Tech Center 2800 • Art Units: 2817 2821 2826 2829 2892 2893
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18462614 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17870200 | SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17539552 | SOLID-STATE IMAGE SENSOR AND ELECTRONIC APPARATUS | Final Rejection | SONY GROUP CORPORATION |
| 18454609 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18551254 | SENSOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18512450 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17445157 | APPARATUSES INCLUDING MEMORY CELLS AND RELATED METHODS | Final Rejection | Micron Technology, Inc. |
| 17734960 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18193634 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18563120 | LEAD BONDING STRUCTURE COMPRISING EMBEDDED MANIFOLD TYPE MICRO-CHANNEL AND PREPARATION METHOD FOR LEAD BONDING STRUCTURE | Non-Final OA | Peking University |
| 18499083 | SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND MULTI-STEP FIELD PLATE AND METHOD OF FABRICATION THEREFOR | Non-Final OA | NXP USA, Inc. |
| 18446514 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18551263 | EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE | Non-Final OA | DYNAX SEMICONDUCTOR, INC. |
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