Tech Center 2800 • Art Units: 1716 1737 2812 2891
This examiner grants 77% of resolved cases
Alexander N. Lee is an examiner in Art Unit 1716, within Tech Center 2800. He has 116 resolved cases, providing a clear view of his examination tendencies. The allowance rate for this examiner is 76.7 percent, which is a favorable and encouraging figure for patent applicants. The interview lift is 11.9 percent, suggesting that direct communication can provide a meaningful boost to the probability of allowance. This 11.9 percent lift is a useful strategic tool for practitioners to consider during prosecution.
The median time to allowance is 1228 days, which is over three years and indicates a relatively long prosecution cycle. This 1228-day timeline, paired with the 76.7 percent allowance rate, offers a predictable path for patent applicants. The 11.9 percent interview lift indicates that the examiner is receptive to oral advocacy and that such interactions often lead to positive outcomes. With 116 resolved cases, the data shows a consistent preference for collaborative prosecution. Practitioners should use the lift to resolve any potential issues early in the process. The 1228-day median pendency remains the primary benchmark for expected prosecution length. Overall, the data indicates that this examiner is both productive and receptive to patent applications.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18413399 | EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18392365 | POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN BY USING THE RESIST COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18251922 | PHOTORESIST REMOVER COMPOSITIONS | Non-Final OA | Merck Patent GmbH |
| 18452721 | MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Non-Final OA | FUJIFILM Corporation |
| 18177742 | CHEMICAL LIQUID SUPPLY METHOD AND PATTERN FORMING METHOD | Non-Final OA | FUJIFILM Corporation |
| 17952941 | PATTERN FORMATION METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 17867327 | COLORING RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 18131279 | GAS-PHASE METHOD OF FORMING RADIATION-SENSITIVE PATTERNABLE MATERIAL | Non-Final OA | ASM IP Holding, B.V. |
| 18578627 | METHOD OF FORMING PATTERNS | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18565488 | COMPOSITION FOR REMOVING EDGE BEAD FROM METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEAD USING SAME | Final Rejection | SAMSUNG SDI CO., LTD. |
| 17512959 | CONDUCTIVE PATTERNING USING A PERMANENT RESIST | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17758567 | POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PERFORMANCE OF METAL-CONTAINING EUV RESIST | Final Rejection | Lam Research Corporation |
| 18447568 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18231540 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
| 17486223 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17340838 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17302880 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17875322 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18314481 | IMPLANT INTO EUV METAL OXIDE PHOTORESIST MODULE TO REDUCE EUV DOSE | Final Rejection | Applied Materials, Inc. |
| 18511327 | LAYER STACK FOR EXTREME ULTRAVIOLET LITHOGRAPHY | Non-Final OA | Tokyo Electron Limited |
| 18193324 | Dry Developing Metal-Free Photoresists | Final Rejection | Tokyo Electron Limited |
| 18339350 | METHOD OF MANUFACTURING MASK, MASK AND METHOD OF MANUFACTURING MASK APPARATUS | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18561499 | MASK BLANK, REFLECTIVE MASK, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES | Non-Final OA | HOYA CORPORATION |
| 18560659 | MASK BLANK AND PHASE SHIFT MASK | Non-Final OA | HOYA CORPORATION |
| 18293927 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18542142 | Reflective Mask Blank, Reflective Mask, and Manufacturing Method Thereof | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18207250 | ONIUM SALT, RESIST COMPOSITION AND PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18180936 | RESIST MATERIAL AND PATTERN FORMING METHOD | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18351511 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND MICROLENS ARRAY | Non-Final OA | Advanced Echem Materials Company Limited |
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