOLET LITHOGRAPHY Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18131279 GAS-PHASE METHOD OF FORMING RADIATION-SENSITIVE PATTERNABLE MATERIAL Non-Final OA ASM IP Holding, B.V.
17900578 METHOD OF FORMING A PHOTORESIST ABSORBER LAYER AND STRUCTURE INCLUDING SAME Non-Final OA ASM IP Holding B.V.
18026396 RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINAL-BLOCKED REACTION PRODUCT Final Rejection NISSAN CHEMICAL CORPORATION
17795061 RESIST UNDERLAYER FILM-FORMING COMPOSITION Final Rejection NISSAN CHEMICAL CORPORATION
17790324 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION Non-Final OA NISSAN CHEMICAL CORPORATION
17763253 RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING HETEROCYCLIC COMPOUND Non-Final OA NISSAN CHEMICAL CORPORATION
18040167 PROCESS SOLUTION COMPOSITION FOR EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY AND PATTERN FORMING METHOD USING SAME Non-Final OA YOUNG CHANG CHEMICAL CO., LTD

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