Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817 2821 2826 2829 2892 2893
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18397713 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18462614 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17870200 | SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18551254 | SENSOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18085258 | BRIDGE HUB TILING ARCHITECTURE | Non-Final OA | Intel Corporation |
| 18512450 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18516351 | MICRO LED ALIGNMENT METHOD USING ELECTROSTATIC REPULSION, AND MICRO LED DISPLAY MANUFACTURING METHOD USING SAME | Non-Final OA | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS |
| 18499083 | SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND MULTI-STEP FIELD PLATE AND METHOD OF FABRICATION THEREFOR | Non-Final OA | NXP USA, Inc. |
| 18563120 | LEAD BONDING STRUCTURE COMPRISING EMBEDDED MANIFOLD TYPE MICRO-CHANNEL AND PREPARATION METHOD FOR LEAD BONDING STRUCTURE | Non-Final OA | Peking University |
| 18558691 | OPTOELECTRONIC LIGHTING DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18562429 | STRESS-CONFIGURABLE NANOELECTRONIC COMPONENT STRUCTURE, INTERMEDIATE PRODUCT, AND METHOD FOR PRODUCING A NANOELECTRONIC COMPONENT STRUCTURE | Non-Final OA | TECHNISCHE UNIVERSITÄT CHEMNITZ |
| 18551263 | EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE | Non-Final OA | DYNAX SEMICONDUCTOR, INC. |
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