Technology area: Chemistry & Materials
14 pending office actions • 8 art units • 14 examiners • 0 of 14 (0%) have an AI response strategy ready • 12 patents granted in the last 365 days
Spts Technologies Limited has 15 pending office actions in Chemistry & Materials. The matters involve 15 distinct examiners and 9 distinct art units. The examiner assignments are fully dispersed, while the art-unit figure shows that several units handle more than one matter. This combination calls for centralized docket control and deliberate monitoring of recurring unit-level approaches.
AHMED, SHAMIM is the busiest examiner, with 1 pending matter. No examiner has a material concentration of the listed workload. Counsel should standardize portfolio-level technical positions where appropriate, while preparing matter-specific responses for the separate examiner assignments.
Based on the USPTO statutory response window for each pending office action. 4 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 4 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 6 (43%) |
| §112 only | 1 (7%) |
| Double-patenting + other | 1 (7%) |
| Multi-statute (no §101) | 6 (43%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| AHMED, SHAMIM | 1 | 78.5% | +22.1% |
| WALTERS JR, ROBERT S | 1 | 51.6% | +50.4% |
| ADAMS, NATHANIEL L | 1 | 72.2% | +19.6% |
| TIGHE, BRENDAN P | 1 | 76.2% | +19.4% |
| PHAM, THOMAS T | 1 | 51.5% | +15.8% |
| TRAN, BINH X | 1 | 81.7% | +11.9% |
| BENNETT, CHARLEE | 1 | 58.8% | +35.1% |
| ALANKO, ANITA KAREN | 1 | 69.9% | -16.1% |
| KACKAR, RAM N | 1 | 40.6% | +57.8% |
| BAND, MICHAEL A | 1 | 45.1% | +55.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18607490 | Plasma Etched Compound Semiconductor | TRAN, BINH X | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18213865 | Control of Trench Profile Angle in SiC Semiconductors | DUCLAIR, STEPHANIE P. | 98d overdue |
| 17976798 | PVD Method and Apparatus | BRAYTON, JOHN JOSEPH | 38d overdue |
| 18375238 | Method and Apparatus for Plasma Etching Dielectric Substrates | KACKAR, RAM N | 30d overdue |
| 18989885 | END EFFECTOR FOR CARRYING A WAFER OR A WAFER ASSEMBLY | ADAMS, NATHANIEL L | — |
| 18752505 | METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS | PHAM, THOMAS T | — |
| 18396397 | SUPPORT | BENNETT, CHARLEE | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18375238 | Method and Apparatus for Plasma Etching Dielectric Substrates | KACKAR, RAM N | 30d overdue |
| 19237240 | METHOD OF PLASMA ETCHING | AHMED, SHAMIM | — |
| 19233467 | A METHOD OF PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION | WALTERS JR, ROBERT S | — |
| 18989885 | END EFFECTOR FOR CARRYING A WAFER OR A WAFER ASSEMBLY | ADAMS, NATHANIEL L | — |
| 18752918 | APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE | TIGHE, BRENDAN P | — |
| 18752505 | METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS | PHAM, THOMAS T | — |
| 18607490 | Plasma Etched Compound Semiconductor | TRAN, BINH X | — |
| 18396397 | SUPPORT | BENNETT, CHARLEE | — |
| Art Unit | Apps |
|---|---|
| 1713 | 5 |
| 1794 | 3 |
| 1715 | 1 |
| 3654 | 1 |
| 3652 | 1 |
| 1718 | 1 |
| 1716 | 1 |
| 2897 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19237240 | METHOD OF PLASMA ETCHING | AHMED, SHAMIM | 1713 | §103 | Non-Final OA | — | Pending | Jun 13, 2025 |
| 19233467 | A METHOD OF PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION | WALTERS JR, ROBERT S | 1715 | §103 | Non-Final OA | — | Pending | Jun 10, 2025 |
| 18989885 | END EFFECTOR FOR CARRYING A WAFER OR A WAFER ASSEMBLY | ADAMS, NATHANIEL L | 3654 | §102§103§112 | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18752918 | APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE | TIGHE, BRENDAN P | 3652 | §103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18752505 | METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS | PHAM, THOMAS T | 1713 | §102§103§112 | Non-Final OA | — | Pending | Jun 24, 2024 |
| 18607490 | Plasma Etched Compound Semiconductor | TRAN, BINH X | 1713 | §103 | Final Rejection | — | Pending | Mar 17, 2024 |
| 18396397 | SUPPORT | BENNETT, CHARLEE | 1718 | §103§112 | Final Rejection | — | Pending | Dec 26, 2023 |
| 18393632 | Plasma Etching Method and Apparatus | ALANKO, ANITA KAREN | 1713 | §112 | Non-Final OA | — | Pending | Dec 21, 2023 |
| 18375238 | Method and Apparatus for Plasma Etching Dielectric Substrates | KACKAR, RAM N | 1716 | §102§103 | Final Rejection | 30d overdue | Pending | Sep 29, 2023 |
| 18372126 | Apparatus and a Method of Controlling Thickness Variation in a Material Layer Formed Using Physical Vapour Deposition | BAND, MICHAEL A | 1794 | §103§112DP | Non-Final OA | — | Pending | Sep 24, 2023 |
| 18213865 | Control of Trench Profile Angle in SiC Semiconductors | DUCLAIR, STEPHANIE P. | 1713 | §102§103 | Final Rejection | 98d overdue | Pending | Jun 25, 2023 |
| 17976798 | PVD Method and Apparatus | BRAYTON, JOHN JOSEPH | 1794 | §102§103 | Final Rejection | 38d overdue | Pending | Oct 29, 2022 |
| 17461928 | Deposition Method | OTT, PATRICK S | 1794 | §103 | Final Rejection | 31d overdue | Pending | Aug 30, 2021 |
| 17098404 | Method, Substrate and Apparatus | SHAMSUZZAMAN, MOHAMMED | 2897 | §103Other | Final Rejection | — | Pending | Nov 15, 2020 |
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Start Free TrialSpts Technologies Limited has 14 pending office actions as of October 2026, spread across 8 art units and 14 examiners.
Shamim Ahmed has the most, with 1 of Spts Technologies Limited's pending office actions.
Mostly Chemistry & Materials (USPTO Tech Center 1700), based on where its pending office actions are examined.
