Tech Center 2800 • Art Units: 2891
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18497446 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18489189 | SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17806959 | GAN DEVICE WITH EXTENDED DRAIN CONTACT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18451819 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18518846 | ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE AS LATERAL EDGE PORTION OF SEMICONDUCTOR BODY | Non-Final OA | Infineon Technologies AG |
| 18117711 | SEMICONDUCTOR DEVICE HAVING MACRO CELLS | Final Rejection | Infineon Technologies AG |
| 18214044 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18483864 | MULTI-TAPERED MRAM DEVICE STRUCTURE | Non-Final OA | International Business Machines Corporation |
| 17921993 | SiC SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18455136 | ELECTRONIC COMPONENT, METHOD FOR THE CONTROL THEREOF, AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT | Non-Final OA | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
| 17931770 | SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 17951711 | Barrier Structure for Sub-100 Nanometer Gate Length Devices | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
| 18129095 | METHOD FOR FABRICATING HIGH ELECTRON MOBILITY TRANSISTOR | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18483720 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Sk keyfoundry Inc. |
| 18226764 | HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATION METHOD THEREOF | Non-Final OA | Vanguard International Semiconductor Corporation |
| 18552625 | THREE-DIMENSIONAL FLASH MEMORY HAVING IMPROVED STACK CONNECTION PART AND METHOD FOR MANUFACTURING SAME | Non-Final OA | IUCF-HYU (Industry University Cooperation Foundation Hanyang University) |
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