Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1716 1737 2812 2891
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18284994 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | Non-Final OA | NISSAN CHEMICAL CORPORATION |
| 17795061 | RESIST UNDERLAYER FILM-FORMING COMPOSITION | Non-Final OA | NISSAN CHEMICAL CORPORATION |
| 17916431 | FILM-FORMING COMPOSITION | Final Rejection | NISSAN CHEMICAL CORPORATION |
| 18392365 | POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN BY USING THE RESIST COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18487788 | Panel Substrate and Method for Manufacturing Micro-LED Display Device Including the Same | Non-Final OA | LG Display Co., Ltd. |
| 18452721 | MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Non-Final OA | FUJIFILM Corporation |
| 18177742 | CHEMICAL LIQUID SUPPLY METHOD AND PATTERN FORMING METHOD | Non-Final OA | FUJIFILM Corporation |
| 17952941 | PATTERN FORMATION METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 17867327 | COLORING RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 18578627 | METHOD OF FORMING PATTERNS | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18565488 | COMPOSITION FOR REMOVING EDGE BEAD FROM METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEAD USING SAME | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18293927 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18541922 | REFLECTIVE MASK BLANK | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18309793 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18180936 | RESIST MATERIAL AND PATTERN FORMING METHOD | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 17512959 | CONDUCTIVE PATTERNING USING A PERMANENT RESIST | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18481124 | LITHOGRAPHY PROCESS | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18231201 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17486223 | UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17340838 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17246496 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17875322 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18193324 | Dry Developing Metal-Free Photoresists | Final Rejection | Tokyo Electron Limited |
| 18339350 | METHOD OF MANUFACTURING MASK, MASK AND METHOD OF MANUFACTURING MASK APPARATUS | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18251922 | PHOTORESIST REMOVER COMPOSITIONS | Non-Final OA | Merck Patent GmbH |
| 18561499 | MASK BLANK, REFLECTIVE MASK, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES | Non-Final OA | HOYA CORPORATION |
| 18560659 | MASK BLANK AND PHASE SHIFT MASK | Non-Final OA | HOYA CORPORATION |
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