Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2898 4100
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18667796 | SEMICONDUCTOR PACKAGE FOR INCREASING BONDING RELIABILITY | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18609430 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18601865 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18591057 | SEMICONDUCTOR DEVICE AND APPARATUS | Non-Final OA | Canon Kabushiki Kaisha |
| 18610898 | ADJACENT LOGIC CELLS HAVING BACK-TO-BACK VIAS | Non-Final OA | QUALCOMM Incorporated |
| 18611778 | CAPACITOR FORMED IN INTERCONNECT LAYER | Non-Final OA | NXP USA, INC. |
| 18591272 | SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18616634 | USING LASER BASED SYSTEM FOR MEAN OF SHAPING OF UNSINGULATED & SINGULATED DIES BY SUBSTRATE LATTICE MANIPULATION | Non-Final OA | Tokyo Electron Limited |
| 18614045 | DOPING BY MOLECULAR LAYER DEPOSITION | Non-Final OA | National University of Singapore |
| 18613139 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | Non-Final OA | Winbond Electronics Corp. |
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