Tech Center 2800 • Art Units: 2893
This examiner grants 62% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18635282 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18509736 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18378170 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18062713 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18176931 | Methods of Forming Bent Display Panels | Non-Final OA | Apple Inc. |
| 17790577 | ARRAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18352826 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY AND MEMORY SYSTEM | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 17523705 | METHOD OF TUNING SENSORS FOR IMPROVED DYNAMIC RANGE AND SENSOR ARRAY | Non-Final OA | Government of the United States, as represented by the Secretary of the Air Force |
| 18073739 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18185232 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18786524 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18154986 | Magnetic Memory Device Based on Perpendicular Exchange Bias and Method of Manufacturing Magnetic Memory Device | Non-Final OA | Korea Advanced Institute of Science and Technology |
| 17746889 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
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