Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2818 3726 4100
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18727604 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18655714 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18634322 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18609065 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18409400 | WIPER FOR TRANSFERRING MICRO SEMICONDUCTOR CHIP AND APPARATUS FOR COLLECTING MICRO SEMICONDUCTOR CHIP | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18558091 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18529792 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18596635 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 18217123 | SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER | Non-Final OA | Intel Corporation |
| 18501172 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18455654 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18459171 | INTEGRATED CIRCUIT PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18455732 | SEMICONDUCTOR STORAGE DEVICE | Final Rejection | Kioxia Corporation |
| 18588791 | CENTER-CONNECTION BONDED MEMORY ASSEMBLY AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18454362 | SEMICONDUCTOR DEVICE WITH TRENCH STRUCTURES AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Monolithic Power Systems, Inc. |
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