Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2823 2828 2897 4100
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18151021 | SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18293194 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18378541 | THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18493930 | LIGHT-EMITTING DEVICE, ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE, AND ELECTRONIC DEVICE INCLUDING THE LIGHT-EMITTING DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18607094 | BURIED BUMP STRUCTURE | Non-Final OA | QUALCOMM Incorporated |
| 18607034 | PACKAGE COMPRISING SUBSTRATES, INTEGRATED DEVICES AND A HEAT SINK | Non-Final OA | QUALCOMM Incorporated |
| 18137360 | REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE | Non-Final OA | Intel Corporation |
| 17710584 | VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS | Final Rejection | Intel Corporation |
| 18358966 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18357264 | IN-SITU THERMAL ANNEALING OF ELECTRODE TO FORM SEED LAYER FOR IMPROVING FERAM PERFORMANCE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18416783 | FERROELECTRIC TUNNEL JUNCTION DEVICES WITH METAL-FE INTERFACE LAYER AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18142600 | JUNCTION STRUCTURE ELEMENT AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
| 18355417 | METHOD FOR SYNTHESIZING NOBLE METAL-SEMICONDUCTOR HETEROSTRUCTURES AND PHOTOCATALYTIC SYSTEM FOR SIMULTANEOUSLY PHOTOCATALYTIC CONVERSION OF CARBON DIOXIDE AND MICROPLASTIC INTO CARBON MONOXIDE | Non-Final OA | City University of Hong Kong |
| 18433787 | ETCHING METHOD AND MANUFACTURING METHOD OF A SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18352667 | Power Semiconductor Device and Method of Producing a Power Semiconductor Device | Non-Final OA | Infineon Technologies AG |
| 18039919 | COMPOUND SEMICONDUCTOR DEVICES WITH A CONDUCTIVE COMPONENT TO CONTROL ELECTRICAL CHARACTERISTICS | Final Rejection | Analog Devices, Inc. |
| 17954979 | TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL | Final Rejection | International Business Machines Corporation |
| 18357144 | RECONFIGURABLE AMBIPOLAR TRANSISTOR | Non-Final OA | UIF (University Industry Foundation), Yonsei University |
| 18493947 | MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER | Non-Final OA | GM Global Technology Operations LLC |
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