Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2858
This examiner grants 91% of resolved cases
Niki Hoang Nguyen is an examiner in Art Unit 2818 of Tech Center 2800. The examiner has 946 resolved cases, with an allowance rate of 90.9%. This percentage reflects the frequency of patent grants. The 946 cases provide a significant data set for these observations.
The median days to allowance is 767. This number represents the timeline for applications that have been granted. Practitioners can use the 767-day figure to estimate the duration of the prosecution process. This median is derived from the examiner's history of 946 resolved cases.
An interview lift of 5.1% is reported for this profile. This lift shows the improvement in the probability of allowance when an interview is conducted relative to the 90.9% baseline. Engaging in an interview may help navigate the 767-day timeline more effectively. These statistics define the examination environment in Art Unit 2818.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18752024 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18757429 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SEIKO EPSON CORPORATION |
| 18050307 | DIFFUSION BARRIERS AND METHOD OF FORMING SAME | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18679729 | MAGNETIC FIELD SENSOR WITH BIAS RESISTOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18780501 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18774903 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770372 | Gate Isolation for Multigate Device | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18768995 | STRUCTURE AND METHOD FOR MRAM DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770392 | PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18768080 | Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18654367 | HIGH PERFORMANCE AND LOW POWER THREE-DIMENSIONAL STATIC RANDOM ACCESS MEMORY AND METHOD OF FORMING SAME | Non-Final OA | Katholieke Universiteit Leuven |
| 18740524 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18669604 | DISPLAY DEVICE | Non-Final OA | AUO Corporation |
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