Tech Center 2800 • Art Units: 2891
This examiner grants 78% of resolved cases
Eric A Ward is an examiner in Art Unit 2891 within Tech Center 2800. The examiner has a volume of 753 resolved cases, providing a statistical profile. The allowance rate is 78.1%, which indicates the frequency of successful applications. The median days to allowance is 912, suggesting the prosecution timeline. Practitioners in Art Unit 2891 can expect a predictable process based on the 753 resolved cases.
The interview lift for this examiner is 13.2%. This lift shows that interviews provide a benefit, even with a baseline allowance rate of 78.1%. The 912-day median pendency and 13.2% lift suggest that direct communication is a way to resolve outstanding issues. For applications in Tech Center 2800, these metrics provide a roadmap for prosecution. The 753 resolved cases support the 78.1% allowance rate as a stable benchmark. Practitioners should consider the 13.2% lift as a tool during the 912-day prosecution period to ensure a grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18742642 | DISPLAY DEVICE INCLUDING QUANTUM-DOT LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18432328 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18502862 | STACK OF MONOCRYSTALLINE LAYERS FOR PRODUCING MICROELECTRONIC DEVICES WITH 3D ARCHITECTURE | Non-Final OA | COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES |
| 18698928 | DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING DISPLAY DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18703809 | IMAGING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18518846 | ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE AS LATERAL EDGE PORTION OF SEMICONDUCTOR BODY | Non-Final OA | Infineon Technologies AG |
| 18414684 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Wuhan Tianma Micro-Electronics Co., Ltd. |
| 18582407 | INTERCONNECT SINGULATION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18497424 | DIELECTRIC LAYER PROTRUSIONS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18066511 | HYBRID SEMICONDUCTOR DEVICE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17806959 | GAN DEVICE WITH EXTENDED DRAIN CONTACT | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18779305 | DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18415529 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18414245 | SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18502792 | INTERCONNECTION STRUCTURE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18289038 | ARRAY SUBSTRATE AND DISPLAY PANEL | Final Rejection | Wuhan China Star Optoelectronics Technology Co., Ltd. |
| 18428119 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18582566 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND LEAD FRAME | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18672430 | INTEGRATED CIRCUIT PACKAGE WITH SPLIT DIE ATTACH PADDLE | Non-Final OA | Allegro MicroSystems, LLC |
| 18603347 | ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRUCTURE THEREOF | Non-Final OA | Zhuhai ACCESS Semiconductor Co., Ltd |
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