Prosecution Insights
Last updated: August 18, 2026

Examiner: WARD, ERIC A

Tech Center 2800 • Art Units: 2891

This examiner grants 78% of resolved cases

Performance Statistics

77.9%
Allow Rate
+9.9% vs TC avg
769
Total Applications
+13.4%
Interview Lift
909
Avg Prosecution Days
Based on 745 resolved cases, 2023–2026

Rejection Statute Breakdown

0.7%
§101 Eligibility
21.1%
§102 Novelty
58.2%
§103 Obviousness
15.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18613338 INTEGRATED CIRCUIT DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18582798 WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18489189 SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND METHOD OF FABRICATING THE SAME Final Rejection Samsung Electronics Co., Ltd.
18703809 IMAGING ELEMENT AND ELECTRONIC DEVICE Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18698344 DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE Non-Final OA Sharp Display Technology Corporation
18658126 COVER GLASS AND DISPLAY DEVICE Non-Final OA Japan Display Inc.
18698928 DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING DISPLAY DEVICE Non-Final OA Semiconductor Energy Laboratory Co., Ltd.
18451819 SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE Final Rejection Mitsubishi Electric Corporation
18582407 INTERCONNECT SINGULATION Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18497424 DIELECTRIC LAYER PROTRUSIONS Non-Final OA TEXAS INSTRUMENTS INCORPORATED
17806959 GAN DEVICE WITH EXTENDED DRAIN CONTACT Final Rejection TEXAS INSTRUMENTS INCORPORATED
18415529 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18502792 INTERCONNECTION STRUCTURE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18518846 ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE AS LATERAL EDGE PORTION OF SEMICONDUCTOR BODY Final Rejection Infineon Technologies AG
18360459 METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SUBSTRATE, AND SILICON CARBIDE SEMICONDUCTOR DEVICE Non-Final OA Infineon Technologies AG
17931770 SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE Non-Final OA SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
18522901 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR Non-Final OA ENKRIS SEMICONDUCTOR, INC.

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