Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2823 2828 2897 4100
This examiner grants 87% of resolved cases
Sheikh Maruf, working in Art Unit 2823, has resolved 567 cases with an allowance rate of 86.8%. This high rate is paired with a median days to allowance of 822. The volume of 567 cases provides a statistically significant look at his practices in Tech Center 4100. The 822-day median pendency is a key metric for applicants seeking patents in this art unit. This 86.8% allowance rate suggests a very favorable environment for patent grants.
The interview lift is 9.2%, showing that verbal communication often aids in reaching an allowance. Given the 86.8% baseline, the lift further improves already favorable odds. Practitioners should consider the 822-day timeline when setting expectations for their clients. The 9.2% lift indicates that the examiner is responsive to direct engagement. With 567 resolved cases, these metrics are well-supported by historical data.
In Art Unit 2823, the 86.8% rate is a strong indicator of success. The 9.2% interview lift provides a tactical option for resolving outstanding issues. Tech Center 4100 applicants can expect a relatively efficient 822-day path to allowance. This profile suggests that Sheikh Maruf is an examiner who consistently reaches resolutions in a timely manner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18168699 | SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC MATERIAL AND ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18151021 | SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18293194 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18742136 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18629250 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18627247 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18357144 | RECONFIGURABLE AMBIPOLAR TRANSISTOR | Non-Final OA | UIF (University Industry Foundation), Yonsei University |
| 18607094 | BURIED BUMP STRUCTURE | Non-Final OA | QUALCOMM Incorporated |
| 18607034 | PACKAGE COMPRISING SUBSTRATES, INTEGRATED DEVICES AND A HEAT SINK | Non-Final OA | QUALCOMM Incorporated |
| 18342112 | Integrated Waveguides for Semiconductor Technology | Non-Final OA | Intel Corporation |
| 17710584 | VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS | Final Rejection | Intel Corporation |
| 18378513 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18069411 | ELECTRONIC COMPONENT WITH AT LEAST ONE LAYER OF A FERROELECTRIC OR ANTIFERROELECTRIC MATERIAL | Final Rejection | Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V. |
| 18298402 | METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17954979 | TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL | Final Rejection | International Business Machines Corporation |
| 18707925 | LIGHT-EMITTING DEVICE | Non-Final OA | SHARP DISPLAY TECHNOLOGY CORPORATION |
| 18433787 | ETCHING METHOD AND MANUFACTURING METHOD OF A SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18326389 | FIELD-PLATED RESISTOR | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18416783 | FERROELECTRIC TUNNEL JUNCTION DEVICES WITH METAL-FE INTERFACE LAYER AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18142600 | JUNCTION STRUCTURE ELEMENT AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
| 18039919 | COMPOUND SEMICONDUCTOR DEVICES WITH A CONDUCTIVE COMPONENT TO CONTROL ELECTRICAL CHARACTERISTICS | Final Rejection | Analog Devices, Inc. |
| 18631140 | ADAPTABLE MEMORY SYSTEM WITH MULTIPLE CHIPLETS | Non-Final OA | Sandisk Technologies, Inc. |
| 18493947 | MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER | Non-Final OA | GM Global Technology Operations LLC |
| 18281445 | SEMICONDUCTOR APPARATUS AND FORMING METHOD FOR FERROELECTRIC THIN FILM | Final Rejection | TOKYO INSTITUTE OF TECHNOLOGY |
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