Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18195970 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18179588 | SEED LAYER FOR ENHANCING TUNNEL MAGNETORESISTANCE WITH PERPENDICULARLY MAGNETIZED HEUSLER FILMS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17790577 | ARRAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18193908 | OPTICAL SENSOR AND METHOD FOR FABRICATING AN OPTICAL SENSOR | Non-Final OA | Infineon Technologies AG |
| 18176931 | Methods of Forming Bent Display Panels | Non-Final OA | Apple Inc. |
| 18306210 | ELECTRO-OPTICAL DEVICE AND IMAGE DISPLAY DEVICE | Final Rejection | SEIKO EPSON CORPORATION |
| 17993888 | ARRAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | HKC CORPORATION LIMITED |
| 17398696 | DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 17901773 | MAGNETIC MEMORY DEVICE | Final Rejection | KIOXIA CORPORATION |
| 18185232 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17881621 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17959771 | SILICON NANO SHEET THREE-DIMENSIONAL HORIZONTAL MEMORY WITH ALL-AROUND METAL STORAGE CAPACITOR | Non-Final OA | Tokyo Electron Limited |
| 18352826 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY AND MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18058426 | STRESS REDUCTION LAYER BASED ON COATING TECHNIQUE | Final Rejection | Melexis Technologies SA |
| 18085850 | DISPLAY PANEL AND DISPLAY DEVICE | Final Rejection | Wuhan Tianma Micro-Electronics Co., Ltd. |
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